Patents by Inventor Gi Tae
Gi Tae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230070922Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: ApplicationFiled: November 8, 2022Publication date: March 9, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11571932Abstract: The disclosed technology generally relates to a tire and more particularly to a non-pneumatic tire. The non-pneumatic tire that has maneuverability similar to a pneumatic tire even without using air pressure, and can support the load of a vehicle and can guide performance-oriented tire deformation behavior by using a meta structure. In an aspect, a non-pneumatic tire includes a tread that comes in contact with the ground, a rim that is connected with an axle, and a spoke unit that serves as a structural support between the rim and the tread, in which the spoke unit is formed in a meta structure in which unit structures are repeated.Type: GrantFiled: November 4, 2019Date of Patent: February 7, 2023Assignees: Hankook Tire & Technology Co., Ltd., Korea Advanced Institute of Science and TechnologyInventors: Sung Hee Youn, Seok Ju Choi, Myong Joong Lee, Jeong Mu Heo, Daniel Saakes, Tek Jin Nam, Seung Ryeol Kim, Se Yeong Kim, Yea Kyung Row, Oo Sung Son, Dong Hyeok Yun, Kwang Eun Park, Gi Tae Koo, Jeong Yeon Lee
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Publication number: 20220415769Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.Type: ApplicationFiled: August 29, 2022Publication date: December 29, 2022Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
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Patent number: 11495505Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: September 11, 2020Date of Patent: November 8, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Publication number: 20220352129Abstract: In one example, a semiconductor structure comprises a frontside substrate comprising a conductive structure, a backside substrate comprising a base substrate and a cavity substrate contacting the base substrate, wherein the backside substrate is over a top side of the frontside substrate and has a cavity and an internal interconnect contacting the frontside substrate, and a first electronic component over the top side of the frontside substrate and in the cavity. The first electronic component is coupled with the conductive structure, and an encapsulant is in the cavity and on the top side of the frontside substrate, contacting a lateral side of the first electronic component, a lateral side of the cavity, and a lateral side of the internal interconnect. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: July 14, 2022Publication date: November 3, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gi Tae Lim, Jae Yun Kim, Myung Jae Choi, Min Hwa Chang, Mi Kyoung Choi
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Patent number: 11482496Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.Type: GrantFiled: October 16, 2020Date of Patent: October 25, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Dong Joo Park, Ji Hun Yi, Jin Young Khim
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Patent number: 11450241Abstract: A holder for holding an electronic label device includes a body; a first coupler including a top horizontal extension and a pressing portion extending from the top horizontal extension in a front direction at a predetermined curvature; a second coupler extending in a horizontal direction and protruding from a top of the body in a front direction, wherein the second coupler is spaced from the pressing portion to define a clipping gap therebetween; and a third coupler including: a bottom horizontal extension extending in a horizontal direction and protruding from a bottom of the body in a front direction; and a guide portion extending from the bottom horizontal extension at a predetermined angle relative to the bottom horizontal extension, such that an upper portion of the guide portion and the bottom horizontal extension define a protrusion receiving portion.Type: GrantFiled: September 17, 2020Date of Patent: September 20, 2022Assignee: RAINUS CO., LTD.Inventors: Hyun-Hak Kim, Gi-Tae Do, Hyun-Hun Oh, Min-Jae Ryu
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Publication number: 20220277106Abstract: Disclosed are a method and an apparatus for de-identification of personal information. The method for de-identification of personal information comprises the steps of: obtaining, from a database, a raw table including records in which raw data indicating the personal information is recorded; generating generalized data by generalizing the raw data recorded in each of the records included in the raw table; setting a generalized hierarchical model consisting of the raw data and the generalized data; generating a raw lattice including a plurality of candidate nodes on the basis of the generalized hierarchical model; and setting, from among the plurality of candidate nodes included in the raw lattice, a final lattice including at least one candidate node satisfying a predetermined criterion. Thus, it is possible for the personal information to be efficiently de-identified.Type: ApplicationFiled: May 14, 2022Publication date: September 1, 2022Applicant: FASOO CO., LTDInventors: Dae Woo CHOI, Woo Seok KWON, Myeong Sik HWANG, Sang Wook KIM, Gi Tae KIM
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Patent number: 11430723Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.Type: GrantFiled: October 1, 2018Date of Patent: August 30, 2022Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
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Patent number: 11398455Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: June 3, 2019Date of Patent: July 26, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee
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Patent number: 11382336Abstract: The present disclosure relates to emulsified oil composition including an oil containing a polyunsaturated fatty acid which is applicable to food, a rosemary extract, and a non-ionic surfactant, wherein the product quality of the food using the oil containing the polyunsaturated fatty acid is maintained during the processing and storage of the food, by preventing the oxidation of the oil containing the polyunsaturated fatty acid to suppress the production of a rancid flavor and an off-flavor.Type: GrantFiled: September 3, 2019Date of Patent: July 12, 2022Assignee: COSMAX NBT, INC.Inventors: Jin Woo Park, Hye Jin Kim, Hye Young Kim, Jee Ho Park, Gi Tae Choe
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Patent number: 11354436Abstract: Disclosed are a method and an apparatus for de-identification of personal information. The method for de-identification of personal information comprises the steps of: obtaining, from a database, a raw table including records in which raw data indicating the personal information is recorded; generating generalized data by generalizing the raw data recorded in each of the records included in the raw table; setting a generalized hierarchical model consisting of the raw data and the generalized data; generating a raw lattice including a plurality of candidate nodes on the basis of the generalized hierarchical model; and setting, from among the plurality of candidate nodes included in the raw lattice, a final lattice including at least one candidate node satisfying a predetermined criterion. Thus, it is possible for the personal information to be efficiently de-identified.Type: GrantFiled: June 27, 2017Date of Patent: June 7, 2022Assignee: FASOO.COM CO., LTD.Inventors: Dae Woo Choi, Woo Seok Kwon, Myeong Sik Hwang, Sang Wook Kim, Gi Tae Kim
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Publication number: 20220158067Abstract: Disclosed is a method for producing a Heusler-based phase thermoelectric material using an amorphous phase precursor. More specifically disclosed is a method for producing a powder or bulk thermoelectric material having a microstructure including a Heusler-based phase with a thermoelectric effect by crystallization of an amorphous phase precursor prepared by a non-equilibrium processes. Also disclosed is a device using a Heusler-based phase thermoelectric material produced by the method. The method largely avoids the efficiency problems of conventional methods, including low productivity in scaling up caused by long annealing time, high annealing temperature, and contamination during nanopowder production, achieving improved process efficiency. In addition, the method enables efficient production of a thermoelectric material having a nano-sized microstructure that is difficult to produce by a conventional method.Type: ApplicationFiled: November 17, 2021Publication date: May 19, 2022Applicants: Kyungpook National University Industry-Academic Cooperation Foundation, Korea Advanced Institute of Science and TechnologyInventors: Seong Hoon YI, Gi Tae PARK, Seong Tae KIM, Pyuck Pa CHOI, Chan Won JUNG
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Publication number: 20220122921Abstract: In one example, an electronic device, comprises a first substrate comprising a first conductive structure, a second substrate comprising a second conductive structure, wherein the first substrate is over the second substrate, a first electronic component between the first substrate and the second substrate, a vertical interconnect between the first substrate and the second substrate, wherein the vertical interconnect is coupled with the first conductive structure and the second conductive structure, and an encapsulant between the first substrate and the second substrate and covering the vertical interconnect. A vertical port on the first electronic component is exposed by an aperture of the first substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 16, 2020Publication date: April 21, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Dong Joo Park, Ji Hun Yi, Jin Young Khim
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Patent number: 11298979Abstract: The disclosed technology generally relates to a tire, and more particularly to a non-pneumatic tire that has handling performance similar to a pneumatic tire, supports the load of a vehicle and improves riding comfort by employing a parametric structure. In one aspect, a non-pneumatic tire includes a tread that comes in contact with the ground, a rim that is connected with an axle, and a spoke unit that functions as a structural support between the rim and the tread, in which the spoke unit is formed by circularly arranging spokes. The spokes have a single closed-loop longitudinal cross-section circumscribed to the rim and around the center of the tire.Type: GrantFiled: November 4, 2019Date of Patent: April 12, 2022Assignees: Hankook Tire & Technology Co., Ltd., Korea Advanced Institute of Science and TechnologyInventors: Sung Hee Youn, Seok Ju Choi, Myong Joong Lee, Jeong Mu Heo, Daniel Saakes, Tek Jin Nam, Seung Ryeol Kim, Se Yeong Kim, Yea Kyung Row, Oo Sung Son, Dong Hyeok Yun, Kwang Eun Park, Gi Tae Koo, Jeong Yeon Lee
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Publication number: 20220068897Abstract: In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 8, 2021Publication date: March 3, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gi Tae Lim, Jae Yun Kim, Myung Jae Choi
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Patent number: 11171127Abstract: In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.Type: GrantFiled: August 2, 2019Date of Patent: November 9, 2021Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Gi Tae Lim, Jae Yun Kim, Myung Jae Choi
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Patent number: 10981153Abstract: A catalyst includes LTA zeolite including copper ions, wherein a Si/Al ratio of the LTA zeolite is 2 to 50. The catalyst is coated on a honeycomb carrier or a filter. The catalyst removes NOx from a reaction gas at 100° C. or above. The catalyst has an NOx conversion rate of 80% at 450° C. or above.Type: GrantFiled: November 19, 2019Date of Patent: April 20, 2021Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, POSTECH ACADEMY-INDUSTRY FOUNDATIONInventors: Suk Bong Hong, Donghui Jo, Taekyung Ryu, Gi Tae Park, In-Sik Nam, Pyung Soon Kim, Chang Hwan Kim
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Patent number: 10970428Abstract: Disclosed is a method of providing performance indicators of a robot hand and a method of optimizing a structure of the robot hand, and more particularly to a method of providing performance indicators of a robot hand, in which the performance indicators are to objectively compare a plurality of robot hands with respect to performance, and a method of optimizing a structure of the robot hand, in which engineering design criteria are provided to determine essential factors in developing the structure of the robot hand.Type: GrantFiled: April 1, 2016Date of Patent: April 6, 2021Assignee: Research & Business Foundation Sungkyunkwan UniversityInventors: Hyouk Ryeol Choi, Gi Tae Kang, Anna Kim, Yong Bum Kim, Won Suk You, Gun Kyu Yee, YoungHun Lee
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Publication number: 20210091364Abstract: A battery module include a first battery having a first top electrode face and a second bottom electrode face; a second battery disposed adjacent to and flush with the first battery, wherein the second battery has a first top electrode face and a second bottom electrode face; a first support terminal being in contact with the first electrode faces of the first and second batteries and electrically connecting the first electrode faces of the first and second batteries with a first substrate terminal disposed on a substrate; and a second support terminal being in contact with the second electrode faces of the first and second batteries, and electrically connecting the second electrode faces of the first and second batteries with a second substrate terminal disposed on the substrate.Type: ApplicationFiled: September 17, 2020Publication date: March 25, 2021Inventors: Hyun-Hak KIM, Gi-Tae DO, Hyun-Hun OH, Min-Jae RYU