Abstract: A heat sink, is made to have a decreased thermal resistance (sink to ambient heat dissipation) and increased heat transfer coefficient by reducing the thickness of the thermal boundary layer. The heat sink includes a thermally conductive base and a plurality of fins extending from a surface of the thermally conductive base. The fins are made of a thermally conductive mesh material. Alternatively, the heat sink can include a thermally conductive base and a plurality of pins extending perpendicularly from a surface of the thermally conductive base, the plurality of pins being made of a thermally conductive material, and being arranged in a plurality of rows, and a plurality of wires extending parallel to the thermally conductive base, each of the wires connecting the pins of one of the plurality of rows.

Abstract: Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Abstract: A computer system is described having additional cooling capabilities in a docking station for a mobile computer. The docking station includes P- and N-doped semiconductor thermoelectric components. The thermoelectric components are connected in series when the mobile computer engages with the docking station. A current flowing through a doped semiconductor causes heat to be transferred either in a direction of a current through the semiconductor component or in a direction opposite to a current in the thermoelectric components, depending on their doping. The thermoelectric components alternate from being P-doped to N-doped and the direction in which current flows alternates accordingly so that heat is transferred in one direction only. A heat pumping effect is created by the thermoelectric components which does not require high-pressure contact upon engagement of the mobile computer with the docking station.

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal spreader formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS and/or to the die through soldering or through a room temperature surface activated bonding (SAB) process. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal interface formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: Folded fin heat sinks are provided to inhibit thermal deterioration in the performance of devices. An exemplary heat sink includes a sheet creased in an accordion fold to form a plurality of fins. The plurality of fins is modified to form a plurality of openings. An exemplary method includes forming the fin from a sheet that has been modified to form a plurality of openings. Given the openings, over fifty percent of the fin structure is receptive to an introduced convection medium.

Abstract: A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use of direct air cooling. The thermosyphon cooling system repositions the air cooling aspect of its cooling function to an exterior cabinet location distant from the circuit modules which can therefore be placed more closely together to shorten signal paths.

Abstract: Supplemental heat mechanisms are employed to ensure that refrigerant in evaporative cold plates for electronic modules not only returns to the compressor in a vapor phase but also further operates to maintain electronic circuit junction temperatures at relatively constant temperature levels. Furthermore, the supplemental heating system responds within a time frame which is faster than other methods which may be employed to achieve the same or similar objectives. In particular, in preferred embodiments of the present invention pressure and temperature measurements of refrigerant exiting the evaporative cold plate are employed to control the turning on of supplemental electrical resistive heating elements to make up for thermal dissipation fluctuations occurring in the electronic module. The supplemental heat may be provided either with a single flat element or through the use of in-line heating elements.

Abstract: A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use of direct air cooling. The thermosyphon cooling system repositions the air cooling aspect of its cooling function to an exterior cabinet location distant from the circuit modules which can therefore be placed more closely together to shorten signal paths.

Abstract: A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from a computer system. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, pre-designed load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided. In one embodiment, the cooling system includes a refrigeration cooled cold plate thermally coupled to an electronic module of a computer system, and an auxiliary air cooled heat sink thermally coupled to the refrigeration cooled cold plate.

Abstract: Redundant humidity control mechanisms are provided for electronic systems which are cooled to temperatures below the dew point temperature of the ambient environment in which the systems are present. In particular, system environment is controlled in an overall fashion by providing a thermally insulating and substantially sealed enclosure for containing both air coolable and refrigerant coolable components. Humidity control and cooling are both provided in a redundant fashion to ensure reliability of service and availability of the components which are being cooled. Both desiccant-based and refrigeration-based humidity control mechanisms are provided. The present invention also includes embodiments in which multiple heat exchange fluids are employed.

Abstract: A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from computer systems. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, predesigned load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided.

Abstract: A redundant refrigeration system is used in conjunction with a dual passage cold plate to provide reliable cooling for electronic circuit modules particularly to such modules which incorporate computer processors for which long term "up time" is very highly desirable. Separate compressor-expansion device-condenser refrigeration systems are coupled to a single cold plate which maintains flow-wise isolation between refrigerant streams while at the same time providing close thermal coupling.

Abstract: A notebook or laptop style computer includes a visor which is attached to an upper edge of the screen. This visor includes electrical circuit components which typically have higher thermal load demands. The visor provides a mechanism for cooling these chips, particularly microprocessor chips. The system provides two related advantages, the first being placement of hot components in an area which is ideal for convective and radiational cooling. A second advantage is the removal of these components from the base unit which now contains other circuit components which are not subjected to high temperatures due to the presence of the components which have been removed and placed in or on the visor.

Abstract: A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from computer systems. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, predesigned load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided.

Abstract: A cabinet with air inlet and exhaust openings includes one or more air-moving devices for the air cooling of circuit cards contained within the cabinet. The circuit cards are insertable into a board (back plane) which also contains an electronic circuit module which is cooled by at least one refrigeration system which may also be disposed within a portion of the cabinet. In one embodiment, a portion of the exhaust air stream is used to also cool a condenser portion of the refrigeration system. The refrigeration system is preferably a dual/redundant system with two distinct coolant loops passing through a single cold plate in contact with the circuit module.

Abstract: A thermosyphon system employs a flat evaporator which is matched to its function of cooling vertically oriented electronic circuit modules. The evaporator is connected in a thermosyphon system which facilitates air cooling and the closer spacing of electronic components whose immediate volume region is not occupied by cooling system components. The evaporator is configured to provide a uniform flow of fluid returned to it to avoid module hot spots.

Abstract: A cold plate includes two flow-wise isolated coolant (or refrigerant) passages (or sets of passages) for use in conjunction with separate refrigeration systems. The cold plate passages do not permit flow communication between distinct coolant (or refrigerant) paths. This permits two distinct cooling systems to operate in a redundant manner. Nonetheless, flow isolation is achieved while still maintaining tight thermal coupling between each path and the object, such as an electronic computer processor module, to be cooled.