Abstract: Devices and techniques are generally described for learning personalized concepts for natural language processing. In various examples, a first natural language input may be received. In some examples, a determination may be made that the first natural language input comprises non-actionable slot data. A dialog session may be initiated with the user. In some examples, first slot data that is indicated by the user during the dialog session may be determined. In various examples, data representing the first slot data may be stored in a database in association with the first natural language input.

Abstract: Glass-based substrates are described herein that may be processed by methods including applying a cover article onto a glass-based substrate, submerging the glass-based substrate in an etchant, and maintaining the submersion of the glass-based substrate in the etchant. The glass-based substrate may include a covered surface portion and an exposed surface portion. At least a portion of the covered surface portion may be in direct contact with the cover article. The covered surface portion may not be in contact with the etchant and the exposed surface portion may be in direct contact with the etchant. The etchant may contact the exposed surface portion and the cover article fora time sufficient to etch the exposed surface portion. The cover article may provide a barrier between the etchant and the covered surface portion for the entirety of the submerging.

Abstract: A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.

Abstract: A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A laminate structure is provided that allows the surface renewal and rework of a device by the selective removal of layers of the laminate. The selective removal may be achieved by heating or irradiating the laminate structure, such that an adhesive layer debonds and allows the removal of a damaged layer to provide a pristine surface.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: Embodiments of the present disclosure relate generally to methods of forming a laminate structure. In one or more embodiments, the method includes situating an interlayer between a glass substrate and a non-glass substrate having a softening point to form an assembled stack, heating the assembled stack to a temperature in a range of greater than the Tg of the interlayer to less than the softening point of the non-glass substrate and applying a force to at least one of the laminate glass surface and the laminate non-glass surface to bond that counter-balances thermal stress and polymer cure forces during bonding and prevents warpage, distortion and breakage of the laminate. In some embodiments, the interlayer has a coefficient of thermal expansion (CTE) at least 10 times greater than the CTE of the glass substrate.

Abstract: A laminated glass structure comprising a non-glass substrate and a glass sheet bonded to the non-glass substrate to form the laminated glass structure, wherein the laminated glass structure withstands a ball drop test wherein a 535 g stainless steel ball is dropped from a height of 0.8 m onto the laminated glass structure, with the glass sheet being impacted by the ball. The glass sheet has a thickness such that the glass sheet exhibits, without cracking, deformation to adapt to any shape change of the non-glass substrate as imparted by the ball of the ball drop test.

Abstract: A method of forming a laminated glass structure includes introducing a continuous ribbon of flexible glass substrate having a thickness of no greater than about 0.3 mm to a substrate material. The substrate material has a coefficient of thermal expansion (CTE) that is greater than that of the flexible glass substrate. The flexible glass substrate is laminated to the substrate material at an elevated temperature. The substrate material is cooled to introduce a compressive stress across a thickness of the flexible glass substrate.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: Methods of processing a glass substrate comprise the step of obtaining a glass substrate and a tab removably attached to a portion of the glass substrate. The position of the glass substrate is manipulated with the engagement portion and the tab is removed from the portion of the glass substrate by releasing a mounting portion of the tab from the portion of the glass substrate without damaging the glass substrate. In further examples, methods include the steps of removably attaching first and second tabs to respective first and second surfaces of a glass substrate and coiling the glass substrate on a storage roll wherein the first tab adheres to the second tab. In further examples, a glass apparatus comprises a glass substrate and a removable tab including a mounting portion attached to a portion of the glass substrate with a first peel force of less than about 10 N/cm.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: A method of forming a laminated glass structure includes introducing a continuous ribbon of flexible glass substrate having a thickness of no greater than about 0.3 mm to a substrate material. The substrate material has a coefficient of thermal expansion (CTE) that is greater than that of the flexible glass substrate. The flexible glass substrate is laminated to the substrate material at an elevated temperature. The substrate material is cooled to introduce a compressive stress across a thickness of the flexible glass substrate.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: A laminated glass structure comprising a non-glass substrate and a glass sheet bonded to the non-glass substrate to form the laminated glass structure, wherein the laminated glass structure withstands a ball drop test wherein a 535 g stainless steel ball is dropped from a height of 0.8 m onto the laminated glass structure, with the glass sheet being impacted by the ball. The glass sheet has a thickness such that the glass sheet exhibits, without cracking, deformation to adapt to any shape change of the non-glass substrate as imparted by the ball of the ball drop test.