Abstract: A display apparatus includes a backlight, a first polarizer, a light controlling panel, a second polarizer, a display panel, and a third polarizer sequentially arranged along a direction. A transmission axis of the first polarizer and a transmission axis of the second polarizer are substantially parallel, and the transmission axis of the second polarizer and a transmission axis of the third polarizer are substantially perpendicular. A set of the first polarizer, the light controlling panel, and the second polarizer has a transmittance, and the transmittance has a maximum value when the light controlling panel is not enabled.

Abstract: A display apparatus includes a backlight, a first polarizer, a light controlling panel, a second polarizer, a display panel, and a third polarizer sequentially arranged along a direction. A transmission axis of the first polarizer and a transmission axis of the second polarizer are substantially parallel, and the transmission axis of the second polarizer and a transmission axis of the third polarizer are substantially perpendicular. A set of the first polarizer, the light controlling panel, and the second polarizer has a transmittance, and the transmittance has a maximum value when the light controlling panel is not enabled.

Abstract: A biomimetic system is provided for evaluating an effect of a test sample in vitro, and includes at least one organ chip, at least one medium container, a liquid pump, a nebulizer, a gas pump, and a chamber device. The liquid pump is provided to drive a liquid medium in the medium container to flow into a lower sub-channel of the organ chip and then to be discharged back into the medium container. The nebulizer is provided for atomizing a test solution including the test sample into an aerosol. The gas pump is provided to generate a pressurized gas which force the aerosol to flow out of a chamber of the chamber device and then to flow through an upper sub-channel of the organ chip.

Abstract: A chip package including an integrated circuit component, a thermal conductive layer, an insulating encapsulant and a redistribution circuit structure is provided. The integrated circuit component includes an amorphous semiconductor portion located at a back surface thereof. The thermal conductive layer covers the amorphous semiconductor portion of the integrated circuit component, wherein thermal conductivity of the thermal conductive layer is greater than or substantially equal to 10 W/mK. The insulating encapsulant laterally encapsulates the integrated circuit component and the thermal conductive layer. The redistribution circuit structure is disposed on the insulating encapsulant and the integrated circuit component, wherein the redistribution circuit structure is electrically connected to the integrated circuit component.

Abstract: A chip package including an integrated circuit component, a thermal conductive layer, an insulating encapsulant and a redistribution circuit structure is provided. The integrated circuit component includes an amorphous semiconductor portion located at a back surface thereof. The thermal conductive layer covers the amorphous semiconductor portion of the integrated circuit component, wherein thermal conductivity of the thermal conductive layer is greater than or substantially equal to 10 W/mK. The insulating encapsulant laterally encapsulates the integrated circuit component and the thermal conductive layer. The redistribution circuit structure is disposed on the insulating encapsulant and the integrated circuit component, wherein the redistribution circuit structure is electrically connected to the integrated circuit component.

Abstract: The present invention provides a polarizer module and an operation method thereof. The polarizer module includes a bifacial reflective polarizer, a first liquid crystal layer, a second liquid crystal layer, a first polarizer, and a second polarizer. The bifacial reflective polarizer has a first surface and a second surface opposite to each other. The first liquid crystal layer and the second liquid crystal layer are disposed on the first surface and the second surface respectively. The first polarizer and the second polarizer are disposed on the first liquid crystal layer and the second liquid crystal layer respectively.

Abstract: A clock circuit has a clock input terminal, a first clock output terminal, and a second clock output terminal. The clock circuit includes a pulse width adjustment module, a sampling module, a comparing module, and a differential signal converting module. A differential input terminal is electrically connected to a pulse width output terminal of the pulse width adjustment module. A positive differential signal output terminal and a negative differential signal output terminal are electrically connected to the first clock output terminal of the clock circuit and the second clock output terminal to output two clock signals with a phase difference of 180 degrees, respectively. A second input terminal of the sampling module is electrically connected to the second clock output terminal.

Abstract: A clock circuit has a clock input terminal, a first clock output terminal, and a second clock output terminal. The clock circuit includes a pulse width adjustment module, a sampling module, a comparing module, and a differential signal converting module. A differential input terminal is electrically connected to a pulse width output terminal of the pulse width adjustment module. A positive differential signal output terminal and a negative differential signal output terminal are electrically connected to the first clock output terminal of the clock circuit and the second clock output terminal to output two clock signals with a phase difference of 180 degrees, respectively. A second input terminal of the sampling module is electrically connected to the second clock output terminal.

Abstract: A chip package including an integrated circuit component, a thermal conductive layer, an insulating encapsulant and a redistribution circuit structure is provided. The integrated circuit component includes an amorphous semiconductor portion located at a back surface thereof. The thermal conductive layer covers the amorphous semiconductor portion of the integrated circuit component, wherein thermal conductivity of the thermal conductive layer is greater than or substantially equal to 10 W/mK. The insulating encapsulant laterally encapsulates the integrated circuit component and the thermal conductive layer. The redistribution circuit structure is disposed on the insulating encapsulant and the integrated circuit component, wherein the redistribution circuit structure is electrically connected to the integrated circuit component.

Abstract: A structure includes a first package component, and a second package component over and bonded to the first package component. A supporting material is disposed in a gap between the first package component and the second package component. A molding material is disposed in the gap and encircling the supporting material.

Abstract: A light emitting device is disclosed and defined with a plurality of light emitting regions. The light emitting device includes a first electrode layer, a second electrode layer, an organic material layer, and an insulating material layer formed between the first and second electrode layers. The light emitting regions are exposed from the insulating material layer, and have different areas. Regions of the first electrode layer corresponding in position to the light emitting regions have the same areas, or regions of the organic material layer corresponding in position to the light emitting regions have the same areas. Voltages applied across the first electrode layer and the second electrode layer corresponding in position to the light emitting regions are the same. The light emitting device displays grayscale or color images.

Abstract: The present invention discloses a housing structure having a conductive adhesive antenna and the conductive adhesive antenna thereof, wherein the housing structure having the conductive adhesive antenna comprises a housing and an electrically conductive adhesive. The housing has two units which can be integrated with each other to form a bonding portion. The electrically conductive adhesive is bonded on the bonding portion and has at least one electrical connection end for electrically connecting with a wireless module, thereby the electrically conductive adhesive is also formed as an antenna structure. With the implementation of the present invention, the conductive adhesive antenna can replace a prior antenna.

Abstract: A light emitting device is disclosed, including a first electrode layer, a second electrode layer, and an organic light emitting layer sandwiched between the first and second electrode layers. The second electrode layer is patterned to form a plurality of electrode patterns arranged with different densities. The organic light emitting layer is subjected to a color separation process to form a plurality of monochromatic blocks that correspond to the electrode patterns, respectively. The electrode patterns are divided into a plurality of electrode pattern groups arranged in an alternate manner. The electrode pattern groups display a same image, and a same voltage is applied to the electrode pattern groups at a same time. Alternatively, the electrode pattern groups display different images, and a same or different voltages are applied to the electrode pattern groups at different times. As such, the light emitting device generates grayscale, full-color, three-dimensional or dynamic images.

Abstract: A package includes a package substrate, which includes a middle layer selected from the group consisting of a core and a middle metal layer, a top metal layer overlying the middle layer, and a bottom metal layer underlying the middle layer. All metal layers overlying the middle layer have a first total metal density that is equal to a sum of all densities of all metal layers over the middle layer. All metal layers underlying the middle layer have a second total metal density that is equal to a sum of all densities of all metal layers under the middle layer. An absolute value of a difference between the first total metal density and the second total metal density is lower than about 0.1.

Abstract: The present invention provides a method of manufacturing a waveguide assembly and a structure thereof, wherein the manufacturing method comprises the steps of: providing at least two waveguide units and combining the waveguide units, wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and at least one adhesive is applied to the bonding portion to combine the waveguide units into the waveguide assembly. With the practice of the present invention, many advanced functions such as rapid design, rapid manufacture, rapid verification and cost reduction can be achieved.

Abstract: An integrated circuit (IC) packaging substrate includes a main body, at least one first conductive line, at least one second conductive line, and at least one protrusion pad. The first conductive line is embedded in the main body. The second conductive line is embedded in the main body. The protrusion pad is disposed on the first conductive line. The protrusion pad protrudes from the main body and is configured to be in electrical contact with a solder portion of a semiconductor chip. A first spacing between the protrusion pad and the second conductive line is determined in accordance with a process deviation of the protrusion pad by the width of the protrusion pad and the width of the first conductive line. Moreover, a semiconductor package having the IC packaging substrate and a manufacturing method of the semiconductor package are also provided.

Abstract: The present invention provides a panorama image capturing device and a panorama image capturing module thereof. The panorama image capturing module includes a lens structure, an optical structure, a single image sensing chip, and a single image signal processor. The lens structure includes a first lens assembly for capturing a first predetermined image light source, and a second lens assembly for capturing a second predetermined image light source. The optical structure is disposed between the first lens assembly and the second lens assembly. The single image sensing chip has a first image sensing region for receiving the first predetermined image light source through the optical structure, and a second image sensing region for receiving the second predetermined image light source through the optical structure. The first and the second predetermined image light sources are processed by the single image signal processor for obtaining a panorama image.

Abstract: The present invention provides an image processing method for immediately producing panoramic images. In this method, two fish-eye cameras are used for capturing video information, and then, a streaming video is transmitted to an electronic device by wired or wireless technology after the video information is treated with a video encoding process and a streaming process. Therefore, an image processing application program installed in the electronic device is able to subsequently treat the streaming video with a video encoding process, a panoramic coordinates converting process, an image stitching process, and an edge-preserving smoothing process in turns, so as to eventually show a sphere panorama on the display of the electronic device. Moreover, by the utilization of a digital signal processor, the image processing application program is able to further process the sphere panorama to a plain panorama, a fisheye panorama, or a human-eye panorama.

Abstract: A light emitting element is disclosed. The light emitting element includes a substrate, a metal layer and a metal electrode stacked on the substrate, and an organic material layer formed between the metal layer and the metal electrode. The metal layer includes a metal film and a plurality of metal particles having a size ranging from 5 nm to 25 nm and spaced apart from the metal electrode at a distance ranging between 75 nm and 130 nm. The organic material layer can generate light having chromaticity within a first range. When a voltage is applied across the metal layer and the metal electrode, a plasmon coupling occurs between the metal layer and the metal electrode, such that the chromaticity of the light generated by the organic material layer can be shifted from the first range to a second range.

Abstract: The present invention provides a method of manufacturing a waveguide assembly and a structure thereof, wherein the manufacturing method comprises the steps of: providing at least two waveguide units and combining the waveguide units, wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and at least one adhesive is applied to the bonding portion to combine the waveguide units into the waveguide assembly. With the practice of the present invention, many advanced functions such as rapid design, rapid manufacture, rapid verification and cost reduction can be achieved.