Abstract: Plasma processing systems and methods are disclosed. The plasma processing system includes a high-frequency generator configured to deliver power to a plasma chamber and a low-frequency generator configured to deliver power to the plasma chamber. A filter is coupled between the plasma chamber and the high-frequency generator, and the filter suppresses mixing products of high frequencies produced by the high-frequency generator and low frequencies produced by the low-frequency generator.

Abstract: Plasma processing systems and methods are disclosed. The system may include at least one modulating supply that modulates plasma properties where the modulation of the plasma properties has a repetition period, T. A synchronization module configured to send a synchronization signal with a synchronization-signal-repetition-period that is an integer multiple of T to at least one piece of equipment connected to the plasma processing system. A waveform-communication module communicates characteristics of a characterized waveform to at least one piece of equipment connected to the plasma system to enable synchronization of pieces of equipment connected to the plasma processing system. The characterized waveform may contain information about the modulation of the plasma or information about a desired waveform of a piece of equipment connected to the plasma processing system.

Abstract: Plasma processing systems and methods are disclosed. The method includes generating and sustaining a plasma in a plasma chamber and producing a surface potential on a surface of a workpiece in the plasma chamber by applying, with a bias supply, an output waveform to a bias electrode within the plasma chamber where the output waveform has a repetition period, T. A waveform dataset is produced to represent the output waveform of the bias supply during the repetition period, T, and the waveform dataset is sent to one or more other pieces of equipment connected to the plasma chamber. A synchronization pulse with a synchronization-pulse-repetition-period is sent to the one or more other pieces of equipment connected to the plasma chamber to enable synchronization among the one or more other pieces of equipment.

Abstract: Plasma processing systems and methods are disclosed. The method may include modulating plasma properties with a modulating supply where the modulation of the plasma properties has a repetition period, T. A waveform with the repetition period T is characterized to produce a waveform dataset, which includes at least one of information about the modulation of the plasma or a desired waveform of a piece of equipment connected to the plasma processing system. The waveform dataset is sent to at least one piece of equipment connected to the plasma system and a synchronization signal is sent with a synchronization signal repetition period that is an integer multiple of T to the at least one piece of equipment connected to the plasma system.

Abstract: This disclosure describes systems, methods, and apparatus for a digital-to-analog (DAC) converter, that can be part of a variable capacitor and/or a match network. The DAC can include a digital input, an analog output, N contributors (e.g., switched capacitors), and an interconnect topology connecting the N contributors, generating a sum of their contributions (e.g., sum of capacitances), and providing the sum to the analog output. The N contributors can form a sub-binary sequence when their contributions to the sum are ordered by average contribution. Also, the gap size between a maximum contribution of one contributor, and a minimum contribution of a subsequent contributor, is less than D, where D is less than or equal to two time a maximum contribution of the first or smallest of the N contributors.

Abstract: Plasma processing systems and methods are disclosed. The plasma processing system includes a high-frequency generator configured to deliver power to a plasma chamber and a low-frequency generator configured to deliver power to the plasma chamber. A filter is coupled between the plasma chamber and the high-frequency generator, and the filter suppresses mixing products of high frequencies produced by the high-frequency generator and low frequencies produced by the low-frequency generator.

Abstract: Plasma processing systems and methods are disclosed. The plasma processing system includes a high-frequency generator configured to deliver power to a plasma chamber and a low-frequency generator configured to deliver power to the plasma chamber. A filter is coupled between the plasma chamber and the high-frequency generator, and the filter suppresses mixing products of high frequencies produced by the high-frequency generator and low frequencies produced by the low-frequency generator.

Abstract: This disclosure describes systems, methods, and apparatus for a digital-to-analog (DAC) converter, that can be part of a variable capacitor and/or a match network. The DAC can include a digital input, an analog output, N contributors (e.g., switched capacitors), and an interconnect topology connecting the N contributors, generating a sum of their contributions (e.g., sum of capacitances), and providing the sum to the analog output. The N contributors can form a sub-binary sequence when their contributions to the sum are ordered by average contribution. Also, the gap size between a maximum contribution of one contributor, and a minimum contribution of a subsequent contributor, is less than D, where D is less than or equal to two time a maximum contribution of the first or smallest of the N contributors.

Abstract: This disclosure describes systems, methods, and apparatus for a digital-to-analog (DAC) converter, that can be part of a variable capacitor and/or a match network. The DAC can include a digital input, an analog output, N contributors (e.g., switched capacitors), and an interconnect topology connecting the N contributors, generating a sum of their contributions (e.g., sum of capacitances), and providing the sum to the analog output. The N contributors can form a sub-binary sequence when their contributions to the sum are ordered by average contribution. Also, the gap size between a maximum contribution of one contributor, and a minimum contribution of a subsequent contributor, is less than D, where D is less than or equal to two time a maximum contribution of the first or smallest of the N contributors.

Abstract: Plasma processing systems and methods are disclosed. The method includes generating and sustaining a plasma in a plasma chamber and producing a surface potential on a surface of a workpiece in the plasma chamber by applying, with a bias supply, an output waveform to a bias electrode within the plasma chamber where the output waveform has a repetition period, T. A waveform dataset is produced to represent the output waveform of the bias supply during the repetition period, T, and the waveform dataset is sent to one or more other pieces of equipment connected to the plasma chamber. A synchronization pulse with a synchronization-pulse-repetition-period is sent to the one or more other pieces of equipment connected to the plasma chamber to enable synchronization among the one or more other pieces of equipment.

Abstract: A RF amplifier is provided that includes a plurality of switch modules connected in a cascade configuration and divided into disjoint sets in accordance with their corresponding distinct peak DC voltages or currents, each switch module including a plurality of switch devices connected in a half-bridge or full-bridge circuit and a DC voltage or current source electrically connected with the half-bridge or full-bridge circuit, and a control circuit configured to determine an output voltage or current of the RF amplifier at the next switching interval, examine the states of the switching devices in the respective switch modules to identify a combination of least-recently-switched switching devices within each set of switch modules that, when switched to an opposite state, will produce the determined output voltage or current, and switch to an opposite state, at the next switching interval, the switching devices in the identified combination.

Abstract: Plasma processing systems and methods are disclosed. The method may include modulating plasma properties with a modulating supply where the modulation of the plasma properties has a repetition period, T. A waveform with the repetition period T is characterized to produce a waveform dataset, which includes at least one of information about the modulation of the plasma or a desired waveform of a piece of equipment connected to the plasma processing system. The waveform dataset is sent to at least one piece of equipment connected to the plasma system and a synchronization signal is sent with a synchronization signal repetition period that is an integer multiple of T to the at least one piece of equipment connected to the plasma system.

Abstract: Plasma processing systems and methods are disclosed. The system may include at least one modulating supply that modulates plasma properties where the modulation of the plasma properties has a repetition period, T. A synchronization module configured to send a synchronization signal with a synchronization-signal-repetition-period that is an integer multiple of T to at least one piece of equipment connected to the plasma processing system. A waveform-communication module communicates characteristics of a characterized waveform to at least one piece of equipment connected to the plasma system to enable synchronization of pieces of equipment connected to the plasma processing system. The characterized waveform may contain information about the modulation of the plasma or information about a desired waveform of a piece of equipment connected to the plasma processing system.

Abstract: Systems and methods for adjusting the source impedance of a generator are disclosed. An exemplary method includes generating a first signal and applying the first signal to a first input of a combiner, generating a second signal and applying the second signal to a second input of said combiner, and combining the first and second signals with the combiner at an output of the combiner to produce power that is delivered to the plasma load. A controllable variable impedance is provided to an isolation port of the combiner, and the controllable variable impedance is adjusted to vary the source impedance of the generator.

Abstract: This disclosure describes systems, methods, and apparatus for frequency tuning a power source so as to optimize power delivery to a plasma load as well as systems, methods, and apparatus for identifying characteristics and/or changes in characteristics of a plasma load. In particular, a secondary power signal can be applied concurrently with a primary power signal, the secondary power signal having a substantially lower power level, so as to tune for a global optimum of a measure of performance and/or identifying characteristics and/or changes in characteristics of a plasma load. The secondary power signal can comprise a low level signal that is jointly generated with or combined with the primary power signal, or it can comprise noise either inherent to the primary power signal or added to the primary power signal.

Abstract: A radio-frequency (RF) generator is provided that produces a controlled overshoot. One embodiment includes a RF power amplifier and a direct-current (DC) power supply that includes a primary DC power supply, an auxiliary DC power supply, a half-bridge circuit, and a control circuit. The half-bridge circuit, in a first switching state, electrically connects, in series, the auxiliary DC power supply with the primary DC power supply and, in a second switching state, electrically disconnects the auxiliary DC power supply from the primary DC power supply. The control circuit places the half-bridge circuit in the first switching state for a first period of time and places the half-bridge circuit in the second switching state for a second period of time to produce a controlled overshoot in the power produced by the RF generator throughout the first period of time.

Abstract: A RF amplifier is provided that includes a plurality of switch modules connected in a cascade configuration and divided into disjoint sets in accordance with their corresponding distinct peak DC voltages or currents, each switch module including a plurality of switch devices connected in a half-bridge or full-bridge circuit and a DC voltage or current source electrically connected with the half-bridge or full-bridge circuit, and a control circuit configured to determine an output voltage or current of the RF amplifier at the next switching interval, examine the states of the switching devices in the respective switch modules to identify a combination of least-recently-switched switching devices within each set of switch modules that, when switched to an opposite state, will produce the determined output voltage or current, and switch to an opposite state, at the next switching interval, the switching devices in the identified combination.

Abstract: This disclosure describes systems, methods, and apparatus for frequency tuning a power source so as to optimize power delivery to a plasma load as well as systems, methods, and apparatus for identifying characteristics and/or changes in characteristics of a plasma load. In particular, a secondary power signal can be applied concurrently with a primary power signal, the secondary power signal having a substantially lower power level, so as to tune for a global optimum of a measure of performance and/or identifying characteristics and/or changes in characteristics of a plasma load. The secondary power signal can comprise a low level signal that is jointly generated with or combined with the primary power signal, or it can comprise noise either inherent to the primary power signal or added to the primary power signal.

Abstract: This disclosure describes systems, methods, and apparatus for frequency tuning a power source so as to optimize power delivery to a plasma load as well as systems, methods, and apparatus for identifying characteristics and/or changes in characteristics of a plasma load. In particular, a secondary power signal can be applied concurrently with a primary power signal, the secondary power signal having a substantially lower power level, so as to tune for a global optimum of a measure of performance and/or identifying characteristics and/or changes in characteristics of a plasma load. The secondary power signal can comprise a low level signal that is jointly generated with or combined with the primary power signal, or it can comprise noise either inherent to the primary power signal or added to the primary power signal.

Abstract: Systems and methods for adjusting the source impedance of a generator are disclosed. An exemplary method includes generating a first signal and applying the first signal to a first input of a combiner, generating a second signal and applying the second signal to a second input of said combiner, and combining the first and second signals with the combiner at an output of the combiner to produce power that is delivered to the plasma load. A controllable variable impedance is provided to an isolation port of the combiner, and the controllable variable impedance is adjusted to vary the source impedance of the generator.