Abstract: A back-to-back double-flow bi-directional thrust-balanced micro-impeller for use in optimized compression cycles of small volumetric flow rates is provided. The back-to-back micro-impeller is a component of a compressor capable of generating a pressure head suitable for maintaining the flow rate needed for dissipating heat, such as produced by an electronic component. The back-to-back micro-impeller provides a fluid path on both sides of the micro-impeller, imparting an equal momentum (or velocity) to the fluid. The left and right compressor sections provide a balancing of forces generated by high-pressure fluid against the two sides of the micro-impeller. This reduces vibrational forces and provides a balancing force on the shaft which reduces the thrust on the shaft in a direction away from the gas flow path. Also, the approximately equally distributed mass about the rotation axis X, provides for a balanced impeller which is desirable when operated at high rotation speeds.

Abstract: A process is described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. A thin diamond layer is formed on a sacrificial wafer, and an integrated circuit is then formed on the thin diamond layer. The sacrificial wafer is then removed to expose the thin diamond layer. The resulting combination wafer is subsequently diced into individual dies. Each die has an exposed diamond layer forming the majority of the die and serving to conduct heat from the integrated circuit to a backside of the die, from where the heat can convect or be conducted away from the die.

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal interface formed of diamond, a diamond composite, or graphite. In an embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material and a second portion made from a second material. One edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion. In some forms, the first portion of the fin is a copper portion that is thermally coupled to a copper base to conduct thermal energy away from the base, and the second portion of the fin is aluminum.

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal spreader formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS and/or to the die through soldering or through a room temperature surface activated bonding (SAB) process. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal interface formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: Embodiments in accordance with the present invention provides active thermal management of the heat generated at localized hot spots on the microelectronic die by using fluid impingement cooling. The combination of orifices constructed using piezoelectric microelectromechanical systems (MEMs) technology, fluid impingement for maximizing the heat transfer coefficient, and embedded thermal diodes within the microelectronic die for measuring local temperature, to produce an active, closed-loop flow-control system for managing hot spots. A small reservoir of fluid is stationed a small distance above the die. The base of the reservoir has an array of piezoelectric orifices embedded within it, and positioned over the hotspot(s). The piezoelectric orifices can be opened and closed depending on the voltage applied.

Abstract: A computer system is described having additional cooling capabilities in a docking station for a mobile computer. The docking station includes P- and N-doped semiconductor thermoelectric components. The thermoelectric components are connected in series when the mobile computer engages with the docking station. A current flowing through a doped semiconductor causes heat to be transferred either in a direction of a current through the semiconductor component or in a direction opposite to a current in the thermoelectric components, depending on their doping. The thermoelectric components alternate from being P-doped to N-doped and the direction in which current flows alternates accordingly so that heat is transferred in one direction only. A heat pumping effect is created by the thermoelectric components which does not require high-pressure contact upon engagement of the mobile computer with the docking station.

Abstract: The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

Abstract: A phase change heat exchanger and method for cooling a heat dissipating electronic component, such as an electronics package, transfers heat from the electronic component by way of a heatsink including a base in heat conducting relation with the electronic component and fins arranged in heat conducting relation at one end thereof with the base. The efficiency of the fins is increased by also transferring heat from the base to the fins at a location spaced from the one end thereof using a phase change fluid separated from the fins. A chamber containing the phase change fluid is defined between two telescoping tubes which extend peripherally about the fins to form a tunnel or duct through which a cooling fluid such as air can be flowed in contact with the fins. A further increase in cooling efficiency is obtained using an additional remote heat exchangers attached to the surface of the chamber.

Abstract: A method of preparing a diamond body, and a diamond body thus prepared. A covering layer is provided on at least one surface of the diamond body such that the covering layer adheres to the at least one surface. The covering layer is in turn provided with a predetermined configuration.

Abstract: A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.

Abstract: A method and apparatus for cooling a portable computer system using a computer cooler with a cold plate that comes into contact with the portable computer system to transfer heat from the portable computer system to the environment surrounding the computer cooler.

Abstract: A phase change beat exchanger and method for cooling a heat dissipating electronic component, such as an electronics package, transfers heat from the electronic component by way of a heatsink including a base in heat conducting relation with the electronic component and fins arranged in heat conducting relation at one end thereof with the base. The efficiency of the fins is increased by also transferring heat from the base to the fins at a location spaced from the one end thereof using a phase change fluid separated from the fins. A chamber containing the phase change fluid is defined between two telescoping tubes which extend peripherally about the fins to form a tunnel or duct through which a cooling fluid such as air can be flowed in contact with the fins. A further increase in cooling efficiency is obtained using an additional remote heat exchangers attached to the surface of the chamber.

Abstract: A heat sink, is made to have a decreased thermal resistance (sink to ambient heat dissipation) and increased heat transfer coefficient by reducing the thickness of the thermal boundary layer. The heat sink includes a thermally conductive base and a plurality of fins extending from a surface of the thermally conductive base. The fins are made of a thermally conductive mesh material. Alternatively, the heat sink can include a thermally conductive base and a plurality of pins extending perpendicularly from a surface of the thermally conductive base, the plurality of pins being made of a thermally conductive material, and being arranged in a plurality of rows, and a plurality of wires extending parallel to the thermally conductive base, each of the wires connecting the pins of one of the plurality of rows.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

Abstract: A heat dissipation device including a heat spreader or support structure having a first surface and a second surface with a flange extending from the heat spreader second surface. A heat exchanger is disposed within a housing and the housing is attached to the flange.