Abstract: The invention provides a method for improving airway conductance in a subject in need thereof, the method comprising administering to the subject an effective amount of one or more of tumstatin; a derivative, variant or homologue thereof, a polynucleotide encoding tumstatin or a derivative, variant or homologue thereof; or an agent capable of increasing the expression or production of tumstatin.

Abstract: An electrode for use in a electrochemical sensor comprises carbon modified with a chemically sensitive redox-active compound, excluding an electrode based on carbon having derivatised thereron two redox-active species wherein at least one of said species is selected from anthraquinone, phenanthrenequinone and N,N?-diphenyl-p-phenylenediamine (DPPD). The invention further provides a pH sensor comprising: a working electrode comprising carbon modified with a chemically sensitive redox active material; and a counter electrode, wherein the ratio of the surface area of the working electrode to the surface area of the counter electrode is from 1:10 to 10:1. Also provided is a pH sensor comprising: a working electrode comprising carbon modified with a chemically sensitive redox active material, and a counter electrode, wherein the area of the working electrode is from 500 ?m2 to 0.1 m2. The uses of these electrodes and sensors are also described.

Abstract: An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate.

Abstract: An improved wafer-to-wafer bonding method includes aligning an upper and a lower wafer and initiating a bond at a single point by applying pressure to a single point of the upper wafer via the flow of pressurized gas through a port terminating at the single point. The bond-front propagates radially across the aligned oppositely oriented wafer surfaces at a set radial velocity rate bringing the two wafer surfaces into full atomic contact by controlling the gas pressure and/or controlling the velocity of the motion of the lower wafer up toward the upper wafer.

Abstract: An apparatus for aligning semiconductor wafers includes equipment for positioning a first surface of a first semiconductor wafer directly opposite to a first surface of a second semiconductor wafer and equipment for aligning a first structure on the first semiconductor wafer with a second structure on the first surface of the second semiconductor wafer. The aligning equipment comprises at least one movable alignment device configured to be moved during alignment and to be inserted between the first surface of the first semiconductor wafer and the first surface of the second semiconductor wafer. The positioning equipment are vibrationally and mechanically isolated from the alignment device motion.

Abstract: A snowskate, comprising: an upper deck having a first tip at one end of the snowskate, the upper deck having an upper surface for supporting a user while riding the snowskate; a lower deck having a second tip at the one end, the lower deck having a lower surface for contacting snow upon which the snowskate is ridden by the user; and, one or more trucks for mounting the upper deck above the lower deck; wherein the second tip extends above the first tip at the one end to thereby reduce the snow from gathering between the upper and lower decks when the snowskate is ridden in the direction of the one end.

Abstract: Electrostatic discharge (ESD) protection circuits for self-protecting cascode stages are disclosed. In one example, an ESD protection circuit is described. A cascode stage is configured to selectively couple an output pad to a reference terminal. An ESD sensor may detect a change in voltage indicative of an ESD event occurring at the output pad, causing a gate drive to turn on the cascode stage to conduct ESD current in response to detection of the ESD event at the output pad. A leakage blocker is also included to prevent leakage current from the cascode stage to the gate drive while there is not an ESD event.

Abstract: Chutes and other components may include composite liners to improve performance. Composite liners generally comprise a base metal having a ceramic material embedded therein. The composite liners exhibit improved resistance to wear and, therefore, have a longer usable life than liners formed of the base metal alone.

Abstract: An apparatus for removing an adhesive layer from a wafer surface includes a chuck, a contact roller, a pick-up roller and a detaping tape. The chuck is configured to support and hold a wafer that comprises an adhesive layer on its top surface. The contact roller comprises an elongated cylindrical body extending along a first axis passing through its center and is configured to rotate around the first axis and to move linearly along a direction perpendicular to the first axis over the chuck and the supported wafer. The pick-up roller comprises an elongated cylindrical body extending along a second axis passing through its center and is configured to rotate around the second axis. The second axis is parallel to the first axis and the pick-up roller is arranged at a first distance from the contact roller. The detaping tape rolls around the contact roller and the pick-up roller, and as it rolls it attaches to the adhesive layer, and then is removed together with the adhesive layer.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair includes a clam-shell type reactor, an upper chuck and a lower chuck. The reactor includes first and second isolated chambers. The upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber and an edge configured to be held in fixed position via clamping means. The lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder apparatus also includes means for holding an unbonded surface of the first wafer of the temporary bonded wafer pair onto the lower surface of the upper chuck, and means for pressurizing the first chamber. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck while the upper chuck edge is held in fixed position via the clamping means, and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward.

Abstract: A debonder apparatus for debonding a temporary bonded wafer pair includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair in contact with a top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair in contact with a first surface of the flex plate. The flex plate is configured to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate.

Abstract: An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.

Abstract: A hammer assembly for attachment to a rotor of a rotary material crusher. The hammer assembly has an adaptor, having a base portion and a hammer mounting portion, with the base portion being attachable to the rotor at the periphery portion and a hammer, having at least one impact portion, for crushing material, and a mounting portion for engagement with the hammer mounting portion of the adaptor. The hammer mounting portion of the adaptor includes bearing surfaces facing a direction of impact when crushing material, and the mounting portion of the hammer includes bearing surfaces for mating with the bearing surfaces of the hammer mounting portion of the adaptor. The hammer assembly further includes a retainer rod, and at least one retainer pin. The hammer is attached to the adaptor and the retainer rod passes through apertures of the adaptor and apertures of each retainer pin in the direction of the longitudinal axes of the hammer and the adaptor.

Abstract: An apparatus for bonding semiconductor structures includes equipment for positioning a first surface of a first semiconductor structure directly opposite and in contact with a first surface of a second semiconductor structure and equipment for forming a bond interface area between the first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together with a force column configured to apply uniform pressure to the entire bond interface area between the first surfaces.

Abstract: An electro-chemical sensor is described having two molecular redox systems sensitive to the same species and having an detector to detect relative shifts in the voltammograms of the two redox systems.

Abstract: Provided herein are methods and compositions for regulating airway tissue remodelling and for treating or preventing conditions associated with airway inflammation and/or airway tissue remodelling. The methods comprise normalising fibulin-1 levels in said tissue relative to normal endogenous levels. In an embodiment the methods comprise administering to a subject in need thereof an effective amount of at least one agent capable of inhibiting the expression and/or activity of fibulin-1.

Abstract: A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly.

Abstract: An extension to the Universal Serial Bus (USB) protocol that utilizes reserved bits in the OHCI Endpoint Descriptors to signal which root hub port(s) should transmit the data. Typically, all ports transmit (broadcast) data. The present invention encodes transmission information that can be used by the hardware to effectively control which port(s) need to be tri-stated. However, by setting, the “on” bits for all the ports, the present invention retains standard USB functionality. Also provided is a method to increase the bandwidth of low speed devices connected to the USB bus by increasing the data payload for such devices.

Abstract: A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end.

Abstract: A debonder apparatus for debonding two via an adhesive layer combined with a release layer temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder configured to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge connected to a hinge and a second edge diametrically opposite to the first edge, and the flex plate's first edge is arranged adjacent to a first edge of the chuck and the flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor is configured to move the contact roller vertical to the plane of the chuck top surface.