Abstract: A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.

Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Abstract: Methods of processing a glass substrate comprise the step of obtaining a glass substrate and a tab removably attached to a portion of the glass substrate. The position of the glass substrate is manipulated with the engagement portion and the tab is removed from the portion of the glass substrate by releasing a mounting portion of the tab from the portion of the glass substrate without damaging the glass substrate. In further examples, methods include the steps of removably attaching first and second tabs to respective first and second surfaces of a glass substrate and coiling the glass substrate on a storage roll wherein the first tab adheres to the second tab. In further examples, a glass apparatus comprises a glass substrate and a removable tab including a mounting portion attached to a portion of the glass substrate with a first peel force of less than about 10 N/cm.

Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.

Abstract: A contoured glass sheet laminating system may include a glass-side vacuum bed, a laminate-side vacuum bed and a lamination actuator. The glass-side vacuum bed may include a vacuum backside and a mold-receiving side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the glass-side vacuum bed between the vacuum backside and the mold-receiving side of the glass-side vacuum bed. The laminate-side vacuum bed may include a vacuum backside and a thin-film loading side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the laminate-side vacuum bed between the vacuum backside and the thin-film loading side of the of the laminate-side vacuum bed.

Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.

Abstract: A method of manufacturing a microfluid mixer includes pouring a ceramic precursor into a first mold, a second mold and a third mold. The first mold forms a base plate, the second mold forms a top plate, and the third mold forms a first plate. The ceramic precursors are gelled in the first mold, the second mold and the third mold to form a green base plate, a green top plate and a green first plate. The plates are removed from the respective molds. The green base plate, the green top plate, and the green first plate are co-fired to form a ceramic base plate, a ceramic top plate and a ceramic first plate. The ceramic base plate is interlocked with the ceramic top plate and the ceramic first plate, and a diaphragm is disposed upon one of the first plate and the top plate.

Abstract: A contoured glass sheet laminating system may include a glass-side vacuum bed, a laminate-side vacuum bed and a lamination actuator. The glass-side vacuum bed may include a vacuum backside and a mold-receiving side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the glass-side vacuum bed between the vacuum backside and the mold-receiving side of the glass-side vacuum bed. The laminate-side vacuum bed may include a vacuum backside and a thin-film loading side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the laminate-side vacuum bed between the vacuum backside and the thin-film loading side of the of the laminate-side vacuum bed.

Abstract: A method includes directing first and second fluids into a plurality of first ports fluidly connected to a mixing chamber disposed between a first plate and a base plate, guiding the first and second fluids into a mixing chamber, directing the first and second fluid into a plurality of second ports fluidly connected to the plurality of first ports, guiding the first and second fluids from the plurality of second ports into another mixing chamber disposed between a second plate and the first plate and fluidly connected to the mixing chamber, activating a heating element to heat one of the first and second fluids entering the mixing chamber, creating a temperature gradient between the first and second fluids entering the mixing chamber, and operating a diaphragm operatively associated with the mixing chamber and the another mixing chamber to agitate the first and second fluids to form a fluid mixture.

Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.

Abstract: A method includes directing first and second fluids into a plurality of first ports fluidly connected to a mixing chamber disposed between a first plate and a base plate, guiding the first and second fluids into a mixing chamber, directing the first and second fluid into a plurality of second ports fluidly connected to the plurality of first ports, guiding the first and second fluids from the plurality of second ports into another mixing chamber disposed between a second plate and the first plate and fluidly connected to the mixing chamber, activating a heating element to heat one of the first and second fluids entering the mixing chamber, creating a temperature gradient between the first and second fluids entering the mixing chamber, and operating a diaphragm operatively associated with the mixing chamber and the another mixing chamber to agitate the first and second fluids to form a fluid mixture.

Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.

Abstract: Disclosed herein is a mixer comprising a base plate; a top plate in intimate contact with a surface of the base plate; the intimate contact preventing a fluid loss from the bottom plate; the top plate comprising a plurality of first ports for the entry of a first fluid and a second fluid; a mixing chamber in fluid communication with the plurality of first ports; a first heating element; and an exit channel for removing an intimate mixture of the first fluid and the second fluid; and a reciprocatory device in physical contact with the mixing chamber; the reciprocatory device being operative to agitate the first fluid and the second fluid.

Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the at least one micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.

Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract: Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.

Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Abstract: An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.

Abstract: An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.