Abstract: Technological solutions are introduced for providing a secure and effective (hence, enhanced) online dating forum. The ability to attend live events in person or remotely is coupled with presence location and automatic verification of user devices and identities. This allows secured communication between participants without having to disclose actual contact information of the participants or their device addresses.

Abstract: A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves. In some instances, the leveling adjustment system further may include a plurality of preload springs configured to provide a given preload capacity and range of adjustment. In some instances, the leveling adjustment system further may include a load cell through which one of the threaded posts may be inserted. In some embodiments, the upper block assembly further may include a reaction plate configured to reduce deformation of the upper block assembly. In some embodiments, the upper block assembly further may include a thermal isolation plate configured to provide compliance deflection and being of monolithic or polylithic construction, as desired.

Abstract: Systems and methods are disclosed herein for resolving a change to a table. A processing circuitry receives, from a user in a collaborative document editing environment, the change to the table, wherein the change comprises an expansion of a first cell in the table. A first state of the first cell is identified, wherein the state is indicative of a number of columns and a number of rows over which the first cell spans, and at least one of the number of columns and the number of rows is greater than one. A second state of a second cell that is adjacent to the first cell is identified, and the processing circuitry selects whether to allow the expansion of the first cell based on the second state of the second cell.

Abstract: A computer system processes a plurality of unrelated database tables to create a join graph where each node in the join graph represents a table. The nodes in the join graph are connected by weighted, directed edges, where each directed edge represents a join from a first column in a first table to a second column in a second table and where the weight of the directed edge represents a predicted level of success in performing the join. The edge weights can be based on a likelihood of finding a value from the first column in the second column. A user selects a subset of the tables, and the system creates a join tree with recommended joins between the tables selected by the user. The recommended joins are used to create a structured query language statement which is executed to return a result to the user.

Abstract: An apparatus for adjusting the assistive lifting force capacity of a height adjustable work surface. The apparatus includes a couple of plates which are mounted to a system for providing a system for adjusting the height of the work surface. The plates include a set of connection points for connecting the apparatus to a gas spring. The geometry of the holes and the positioning of the gas spring provide for a more consistent lifting force throughout a range of motion of the work surface.

Abstract: An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: Systems and methods disclosed herein provide a method of managing a state of a virtual rendering surface for an electronic document. The method includes obtaining, at a user device from a remote storage server, content relating to an electronic document, and rendering the content of the electronic document onto a first virtual rendering surface. The method further includes maintaining a second virtual rendering surface that stores a current state of the first virtual rendering surface. The method further includes obtaining an operation command relating to the electronic document, and retrieving first state information of the first virtual rendering surface and second state information of the second virtual rendering surface. The method further includes applying the operation command to the rendered content of the electronic document on the first virtual rendering surface, and updating at least one of the first state information or the second state information based on a type of the operation command.

Abstract: A device for reducing communications crosstalk including a plurality of channel inputs each configured to receive an incoming signal from a respective device. The device further includes at least one control input configured such that, when the control input is triggered, the control input activates a voltage divider that attenuates at least one of the incoming signals, thereby reducing crosstalk between a first channel carrying the at least one attenuated incoming signal and a second channel not carrying the at least one attenuated incoming signal. The at least one attenuated incoming signal and the remaining incoming signals are output to a respective receiver.

Abstract: A computer system processes a plurality of unrelated database tables to create a join graph where each node in the join graph represents a table. The nodes in the join graph are connected by weighted, directed edges, where each directed edge represents a join from a first column in a first table to a second column in a second table and where the weight of the directed edge represents a predicted level of success in performing the join. The edge weights can be based on a likelihood of finding a value from the first column in the second column. A user selects a subset of the tables, and the system creates a join tree with recommended joins between the tables selected by the user. The recommended joins are used to create a structured query language statement which is executed to return a result to the user.

Abstract: An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.

Abstract: An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: Power modules with reduced parasitic inductances are provided. A power module includes a first substrate including a first electrically-conductive layer and a second substrate including a second electrically-conductive layer. These substrates may be stacked on each other. A scalable network of power switches may be arranged on the substrates. Power bars may be connectable to the electrically-conductive layers through electromechanical interfaces at selectable interface locations. The locations and/or type of interface may be selectable based on the arrangement of the switches. The first and second electrically-conductive layers may be disposed on mutually opposed surfaces of a dielectric layer having a thickness chosen to effect a level of coupling between respective source and return current paths provided by the electrically-conductive layers.

Abstract: A multiport AC link converter includes a resonant AC link, an input port, an output port, and a plurality of switches. A first subset of the switches is between the input port the resonant link and a second subset of the switches is between the resonant link and the output port. The switch sequencing for the input port is selected and executed independently of the switch sequencing for the output port the switch sequencings for the output port is selected and executed independently of that for the input port.

Abstract: A baking device for a wafer coated with a coating containing a solvent is described, having a baking chamber, a support for the wafer, an inlet for a purge gas, and an evacuation for the purge gas charged with solvent evaporated from the coating. The inlet is formed as a diffusion element arranged above the wafer so as to admit the purge gas evenly over substantially the entire surface of the wafer, and the evacuation is formed as an evacuation ring which radially surrounds the diffusion element and is arranged at a ceiling of the baking chamber.

Abstract: A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly.

Abstract: A computer system processes a plurality of unrelated database tables to create a join graph where each node in the join graph represents a table. The nodes in the join graph are connected by weighted, directed edges, where each directed edge represents a join from a first column in a first table to a second column in a second table and where the weight of the directed edge represents a predicted level of success in performing the join. The edge weights can be based on a likelihood of finding a value from the first column in the second column. A user selects a subset of the tables, and the system creates a join tree with recommended joins between the tables selected by the user. The recommended joins are used to create a structured query language statement which is executed to return a result to the user.