Patents by Inventor Govindarajan Natarajan
Govindarajan Natarajan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20050214508Abstract: Methods for forming and the intermediate greensheet products formed are provided by attaching a removable support film to a first surface of a greensheet and a frame to a second surface of the greensheet. The support film is preferably a peelable support film cast to the first surface of the greensheet for providing strength thereto. A plurality of openings are formed in the greensheet by punching into the support film, through the support film and then through the greensheet. During this process, the support film provides added strength to the greensheet therein significantly reducing embossing and deformation of such greensheet. A second support film may be attached to the removable support film using an adhesive layer, which, is extruded into the openings upon attachment. The support film(s) may be peeled off the greensheet with little or no impact on via locations as a metal frame continues to support the greensheet.Type: ApplicationFiled: May 26, 2005Publication date: September 29, 2005Inventor: Govindarajan Natarajan
-
Publication number: 20050146016Abstract: An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wirings having regions of larger wire cross-sectional areas in locations where the package must supply higher current distribution to the electronic devices and/or where signal lines need lower electrical resistance. These larger wire cross-sectional areas are vertically extended conductors applied to either the entire conductor or portions of the conductor.Type: ApplicationFiled: January 6, 2004Publication date: July 7, 2005Applicant: International Business Machines CorporationInventors: Govindarajan Natarajan, Raschid Bezama
-
Publication number: 20050077657Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a composite material combining a durable matrix material that remains in the final structure and a temporary material that is removed after the sintering step. An array of apertures is formed in a template plate by photolithographic means and transferred to an adjacent greensheet.Type: ApplicationFiled: October 14, 2003Publication date: April 14, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: UMAR AHMAD, RASCHID BEZAMA, JAMES HUMENIK, JOHN KNICKERBOCKER, GOVINDARAJAN NATARAJAN, RAO VALLABHANENI
-
Publication number: 20050069949Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which an array of sample cells contain a U-shaped structure having two vertical apertures connected by a horizontal passage in a bottom sheet; reagents are drawn in to the vertical passages by capillary action or other forces and react in the horizontal passage. An optional version of the invention includes a relatively large reservoir for containing rinsing fluids.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: JAMES HUMENIK, GOVINDARAJAN NATARAJAN, SANDRA WHALEY, ALBERT YOUNG
-
Publication number: 20050069462Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which an array of sample cells contain a U-shaped structure having two vertical apertures connected by a horizontal passage in a bottom sheet; reagents are drawn in to the vertical passages by capillary action and react in the horizontal passage. An optional version of the invention includes a relatively large reservoir for containing rinsing fluids.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: JAMES HUMENIK, GOVINDARAJAN NATARAJAN, SANDRA WHALEY, ALBERT YOUNG
-
Publication number: 20040265537Abstract: Methods for forming and the intermediate greensheet products formed are provided by attaching a removable support film to a first surface of a greensheet and a frame to a second surface of the greensheet. The support film is preferably a peelable support film cast to the first surface of the greensheet for providing strength thereto. A plurality of openings are formed in the greensheet by punching into the support film, through the support film and then through the greensheet. During this process, the support film provides added strength to the greensheet therein significantly reducing embossing and deformation of such greensheet. A second support film may be attached to the removable support film using an adhesive layer, which, is extruded into the openings upon attachment. The support film(s) may be peeled off the greensheet with little or no impact on via locations as a metal frame continues to support the greensheet.Type: ApplicationFiled: June 30, 2003Publication date: December 30, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: GOVINDARAJAN NATARAJAN
-
Patent number: 6790515Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered.Type: GrantFiled: April 11, 2003Date of Patent: September 14, 2004Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Govindarajan Natarajan
-
Publication number: 20040129371Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.Type: ApplicationFiled: January 7, 2003Publication date: July 8, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Govindarajan Natarajan, Umar Ahmad, Raschid J. Bezama, James N. Humenik, John U. Knickerbocker, Rao V. Vallabhaneni
-
Patent number: 6745932Abstract: A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method can be applied to chips with high solder ball counts, chips with small solder ball sizes, and chips with weak surface strength. The chip detach apparatus and method measures and accounts for variability in the electronic module manufacturing and assembly.Type: GrantFiled: September 3, 2002Date of Patent: June 8, 2004Assignee: International Business Machines Corp.Inventors: Raschid J. Bezama, Govindarajan Natarajan, Robert W. Pasco
-
Patent number: 6726984Abstract: The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.Type: GrantFiled: March 28, 2003Date of Patent: April 27, 2004Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, John U. Knickerbocker, Robert W. Pasco
-
Publication number: 20040041012Abstract: A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method can be applied to chips with high solder ball counts, chips with small solder ball sizes, and chips with weak surface strength. The chip detach apparatus and method measures and accounts for variability in the electronic module manufacturing and assembly.Type: ApplicationFiled: September 3, 2002Publication date: March 4, 2004Applicant: International Business Machines CorporationInventors: Raschid J. Bezama, Govindarajan Natarajan, Robert W. Pasco
-
Patent number: 6653776Abstract: The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.Type: GrantFiled: June 28, 2000Date of Patent: November 25, 2003Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, John U. Knickerbocker, Srinivasa S. N. Reddy, Rao V. Vallabhaneni
-
Publication number: 20030205967Abstract: The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.Type: ApplicationFiled: June 16, 2003Publication date: November 6, 2003Inventors: Govindarajan Natarajan, John U. Knickerbocker, Srinivasa S. N. Reddy, Rao V. Vallabhaneni
-
Publication number: 20030203169Abstract: The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.Type: ApplicationFiled: March 28, 2003Publication date: October 30, 2003Inventors: Govindarajan Natarajan, John U. Knickerbocker, Robert W. Pasco
-
Publication number: 20030203175Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered.Type: ApplicationFiled: April 11, 2003Publication date: October 30, 2003Applicant: International Business Machines CorporationInventors: John U. Knickerbocker, Govindarajan Natarajan
-
Patent number: 6627020Abstract: A method to control the post sinter distortion of free sintered multilayer ceramic substrates by placing a discrete non-densifying structure in the green ceramic laminate prior to sintering. One or several discrete non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the discrete non-densifying structure will locally control the dimensions of the free sintered multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the discrete non-densifying structure in the active area or in the kerf area between the individual product ups prior to sintering.Type: GrantFiled: August 31, 2001Date of Patent: September 30, 2003Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, Raschid Jose Bezama
-
Patent number: 6607780Abstract: The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.Type: GrantFiled: May 25, 2000Date of Patent: August 19, 2003Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, John U. Knickerbocker, Robert W. Pasco
-
Patent number: 6607620Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered.Type: GrantFiled: January 8, 2001Date of Patent: August 19, 2003Assignee: International Business Machines CorporationInventors: John U. Knickerbocker, Govindarajan Natarajan
-
Patent number: 6597058Abstract: This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface.Type: GrantFiled: August 9, 1999Date of Patent: July 22, 2003Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, Richard F. Indyk, Vincent P. Peterson, Krishna G. Sachdev
-
Publication number: 20030096085Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered.Type: ApplicationFiled: January 8, 2001Publication date: May 22, 2003Applicant: International Business Machines CorporationInventors: John U. Knickerbocker, Govindarajan Natarajan