Patents by Inventor Gregory L. Whiting
Gregory L. Whiting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180306218Abstract: A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members.Type: ApplicationFiled: July 2, 2018Publication date: October 25, 2018Inventors: Scott J. H. Limb, Gregory L. Whiting
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Publication number: 20180294232Abstract: A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and immersing the microchip in a fluid to develop charge in or on the material through interaction with the surrounding fluid.Type: ApplicationFiled: June 14, 2018Publication date: October 11, 2018Inventors: Eugene M. Chow, JenPing Lu, Armin R. Volkel, Bing R. Hsieh, Gregory L. Whiting, Sean E. Doris
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Publication number: 20180254302Abstract: A method and system utilizes ink jetting or printing of surface work function modification material or solution to form modified p-type and/or n-type electrodes. The proposed method is suitable for making complementary OTFT circuits in roll-to-roll fabrication environment.Type: ApplicationFiled: March 1, 2017Publication date: September 6, 2018Applicant: Palo Alto Research Center IncorporatedInventors: Ping Mei, Robert A. Street, Gregory L. Whiting, Sivkheng Kor, Steven E. Ready
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Publication number: 20180252659Abstract: A printed resistive gas detector configuration that is simple, inexpensive and compact, fabricated for incorporation into an electronic device, such as an electronic computing and/or communication device, the printed resistive gas detector configuration designed to continuously monitor for predetermined types of gasses. The printed resistive gas detector configuration manufactured by the use of printing technology to print on a flexible substrate.Type: ApplicationFiled: March 1, 2017Publication date: September 6, 2018Applicant: Palo Alto Research Center IncorporatedInventors: Robert A. Street, David Eric Schwartz, Ping Mei, Brent S. Krusor, Jonathan Rivnay, Yong Zhang, Gregory L. Whiting, Sivkheng Kor, Steven E. Ready
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Patent number: 10014261Abstract: A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and immersing the microchip in a fluid to develop charge in or on the material through interaction with the surrounding fluid.Type: GrantFiled: October 15, 2012Date of Patent: July 3, 2018Assignee: PALO ALTO RESEARCH CENTER INCORPORATEDInventors: Eugene M. Chow, JengPing Lu, Armin R. Volkel, Bing R. Hsieh, Gregory L. Whiting
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Patent number: 10012250Abstract: A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members.Type: GrantFiled: April 6, 2016Date of Patent: July 3, 2018Assignee: Palo Alto Research Center IncorporatedInventors: Scott J. H. Limb, Gregory L. Whiting
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Patent number: 9952082Abstract: The level sensor system includes a level sensor label configured to be associated with a container containing a material whose level is to be sensed, the level sensor label arrangement having a circuit which includes an inductive element electrically connected to a capacitive structure configured to be associated with the container.Type: GrantFiled: May 10, 2016Date of Patent: April 24, 2018Assignee: PALO ALTO RESEARCH CENTER INCORPORATEDInventors: David E. Schwartz, Yunda Wang, Robert A. Street, Ping Mei, Janos Veres, Gregory L. Whiting, Steven E. Ready, Tse Nga Ng
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Publication number: 20180005963Abstract: A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes a trigger device operably mounted on a surface thereof. An integrated circuit (IC) die is then bonded to the interposer, and the interposer is mounted to a package structure where it serves, under normal operating conditions, to operably connect the IC die to the package I/O pins/balls. During a transient event (e.g., when unauthorized tampering is detected), a trigger signal is transmitted to the trigger device, causing the trigger device to generate an initial fracture force that is applied onto the glass-based interposer substrate. The interposer is configured such that the initial fracture force propagates through the glass-based interposer substrate with sufficient energy to both entirely powderize the interposer, and to transfer to the IC die, whereby the IC die also powderizes (i.e., visually disappears).Type: ApplicationFiled: August 29, 2017Publication date: January 4, 2018Inventors: Scott J.H. Limb, Gregory L. Whiting
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Publication number: 20170328761Abstract: The level sensor system includes a level sensor label configured to be associated with a container containing a material whose level is to be sensed, the level sensor label arrangement having a circuit which includes an inductive element electrically connected to a capacitive structure configured to be associated with the container.Type: ApplicationFiled: May 10, 2016Publication date: November 16, 2017Applicant: Palo Alto Research Center IncorporatedInventors: David E. Schwartz, Yunda Wang, Robert A. Street, Ping Mei, Janos Veres, Gregory L. Whiting, Steven E. Ready, Tse Nga Ng
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Publication number: 20170292546Abstract: A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members.Type: ApplicationFiled: April 6, 2016Publication date: October 12, 2017Inventors: Scott J. H. Limb, Gregory L. Whiting
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Patent number: 9780044Abstract: A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes a trigger device operably mounted on a surface thereof. An integrated circuit (IC) die is then bonded to the interposer, and the interposer is mounted to a package structure where it serves, under normal operating conditions, to operably connect the IC die to the package I/O pins/balls. During a transient event (e.g., when unauthorized tampering is detected), a trigger signal is transmitted to the trigger device, causing the trigger device to generate an initial fracture force that is applied onto the glass-based interposer substrate. The interposer is configured such that the initial fracture force propagates through the glass-based interposer substrate with sufficient energy to both entirely powderize the interposer, and to transfer to the IC die, whereby the IC die also powderizes (i.e., visually disappears).Type: GrantFiled: April 23, 2015Date of Patent: October 3, 2017Assignee: Palo Alto Research Center IncorporatedInventors: Scott J. H. Limb, Gregory L. Whiting
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Publication number: 20170171958Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed.Type: ApplicationFiled: December 10, 2015Publication date: June 15, 2017Applicant: Palo Alto Research Center IncorporatedInventors: Tse Nga Ng, Ping Mei, Brent S. Krusor, Gregory L. Whiting, Steven E. Ready, Janos Veres
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Publication number: 20170084551Abstract: A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes a trigger device operably mounted on a surface thereof. An integrated circuit (IC) die is then bonded to the interposer, and the interposer is mounted to a package structure where it serves, under normal operating conditions, to operably connect the IC die to the package I/O pins/balls. During a transient event (e.g., when unauthorized tampering is detected), a trigger signal is transmitted to the trigger device, causing the trigger device to generate an initial fracture force that is applied onto the glass-based interposer substrate. The interposer is configured such that the initial fracture force propagates through the glass-based interposer substrate with sufficient energy to both entirely powderize the interposer, and to transfer to the IC die, whereby the IC die also powderizes (i.e., visually disappears).Type: ApplicationFiled: April 23, 2015Publication date: March 23, 2017Inventors: Scott J. H. Limb, Gregory L. Whiting
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Patent number: 9594039Abstract: A method for detecting an enthalpy change includes providing a first mixture and a second mixture to a drop generator. The first mixture includes a ligand. The second mixture contains a target molecule. The method further includes generating a drop in the drop generator. The drop includes the target molecule, a temperature-sensitive reporter compound, and the ligand. The method also includes measuring a property of the temperature-sensitive reporter compound in the drop to determine an amount of enthalpy change that has occurred.Type: GrantFiled: December 26, 2014Date of Patent: March 14, 2017Assignee: PALO ALTO RESEARCH CENTER INCORPORATEDInventors: Michael I. Recht, Joerg Martini, Gregory L. Whiting, Francisco E. Torres
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Publication number: 20170048986Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among others, where the surface of the electronic circuit component is at the same level as the associated substrate, the surface of the electronic circuit component holding connection pads. A gap exists between the electronic circuit component, and the end of an opening within the substrate. This gap is filled with a filler material, such as a bonding material. The bonding material also used to encapsulate or bond together the back side of the substrate and electronic circuit component. During the manufacturing process, the front surface of the electronic circuit component (which includes the contact pads) and the front surface of the substrate which includes electronic circuitry are held in an adhesive relationship by a flat material having an upper surface which includes adhesive or sticky material (such as PDMS).Type: ApplicationFiled: December 10, 2015Publication date: February 16, 2017Applicant: Palo Alto Research Center IncorporatedInventors: Ping Mei, Gregory L. Whiting, Brent S. Krusor
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Patent number: 9473047Abstract: A system and method reduce stiction while manipulating micro objects on a surface. The system and method employed a field generator configured to generate a driving force at a frequency and amplitude to at least partially overcome stiction between the micro objects and the surface. The field generator is further configured to generate a manipulation force to manipulate the micro objects on the surface in two dimensions. The manipulation force is spatially programmable.Type: GrantFiled: September 19, 2013Date of Patent: October 18, 2016Assignee: Palo Alto Research Center IncorporatedInventors: Jason Thompson, Eugene M. Chow, JengPing Lu, Gregory L. Whiting, David K. Biegelsen, Janos Veres
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Patent number: 9431283Abstract: A system and method manipulate micro objects. A field generator is configured to generate a force field varying in both space and time to manipulate the micro objects on a substrate. The substrate is not permanently affixed to the field generator and allows the force field to pass through the substrate.Type: GrantFiled: September 19, 2013Date of Patent: August 30, 2016Assignee: Palo Alto Research Center IncorporatedInventors: Jason Thompson, Eugene M. Chow, JengPing Lu, Gregory L. Whiting, David K. Biegelsen, Janos Veres
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Patent number: 9396972Abstract: An IC assembly includes multiple microelectronic dies embedded in a substrate material using capillary forces such that the contact surface of each microelectronic die is coplanar with a planar upper surface of the substrate material. The substrate material is deposited as a layer of uncured polymer in a paste (or other solid form) on a base chip, and then the microelectronic dies are mounted on the layer surface in a predefined pattern. The uncured polymer is then heated until becomes a flowable liquid, causing the microelectronic dies to be pulled into the liquid polymer by capillary forces until the contact surface of each microelectronic die is coplanar with the upper liquid polymer surface. The liquid polymer is then cured to form the substrate material as a cross-linked robust solid film that fixedly secures the microelectronic dies in the predefined pattern. The microelectronic dies are then interconnected using standard metallization techniques.Type: GrantFiled: February 11, 2014Date of Patent: July 19, 2016Assignee: Palo Alto Research Center IncorporatedInventors: Gregory L. Whiting, Rene A. Lujan
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Publication number: 20160187273Abstract: A method for detecting an enthalpy change includes providing a first mixture and a second mixture to a drop generator. The first mixture includes a ligand. The second mixture contains a target molecule. The method further includes generating a drop in the drop generator. The drop includes the target molecule, a temperature-sensitive reporter compound, and the ligand. The method also includes measuring a property of the temperature-sensitive reporter compound in the drop to determine an amount of enthalpy change that has occurred.Type: ApplicationFiled: December 26, 2014Publication date: June 30, 2016Inventors: Michael I. Recht, Joerg Martini, Gregory L. Whiting, Francisco E. Torres
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Patent number: 9356603Abstract: A thermally tempered glass substrate for transient electronic systems (i.e., including electronic devices that visually disappear when triggered to do so) including two or more fused-together glass structures having different coefficient of thermal expansion (CTE) values disposed in an intermixed arrangement manner that generates and stores potential energy in the form of residual, self-equilibrating internal stresses. In alternative embodiments the substrate includes laminated glass sheets, or glass elements (e.g., beads or cylinders) disposed in a glass layer. A trigger device causes an initial fracture in the thermally tempered glass substrate, whereby the fracture energy nearly instantaneously travels throughout the thermally tempered glass substrate, causing the thermally tempered glass substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. Patterned fracture features are optionally provided to control the final fractured particle size.Type: GrantFiled: April 23, 2015Date of Patent: May 31, 2016Assignee: Palo Alto Research Center IncorporatedInventors: Scott J. H. Limb, Gregory L. Whiting, Sean R. Garner