Abstract: Disclosed is an apparatus and method for controlling step charging of a secondary battery. A charging control unit determines a SOC, an OCV and a polarization voltage of the secondary battery, determines an OCV deviation corresponding to a difference between the OCV and a predefined minimum OCV value, determines a correction factor corresponding to the polarization voltage and the OCV deviation, determines a look-up SOC by correcting the SOC according to the correction factor, determines the magnitude of a charging current corresponding to the look-up SOC, and provides the determined charging current to a charging device.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A continuous use authentication method includes: acquiring a normal state image and a current image for a user; determining an inferred classification state for the user from among a plurality of classification states by applying the normal state image and the current image to a low-depth inference model for the user; when the inferred classification state is included in an abnormality category, determining a high-depth inference model corresponding to the inferred classification state from among a plurality of high-depth inference models; and determining reliability of the inferred classification state by applying the current image to the high-depth inference model.

Abstract: A charging control apparatus measures a first temperature of a first secondary battery selected from the plurality of secondary batteries, a second temperature of a coolant flowing into the cooling device, a charging current of the secondary battery pack, a first terminal voltage of the first secondary battery and a second terminal voltage of a second secondary battery closest to the cooling device, estimates a temperature of a temperature estimation point of the second secondary battery from a lumped thermal model having a thermal resistance between two points selected from the temperature estimation point of the second secondary battery, the first temperature measurement point and the second temperature measurement point, and measurement data about temperature, current and voltage, and determines the estimated temperature as a minimum temperature of the secondary battery pack, and varies a charging power provided to the secondary battery pack according to the minimum temperature.

Abstract: The present disclosure relates to a memory system capable of encrypting and storing data, and a memory controller. The memory controller may include a first interface configured to perform data Communication with a first external device, a second interface configured to generate a signal for controlling an operation of a second extern& device and transmit the signal; and a processor configured to receive, from the first external device, a data write command to write data to the second external device, encrypt the data by using one of a plurality of keys stored in a key area provided in the first external device in response to the data write command, and then control the encrypted data to be written to the second external device.

Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.

Abstract: The present disclosure relates to a method for analysis on interim result data in a de-identification procedure, an apparatus for the same, a computer program for the same, and a recording medium storing computer program thereof. A method for de-identification according to an example of the present disclosure may include: generating a first interim result data by applying a first de-identification process to an initial data; generating a first analysis metric for the first interim result data; and generating a final result data based on the first interim result data, when the first analysis metric satisfies a first de-identification criterion.

Abstract: In a secure network where the network characteristics are not known, a call admission control algorithm and a preemption control algorithm based on a destination node informing the source node of the observed carried traffic are used to regulate the amount of traffic that needs to be preempted by the source. The amount of traffic that needs to be preempted is based on the carried traffic measured at the destination node. The traffic to be preempted is based on the priority of the traffic, where the lowest priority traffic is the first to be preempted until the amount of traffic preempted is sufficient to allow the remaining traffic to pass through the network without congestion.

Abstract: In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.

Abstract: A gripper includes a finger module coupled to one side of a palm module, the palm module including a first power unit including a first rotary shaft and configured to rotate the first rotary shaft, a screw member configured to rotate in conjunction with a rotation of the first rotary shaft, a nut member coupled to the screw member, a first member coupled to the nut member and movable in a vertical direction in conjunction with a vertical motion of the nut member, the first member having a groove extending in one direction and having a recessed shape, and a connection member having a first side coupled to the finger module and a second side inserted into the groove, wherein the connection member is movable away from or toward the screw member by restriction between the connection member and an inner surface of the groove.

Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: The disclosed technology generally relates to a tire and more particularly to a non-pneumatic tire. The non-pneumatic tire that has maneuverability similar to a pneumatic tire even without using air pressure, and can support the load of a vehicle and can guide performance-oriented tire deformation behavior by using a meta structure. In an aspect, a non-pneumatic tire includes a tread that comes in contact with the ground, a rim that is connected with an axle, and a spoke unit that serves as a structural support between the rim and the tread, in which the spoke unit is formed in a meta structure in which unit structures are repeated.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: In one example, a semiconductor structure comprises a frontside substrate comprising a conductive structure, a backside substrate comprising a base substrate and a cavity substrate contacting the base substrate, wherein the backside substrate is over a top side of the frontside substrate and has a cavity and an internal interconnect contacting the frontside substrate, and a first electronic component over the top side of the frontside substrate and in the cavity. The first electronic component is coupled with the conductive structure, and an encapsulant is in the cavity and on the top side of the frontside substrate, contacting a lateral side of the first electronic component, a lateral side of the cavity, and a lateral side of the internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.

Abstract: A holder for holding an electronic label device includes a body; a first coupler including a top horizontal extension and a pressing portion extending from the top horizontal extension in a front direction at a predetermined curvature; a second coupler extending in a horizontal direction and protruding from a top of the body in a front direction, wherein the second coupler is spaced from the pressing portion to define a clipping gap therebetween; and a third coupler including: a bottom horizontal extension extending in a horizontal direction and protruding from a bottom of the body in a front direction; and a guide portion extending from the bottom horizontal extension at a predetermined angle relative to the bottom horizontal extension, such that an upper portion of the guide portion and the bottom horizontal extension define a protrusion receiving portion.

Abstract: Disclosed are a method and an apparatus for de-identification of personal information. The method for de-identification of personal information comprises the steps of: obtaining, from a database, a raw table including records in which raw data indicating the personal information is recorded; generating generalized data by generalizing the raw data recorded in each of the records included in the raw table; setting a generalized hierarchical model consisting of the raw data and the generalized data; generating a raw lattice including a plurality of candidate nodes on the basis of the generalized hierarchical model; and setting, from among the plurality of candidate nodes included in the raw lattice, a final lattice including at least one candidate node satisfying a predetermined criterion. Thus, it is possible for the personal information to be efficiently de-identified.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.