Patents by Inventor Gerard McVicker

Gerard McVicker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7559132
    Abstract: Embodiments of the present invention pertain to method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, a flexure is formed that is capable of being coupled to an assembly joint. An assembly joint is formed so that the assembly joint is capable of being coupled to the flexure and the chassis of a computer system. A shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: July 14, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Sri M. Sri-Jayantha, Vijayeshwar D. Khanna, Gerard McVicker
  • Publication number: 20090169886
    Abstract: Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 2, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gareth G. Hougham, Vijayeshwar D. Khanna, Xiao Hu Liu, Gerard McVicker
  • Patent number: 7477517
    Abstract: Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending from the spreader plate. A membrane connects the heat spreader and the housing, sealing an interface between the heat spreader and the housing. A top plate, including a plurality of top plate fins, is disposed in the housing. A pump is located between the top plate fins and the spreader fins and urges fluid across the spreader fins and conducts heat from the spreader fins. The top plate fins conduct heat from the fluid and into a heat sink in thermal contact with the top plate. A heat sink plate conducts heat into heat sink fins where the heat is dissipated.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: January 13, 2009
    Assignee: International Business Machines Corporation
    Inventors: Vijayeshwar D. Khanna, Alok K. Lohia, Gerard McVicker, Sri M. Sri-Jayantha
  • Publication number: 20080282114
    Abstract: A system for reducing an impact of hot spot, pulsing of a semiconductor device including: first generating means for generating a plurality of local op-codes; a sequencer for augmenting customer op-codes with the plurality of local op-codes; selecting means for selecting one or more of the randomly arriving customer op-codes awaiting execution; monitoring means for tracking which of the one or more randomly arriving customer op-codes have been selected; separating means for separating the plurality of local op-codes from the one or more customer op-codes; storing means for storing one or more data related to the processing of the plurality of local op-codes and the customer op-codes; and second generating means for generating an output for a customer corresponding to that customer op-code while gainfully employing an output generated by local op-codes for system health monitoring purpose.
    Type: Application
    Filed: May 7, 2007
    Publication date: November 13, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John U. Knickerbocker, Gerard McVicker, Sri M. Sri-Jayantha
  • Publication number: 20080225488
    Abstract: Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.
    Type: Application
    Filed: March 16, 2007
    Publication date: September 18, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
  • Publication number: 20080180914
    Abstract: Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending from the spreader plate. A membrane connects the heat spreader and the housing, sealing an interface between the heat spreader and the housing. A top plate, including a plurality of top plate fins, is disposed in the housing. A pump is located between the top plate fins and the spreader fins and urges fluid across the spreader fins and conducts heat from the spreader fins. The top plate fins conduct heat from the fluid and into a heat sink in thermal contact with the top plate. A heat sink plate conducts heat into heat sink fins where the heat is dissipated.
    Type: Application
    Filed: January 29, 2007
    Publication date: July 31, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vijayeshwar D. Khanna, Alok K. Lohia, Gerard McVicker, Sri M. Sri-Jayantha
  • Publication number: 20080159853
    Abstract: A cooling system includes a moving rotor system which in turn includes: a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area; the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled.
    Type: Application
    Filed: January 3, 2007
    Publication date: July 3, 2008
    Applicant: International Business Machines Corporation
    Inventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
  • Publication number: 20080158819
    Abstract: A heat transfer device (and method therefore) for transferring heat from a heat source to a heat conductor, includes a fluid film operable as a compliant interface between the heat source and the heat conductor. The heat source includes a microelectronic device.
    Type: Application
    Filed: January 3, 2007
    Publication date: July 3, 2008
    Applicant: International Business Machines Corporation
    Inventors: Vijayeshwar Das Khanna, Gerard McVicker, Sri M. Sri-Jayantha
  • Publication number: 20080116571
    Abstract: A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom
    Type: Application
    Filed: November 22, 2006
    Publication date: May 22, 2008
    Applicant: International Business Machines Corporation, Inc.
    Inventors: Hien P. Dang, Vinod Kamath, Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha, Jung H. Yoon
  • Patent number: 7248467
    Abstract: Embodiments of the present invention pertain to an apparatus for a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, the disk drive shock absorber includes an assembly joint and a flexure. The flexure is capable of being coupled to the assembly joint. The assembly joint is capable of being coupled to the flexure and the computer system's chassis. The shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: July 24, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Sri M. Sri-Jayantha, Vijayeshwar D. Khanna, Gerard McVicker
  • Publication number: 20060098404
    Abstract: Embodiments of the present invention pertain to an apparatus for a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, the disk drive shock absorber includes an assembly joint and a flexure. The flexure is capable of being coupled to the assembly joint. The assembly joint is capable of being coupled to the flexure and the computer system's chassis. The shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.
    Type: Application
    Filed: November 5, 2004
    Publication date: May 11, 2006
    Inventors: Sri Sri-Jayantha, Vijayeshwar Khanna, Gerard McVicker
  • Publication number: 20060098399
    Abstract: Embodiments of the present invention pertain to method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, a flexure is formed that is capable of being coupled to an assembly joint. An assembly joint is formed so that the assembly joint is capable of being coupled to the flexure and the chassis of a computer system. A shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.
    Type: Application
    Filed: November 5, 2004
    Publication date: May 11, 2006
    Inventors: Sri Sri-Jayantha, Vijayeshwar Khanna, Gerard McVicker
  • Patent number: 6963463
    Abstract: A disk drive (HDD) subject to linear and rotational vibration, includes an independent sensing unit for sensing a rotational velocity component of the HDD rotational vibration in a predetermined frequency range.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: November 8, 2005
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Sri M. Sri-Jayantha, Hien Dang, Vijayeshwar Das Khanna, Gerard McVicker, Mitsuro Ohta
  • Patent number: 6937432
    Abstract: A system for mounting a hard disk enclosure (HDE), includes a casing pivotably mounted to minimize at least one of settle-out dynamics, external rotational vibration, and emitted vibration, the casing allowing the HDE to rotate substantially freely, wherein the center of gravity of the HDE is substantially the same as a pivot point of the casing. Further, a computer chassis includes a housing, at least one disk drive assembly for being housed by the housing, and a plurality of theta-mounts integrally built within the housing.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: August 30, 2005
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Sri M. Sri-Jayantha, Vijayeshwar Das Khanna, Gerard McVicker, Hien Dang, Arun Sharma, Kiyoshi Satoh, Tatsuo Nakamoto
  • Publication number: 20040070865
    Abstract: A system for mounting a hard disk enclosure (HDE), includes a casing pivotably mounted to minimize at least one of settle-out dynamics, external rotational vibration, and emitted vibration, the casing allowing the HDE to rotate substantially freely, wherein the center of gravity of the HDE is substantially the same as a pivot point of the casing. Further, a computer chassis includes a housing, at least one disk drive assembly for being housed by the housing, and a plurality of theta-mounts integrally built within the housing.
    Type: Application
    Filed: September 3, 2003
    Publication date: April 15, 2004
    Inventors: Sri M. Sri-Jayantha, Vijayeshwar Das Khanna, Gerard McVicker, Hien Dang, Arun Sharma, Kiyoshi Satoh, Tatsuo Nakamoto
  • Patent number: 6683745
    Abstract: A system for mounting a hard disk enclosure (HDE), includes a casing pivotably mounted to minimize at least one of settle-out dynamics, external rotational vibration, and emitted vibration, the casing allowing the HDE to rotate substantially freely, wherein the center of gravity of the HDE is substantially the same as a pivot point of the casing. Further, a computer chassis includes a housing, at least one disk drive assembly for being housed by the housing, and a plurality of theta-mounts integrally built within the housing.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: January 27, 2004
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Sri M. Sri-Jayantha, Vijayeshwar Das Khanna, Gerard McVicker, Hien Dang, Arun Sharma, Kiyoshi Satoh, Tatsuo Nakamoto
  • Publication number: 20030218819
    Abstract: A disk drive (HDD) subject to linear and rotational vibration, includes an independent sensing unit for sensing a rotational velocity component of the HDD rotational vibration in a predetermined frequency range.
    Type: Application
    Filed: May 24, 2002
    Publication date: November 27, 2003
    Applicant: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien Dang, Vijayeshwar Das Khanna, Gerard McVicker, Mutsuro Ohta
  • Patent number: 6504388
    Abstract: Disclosed is an improved probe housing mechanism that will allow for the quick release of a probe tip from a testing tool. The invention includes a probe housing, a double cantilevered beam for holding a probe tip, and a releasable spring mechanism for holding the beam into place. The spring mechanism can be released by squeezing the spring together or by releasing a non-removable locking screw, thereby allowing the beam to be slidably removed from the probe housing for easy replacement.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: January 7, 2003
    Assignee: International Business Machines Corporation
    Inventors: Ralph Richard Comulada, Jr., Michael Philip Goldowsky, John P. Karidis, Gerard McVicker, Yuet-Ying Yu
  • Patent number: 6360104
    Abstract: A wireless handset phone, virtual image display coupled to the wireless handset phone and pointing device for pointing on the virtual image display are included. The communicator may also include a limited-function computer. The virtual image display uses optics to create the virtual image. The pointing device may include a virtual selector; that is, an array of sensors or switches to accommodate different users's hands.
    Type: Grant
    Filed: September 3, 1999
    Date of Patent: March 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: Russell Alan Budd, John Peter Karidis, Gerard McVicker
  • Publication number: 20020014892
    Abstract: Disclosed is an improved probe housing mechanism that will allow for the quick release of a probe tip from a testing tool. The invention includes a probe housing, a double cantilevered beam for holding a probe tip, and a releasable spring mechanism for holding the beam into place. The spring mechanism can be released by squeezing the spring together or by releasing a non-removable locking screw, thereby allowing the beam to be slidably removed from the probe housing for easy replacement.
    Type: Application
    Filed: December 16, 1999
    Publication date: February 7, 2002
    Inventors: RALPH RICHARD COMULADA, MICHAEL PHILIP GOLDOWSKY, JOHN P. KARIDIS, GERARD MCVICKER, YUET-YING YU