Patents by Inventor Gregory L. Whiting

Gregory L. Whiting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10012250
    Abstract: A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: July 3, 2018
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Scott J. H. Limb, Gregory L. Whiting
  • Patent number: 9952082
    Abstract: The level sensor system includes a level sensor label configured to be associated with a container containing a material whose level is to be sensed, the level sensor label arrangement having a circuit which includes an inductive element electrically connected to a capacitive structure configured to be associated with the container.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: April 24, 2018
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: David E. Schwartz, Yunda Wang, Robert A. Street, Ping Mei, Janos Veres, Gregory L. Whiting, Steven E. Ready, Tse Nga Ng
  • Publication number: 20180005963
    Abstract: A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes a trigger device operably mounted on a surface thereof. An integrated circuit (IC) die is then bonded to the interposer, and the interposer is mounted to a package structure where it serves, under normal operating conditions, to operably connect the IC die to the package I/O pins/balls. During a transient event (e.g., when unauthorized tampering is detected), a trigger signal is transmitted to the trigger device, causing the trigger device to generate an initial fracture force that is applied onto the glass-based interposer substrate. The interposer is configured such that the initial fracture force propagates through the glass-based interposer substrate with sufficient energy to both entirely powderize the interposer, and to transfer to the IC die, whereby the IC die also powderizes (i.e., visually disappears).
    Type: Application
    Filed: August 29, 2017
    Publication date: January 4, 2018
    Inventors: Scott J.H. Limb, Gregory L. Whiting
  • Publication number: 20170328761
    Abstract: The level sensor system includes a level sensor label configured to be associated with a container containing a material whose level is to be sensed, the level sensor label arrangement having a circuit which includes an inductive element electrically connected to a capacitive structure configured to be associated with the container.
    Type: Application
    Filed: May 10, 2016
    Publication date: November 16, 2017
    Applicant: Palo Alto Research Center Incorporated
    Inventors: David E. Schwartz, Yunda Wang, Robert A. Street, Ping Mei, Janos Veres, Gregory L. Whiting, Steven E. Ready, Tse Nga Ng
  • Publication number: 20170292546
    Abstract: A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members.
    Type: Application
    Filed: April 6, 2016
    Publication date: October 12, 2017
    Inventors: Scott J. H. Limb, Gregory L. Whiting
  • Patent number: 9780044
    Abstract: A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes a trigger device operably mounted on a surface thereof. An integrated circuit (IC) die is then bonded to the interposer, and the interposer is mounted to a package structure where it serves, under normal operating conditions, to operably connect the IC die to the package I/O pins/balls. During a transient event (e.g., when unauthorized tampering is detected), a trigger signal is transmitted to the trigger device, causing the trigger device to generate an initial fracture force that is applied onto the glass-based interposer substrate. The interposer is configured such that the initial fracture force propagates through the glass-based interposer substrate with sufficient energy to both entirely powderize the interposer, and to transfer to the IC die, whereby the IC die also powderizes (i.e., visually disappears).
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: October 3, 2017
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Scott J. H. Limb, Gregory L. Whiting
  • Publication number: 20170171958
    Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed.
    Type: Application
    Filed: December 10, 2015
    Publication date: June 15, 2017
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Tse Nga Ng, Ping Mei, Brent S. Krusor, Gregory L. Whiting, Steven E. Ready, Janos Veres
  • Publication number: 20170084551
    Abstract: A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes a trigger device operably mounted on a surface thereof. An integrated circuit (IC) die is then bonded to the interposer, and the interposer is mounted to a package structure where it serves, under normal operating conditions, to operably connect the IC die to the package I/O pins/balls. During a transient event (e.g., when unauthorized tampering is detected), a trigger signal is transmitted to the trigger device, causing the trigger device to generate an initial fracture force that is applied onto the glass-based interposer substrate. The interposer is configured such that the initial fracture force propagates through the glass-based interposer substrate with sufficient energy to both entirely powderize the interposer, and to transfer to the IC die, whereby the IC die also powderizes (i.e., visually disappears).
    Type: Application
    Filed: April 23, 2015
    Publication date: March 23, 2017
    Inventors: Scott J. H. Limb, Gregory L. Whiting
  • Patent number: 9594039
    Abstract: A method for detecting an enthalpy change includes providing a first mixture and a second mixture to a drop generator. The first mixture includes a ligand. The second mixture contains a target molecule. The method further includes generating a drop in the drop generator. The drop includes the target molecule, a temperature-sensitive reporter compound, and the ligand. The method also includes measuring a property of the temperature-sensitive reporter compound in the drop to determine an amount of enthalpy change that has occurred.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: March 14, 2017
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Michael I. Recht, Joerg Martini, Gregory L. Whiting, Francisco E. Torres
  • Publication number: 20170048986
    Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among others, where the surface of the electronic circuit component is at the same level as the associated substrate, the surface of the electronic circuit component holding connection pads. A gap exists between the electronic circuit component, and the end of an opening within the substrate. This gap is filled with a filler material, such as a bonding material. The bonding material also used to encapsulate or bond together the back side of the substrate and electronic circuit component. During the manufacturing process, the front surface of the electronic circuit component (which includes the contact pads) and the front surface of the substrate which includes electronic circuitry are held in an adhesive relationship by a flat material having an upper surface which includes adhesive or sticky material (such as PDMS).
    Type: Application
    Filed: December 10, 2015
    Publication date: February 16, 2017
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Ping Mei, Gregory L. Whiting, Brent S. Krusor
  • Patent number: 9473047
    Abstract: A system and method reduce stiction while manipulating micro objects on a surface. The system and method employed a field generator configured to generate a driving force at a frequency and amplitude to at least partially overcome stiction between the micro objects and the surface. The field generator is further configured to generate a manipulation force to manipulate the micro objects on the surface in two dimensions. The manipulation force is spatially programmable.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: October 18, 2016
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Jason Thompson, Eugene M. Chow, JengPing Lu, Gregory L. Whiting, David K. Biegelsen, Janos Veres
  • Patent number: 9431283
    Abstract: A system and method manipulate micro objects. A field generator is configured to generate a force field varying in both space and time to manipulate the micro objects on a substrate. The substrate is not permanently affixed to the field generator and allows the force field to pass through the substrate.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: August 30, 2016
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Jason Thompson, Eugene M. Chow, JengPing Lu, Gregory L. Whiting, David K. Biegelsen, Janos Veres
  • Patent number: 9396972
    Abstract: An IC assembly includes multiple microelectronic dies embedded in a substrate material using capillary forces such that the contact surface of each microelectronic die is coplanar with a planar upper surface of the substrate material. The substrate material is deposited as a layer of uncured polymer in a paste (or other solid form) on a base chip, and then the microelectronic dies are mounted on the layer surface in a predefined pattern. The uncured polymer is then heated until becomes a flowable liquid, causing the microelectronic dies to be pulled into the liquid polymer by capillary forces until the contact surface of each microelectronic die is coplanar with the upper liquid polymer surface. The liquid polymer is then cured to form the substrate material as a cross-linked robust solid film that fixedly secures the microelectronic dies in the predefined pattern. The microelectronic dies are then interconnected using standard metallization techniques.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: July 19, 2016
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Gregory L. Whiting, Rene A. Lujan
  • Publication number: 20160187273
    Abstract: A method for detecting an enthalpy change includes providing a first mixture and a second mixture to a drop generator. The first mixture includes a ligand. The second mixture contains a target molecule. The method further includes generating a drop in the drop generator. The drop includes the target molecule, a temperature-sensitive reporter compound, and the ligand. The method also includes measuring a property of the temperature-sensitive reporter compound in the drop to determine an amount of enthalpy change that has occurred.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 30, 2016
    Inventors: Michael I. Recht, Joerg Martini, Gregory L. Whiting, Francisco E. Torres
  • Patent number: 9356603
    Abstract: A thermally tempered glass substrate for transient electronic systems (i.e., including electronic devices that visually disappear when triggered to do so) including two or more fused-together glass structures having different coefficient of thermal expansion (CTE) values disposed in an intermixed arrangement manner that generates and stores potential energy in the form of residual, self-equilibrating internal stresses. In alternative embodiments the substrate includes laminated glass sheets, or glass elements (e.g., beads or cylinders) disposed in a glass layer. A trigger device causes an initial fracture in the thermally tempered glass substrate, whereby the fracture energy nearly instantaneously travels throughout the thermally tempered glass substrate, causing the thermally tempered glass substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. Patterned fracture features are optionally provided to control the final fractured particle size.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: May 31, 2016
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Scott J. H. Limb, Gregory L. Whiting, Sean R. Garner
  • Patent number: 9305807
    Abstract: Charge-encoded chiplets are produced using a sacrificial metal mask and associated fabrication techniques and materials that are compatible with typical semiconductor fabrication processes to provide each chiplet with two different (i.e., positive and negative) charge polarity regions generated by associated patterned charge-inducing material structures. A first charge-inducing material having a positive charge polarity is formed on a silicon wafer over previously-fabricated integrated circuits, then a sacrificial metal mask is patterned only over a portion of the charge-inducing material structure, and a second charge-inducing material structure (e.g., a self-assembling octadecyltrichlorosilane monolayer) is deposited having a negative charge polarity. The sacrificial metal mask is then removed to expose the masked portion of the first charge-inducing material structure, thereby providing the chiplet with both a positive charge polarity region and a negative charge polarity region.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: April 5, 2016
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Gregory L. Whiting, Rene A. Lujan, Eugene M. Chow, JengPing Lu
  • Publication number: 20150358021
    Abstract: A thermally tempered glass substrate for transient electronic systems (i.e., including electronic devices that visually disappear when triggered to do so) including two or more fused-together glass structures having different coefficient of thermal expansion (CTE) values disposed in an intermixed arrangement manner that generates and stores potential energy in the form of residual, self-equilibrating internal stresses. In alternative embodiments the substrate includes laminated glass sheets, or glass elements (e.g., beads or cylinders) disposed in a glass layer. A trigger device causes an initial fracture in the thermally tempered glass substrate, whereby the fracture energy nearly instantaneously travels throughout the thermally tempered glass substrate, causing the thermally tempered glass substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. Patterned fracture features are optionally provided to control the final fractured particle size.
    Type: Application
    Filed: April 23, 2015
    Publication date: December 10, 2015
    Inventors: Scott J.H. Limb, Gregory L. Whiting, Sean R. Garner
  • Patent number: 9154138
    Abstract: A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: October 6, 2015
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Scott J. H. Limb, Gregory L. Whiting, Sean R. Garner, JengPing Lu, Dirk DeBruyker
  • Publication number: 20150262856
    Abstract: A system and method manipulate micro objects. A field generator is configured to generate a force field varying in both space and time to manipulate the micro objects on a substrate. The substrate is not permanently affixed to the field generator and allows the force field to pass through the substrate.
    Type: Application
    Filed: September 19, 2013
    Publication date: September 17, 2015
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Jason Thompson, Eugene M. Chow, JengPing Lu, Gregory L. Whiting, David K. Biegelsen, Janos Veres
  • Publication number: 20150243528
    Abstract: Charge-encoded chiplets are produced using a sacrificial metal mask and associated fabrication techniques and materials that are compatible with typical semiconductor fabrication processes to provide each chiplet with two different (i.e., positive and negative) charge polarity regions generated by associated patterned charge-inducing material structures. A first charge-inducing material (e.g., SiO2) having a first (e.g., positive) charge polarity is formed on a silicon wafer over previously-fabricated integrated circuits (ICs), then a sacrificial metal mask (e.g., MoCr) is patterned only over a portion of the charge-inducing material structure, and a second charge-inducing material structure (e.g., a self-assembling octadecyltrichlorosilane (OTS) monolayer) is deposited having a second (e.g., negative) charge polarity.
    Type: Application
    Filed: February 27, 2014
    Publication date: August 27, 2015
    Applicant: Palo Alto Research Center Incorporated
    Inventors: Gregory L. Whiting, Rene A. Lujan, Eugene M. Chow, JengPing Lu