Abstract: A fluid filtration assembly for a dishwasher system includes at least one spray arm assembly configured to distribute fluid within a wash chamber, and a filter assembly including a filter body defining a fluid inlet and a soil outlet thereon. A soil collection chamber is coupled in flow communication with the soil outlet and is configured to receive soil filtered by the filter assembly. A pump is configured to direct fluid to one of the spray arm assembly and the soil collection chamber. A valve assembly is movable between a first position and a second position. The valve assembly is coupled in flow communication with the spray arm assembly and the soil collection chamber. In the first position, the pump is configured to direct fluid to the at least one spray arm assembly. In the second position, the pump is configured to direct fluid into the soil collection chamber.

Abstract: Passivated semiconductor nanoparticles and methods for the fabrication and use of passivated semiconductor nanoparticles is provided herein.

Abstract: The present invention relates to cellobiohydrolase variants having improved thermostability and/or thermoactivity in comparison to wild-type Myceliophthora thermophila CBH2b.

Abstract: Ultra-thin semiconductor devices, including piezo-resistive sensing elements can be formed a wafer stack that facilitates handling many thin device dice at a wafer level. Three embodiments are provided to form the thin dice in a wafer stack using three different fabrication techniques that include anodic bonding, adhesive bonding and fusion bonding. A trench is etched around each thin die to separate the thin die from others in the wafer stack. A tether layer, also known as a tether, is used to hold thin dice or dice in a wafer stack. Such as wafer stack holds many thin dice together at a wafer level for handling and enables easier die picking in packaging processes.

Abstract: Ultra-thin semiconductor devices, including piezoresistive sensing elements can be formed in a wafer stack that facilitates handling many thin device dice at a wafer level. Three embodiments are provided to form the thin dice in a wafer stack using three different fabrication techniques that include anodic bonding, adhesive bonding and fusion bonding. A trench is etched around each thin die to separate the thin die from others in the wafer stack. A tether layer, also known as a tether, is used to hold thin dice or dice in a wafer stack. Such as wafer stack holds many thin dice together at a wafer level for handling and enables easier die picking in packaging processes.

Abstract: Ultra-thin semiconductor devices, including piezoresistive sensing elements can be formed in a wafer stack that facilitates handling many thin device dice at a wafer level. Three embodiments are provided to form the thin dice in a wafer stack using three different fabrication techniques that include anodic bonding, adhesive bonding and fusion bonding. A trench is etched around each thin die to separate the thin die from others in the wafer stack. A tether layer, also known as a tether, is used to hold thin dice or dice in a wafer stack. Such as wafer stack holds many thin dice together at a wafer level for handling and enables easier die picking in packaging processes.

Abstract: A seatback-motion controller in accordance with the present disclosure is mounted on a vehicle seat in a vehicle. The vehicle seat includes a seat base and a seat back mounted for pivotable movement relative to the seat base between an upright use position and a forward-leaning easy-entry position.

Abstract: An apparatus to indicate unauthorized manipulation of at least one protected device enclosed in a housing is provided. The apparatus includes a structure attached to a first portion of the housing and a token switch attached to a second portion of the housing. The token switch is operably positioned with reference to the structure. The token switch includes a plunger, and a register programmed with a value. The register is communicatively coupled with a processor in a circuit. The circuit is communicatively coupled to drive the device. The structure, the token switch, and the circuit are internal to the housing when the housing is in a closed position. The plunger and the structure are positioned to generate a current when the housing is opened. The programmed value in the register is changed by the generated current and the processor takes an action responsive to the change in the programmed value.

Abstract: This disclosure generally relates to stabilizing energy provided by an energy source, and more particularly to systems and methods for using multiple types of energy storage devices to selectively capture and provide energy. An energy source provides energy, and the energy storage devices selectively capture energy provided by the energy source in excess of an immediate energy requirement of a load and selectively provide energy when the immediate energy requirement of the load exceeds the energy provided by the energy source.

Abstract: This disclosure generally relates to stabilizing energy provided by an energy source, and more particularly to systems and methods for using multiple types of energy storage devices to selectively capture and provide energy. An energy source provides energy, and the energy storage devices selectively capture energy provided by the energy source in excess of an immediate energy requirement of a load and selectively provide energy when the immediate energy requirement of the load exceeds the energy provided by the energy source.

Abstract: Ultra-thin semiconductor devices, including piezoresistive sensing elements can be formed in a wafer stack that facilitates handling many thin device dice at a wafer level. Three embodiments are provided to form the thin dice in a wafer stack using three different fabrication techniques that include anodic bonding, adhesive bonding and fusion bonding. A trench is etched around each thin die to separate the thin die from others in the wafer stack. A tether layer, also known as a tether, is used to hold thin dice or dice in a wafer stack. Such as wafer stack holds many thin dice together at a wafer level for handling and enables easier die picking in packaging processes.

Abstract: The present disclosure provides engineered transaminase enzymes having improved properties as compared to a naturally occurring wild-type transaminase enzyme. Also provided are polynucleotides encoding the engineered transaminase enzymes, host cells capable of expressing the engineered transaminase enzymes, and methods of using the engineered transaminase enzymes to synthesize a variety of chiral compounds.

Abstract: Series interconnection of optoelectronic device modules is disclosed. Each device module includes an active layer disposed between a bottom electrode and a transparent conducting layer. An insulating layer is disposed between the bottom electrode of a first device module and a backside top electrode of the first device module. One or more vias are formed through the active layer, transparent conducting layer and insulating layer of the first device module. Sidewalls of the vias are coated with an insulating material such that a channel is formed through the insulating material to the backside top electrode of the first device module. The channel is at least partially filled with an electrically conductive material to form a plug that makes electrical contact between the transparent conducting layer and the backside top electrode of the first device module.

Abstract: An inertial measurement unit is described that includes a first subassembly comprising one or more inertial sensors, a second subassembly comprising support electronics for the one or more inertial sensors, and at least one pair of mating connectors configured to provide an interface between the first subassembly and the second subassembly.

Abstract: A system and method for placing a live, interactive, product specific communication conduit on user desktops. A retailer, wholesaler, or any other type of provider of goods or services having a website describing one or more products selects specific products for which the retailer desires to enable direct communication with consumers. The display of the selected products on the retailer's website are marked with an identifiable label, for example, the text “Grab-It”. Consumers are enabled to drag and drop the display of the product to their desktop, creating an interactive icon (also referred to herein as a “satellite icon”.) The interactive icon supports two-way messaging between the retailer and the consumer. The retailer is enabled to push content regarding the selected content, for example, product specific advertising to the icon for display. The consumer is enabled to request information or periodic updates regarding the product through the icon.

Abstract: A fluid filtration assembly for a dishwasher system includes at least one spray arm assembly configured to distribute fluid within a wash chamber, and a filter assembly including a filter body defining a fluid inlet and a soil outlet thereon. A soil collection chamber is coupled in flow communication with the soil outlet and is configured to receive soil filtered by the filter assembly. A pump is configured to direct fluid to one of the spray arm assembly and the soil collection chamber. A valve assembly is movable between a first position and a second position. The valve assembly is coupled in flow communication with the spray arm assembly and the soil collection chamber. In the first position, the pump is configured to direct fluid to the at least one spray arm assembly. In the second position, the pump is configured to direct fluid into the soil collection chamber.

Abstract: A high-resolution image is generated using multiple spatially offset lower-resolution digital micro-mirror device (DMD) panels. Multiple lower-resolution subframe signals for controlling the spatial light modulators are generated from a high-resolution image signal using a resolution reduction and interpolation algorithm. The spatial light modulators under control of the subframe signals are illuminated by a light source and light beams reflected from the spatial light modulators are combined and directed onto a screen for display.

Abstract: An illumination module may provide light in a plurality of colors including Red-Green-Blue (RGB) light and/or white light. The light from the illumination module may be directed to a 3LCD system, a Digital Light Processing (DLP®) system, a Liquid Crystal on Silicon (LCoS) system, or other micro-display or micro-projection systems. In one embodiment the illumination module includes a laser configured to produce an optical beam at a first wavelength, a planar lightwave circuit coupled to the laser and configured to guide the optical beam, and a waveguide optical frequency converter coupled to the planar lightwave circuit and configured to receive the optical beam at the first wavelength, convert the optical beam at the first wavelength into an output optical beam at a second wavelength, and may provide optically coupled feedback which is nonlinearly dependent on a power of the optical beam at the first wavelength to the laser.

Abstract: Switchable power combining is provided using a tunable arrayed waveguide grating (AWG) as the combining element. The AWG has two or more inputs and two or more outputs. Each AWG input is bi-directionally coupled to a corresponding laser source, and each laser source has substantially the same gain spectrum. All sources are coupled to a selected one of the AWG outputs, without substantial coupling of the sources to any other AWG output. The AWG is tunable, such that any one of its outputs can be thus selected. The selected output provides optical feedback, thereby feedback stabilizing the emission wavelengths of the sources to values suitable for single-mode combining. According to a further aspect of the invention, a piezo-electrically tunable AWG is provided. The AWG has a piezo-electric transducer bonded to the waveguide array section of the AWG. Strain induced in the waveguide array by the transducer can alter optical path lengths of the waveguide, thereby tuning the AWG.

Abstract: Series interconnection of optoelectronic device modules is disclosed. Each device module includes an active layer disposed between a bottom electrode and a transparent conducting layer. An insulating layer is disposed between the bottom electrode of a first device module and a backside top electrode of the first device module. One or more vias are formed through the active layer, transparent conducting layer and insulating layer of the first device module. Sidewalls of the vias are coated with an insulating material such that a channel is formed through the insulating material to the backside top electrode of the first device module. The channel is at least partially filled with an electrically conductive material to form a plug that makes electrical contact between the transparent conducting layer and the backside top electrode of the first device module.