Patents by Inventor Guo-cheng Liao
Guo-cheng Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230402738Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.Type: ApplicationFiled: August 8, 2023Publication date: December 14, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Guo-Cheng LIAO, Yi Chuan DING
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Patent number: 11721884Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.Type: GrantFiled: April 5, 2021Date of Patent: August 8, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Guo-Cheng Liao, Yi Chuan Ding
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Patent number: 11670836Abstract: A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.Type: GrantFiled: October 29, 2020Date of Patent: June 6, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ting Ruei Chen, Hung-Hsiang Cheng, Guo-Cheng Liao, Yun-Hsiang Tien
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Patent number: 11404799Abstract: A semiconductor device package includes a substrate, a support structure and a first antenna. The substrate has a first surface and a second surface opposite to the first surface. The support structure is disposed on the first surface of the substrate. The first antenna is disposed on the support structure. The first antenna has a first surface facing the substrate, a second surface opposite to the first surface and a lateral surface extending between the first surface and a second surface of the first antenna. The lateral surface of the first antenna is exposed to the external of the semiconductor device package. The first antenna includes a dielectric layer and an antenna pattern disposed within the dielectric layer and penetrating the dielectric layer.Type: GrantFiled: October 24, 2019Date of Patent: August 2, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ting Ruei Chen, Guo-Cheng Liao
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Patent number: 11362049Abstract: A semiconductor device package includes a first surface and a second surface opposite to the first surface. The semiconductor device package further includes a first supporting structure disposed on the first surface of the substrate and a second supporting structure disposed on the first surface of the substrate. The first supporting structure has a first surface spaced apart from the first surface of the substrate by a first distance. The second supporting structure has a first surface spaced apart from the first surface of the substrate by a second distance. The second distance is different from the first distance. The semiconductor device package further includes a first antenna disposed above the first surface of the substrate. The first antenna is supported by the first surface of the first supporting structure and the first surface of the second supporting structure.Type: GrantFiled: December 31, 2019Date of Patent: June 14, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Guo-Cheng Liao, Yi Chuan Ding
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Publication number: 20220140467Abstract: A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.Type: ApplicationFiled: October 29, 2020Publication date: May 5, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ting Ruei CHEN, Hung-Hsiang CHENG, Guo-Cheng LIAO, Yun-Hsiang TIEN
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Patent number: 11296001Abstract: A package substrate includes a first dielectric layer, a first patterned conductive layer and a first set of alignment marks. The first patterned conductive layer is disposed on the first dielectric layer. The first set of alignment marks is disposed on the first dielectric layer and adjacent to a first edge of the first dielectric layer. The first set of alignment marks includes a plurality of alignment marks. Distances between the alignment marks of the first set of alignment marks and the first edge are different from each other.Type: GrantFiled: October 3, 2019Date of Patent: April 5, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Guo-Cheng Liao, Yi Chuan Ding
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Patent number: 11217509Abstract: Present disclosure provides a lead frame, including a die paddle and a plurality of leads surrounding the die paddle. Each of the leads including a finger portion proximal to the die paddle and a lead portion distal from the die paddle. The finger portion includes a main body and at least one support structure. The respective support structures on adjacent leads are mutually isolated, and a distance between the support structure and the die paddle is smaller than a distance between the lead portion and the die paddle. A semiconductor package structure including the lead frame described herein and a semiconductor package assembly including the semiconductor package structure described herein are also provided.Type: GrantFiled: January 22, 2020Date of Patent: January 4, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jyun-Chi Jhan, Guo-Cheng Liao
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Patent number: 11107777Abstract: A substrate structure includes a substrate body, a bottom circuit layer, a first bottom protection structure and a second bottom protection structure. The substrate body has a top surface and a bottom surface opposite to the top surface. The bottom circuit layer is disposed adjacent to the bottom surface of the substrate body, and includes a plurality of pads. The first bottom protection structure is disposed on the bottom surface of the substrate body, and covers a portion of the bottom circuit layer. The second bottom protection structure is disposed on the bottom surface of the substrate body, and covers a portion of the bottom circuit layer. A second thickness of the second bottom protection structure is greater than a first thickness of the first bottom protection structure.Type: GrantFiled: May 22, 2019Date of Patent: August 31, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Guo-Cheng Liao, Yi Chuan Ding
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Publication number: 20210225741Abstract: A lead frame includes a die paddle, a first lead, a second lead, an extending portion and at least one supporting portion. The first lead includes a first main portion and a first I/O portion opposite to the first main portion. The second lead includes a second main portion and a second I/O portion opposite to the second main portion. The first lead and the second lead surround the die paddle. The extending portion extends from the first main portion of the first lead. The supporting portion is connected to the extending portion.Type: ApplicationFiled: January 22, 2020Publication date: July 22, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: I-Jen CHEN, Guo-Cheng LIAO, Jyun-Chi JHAN, Hui-Chen HSU
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Publication number: 20210226317Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure.Type: ApplicationFiled: April 5, 2021Publication date: July 22, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Guo-Cheng LIAO, Yi Chuan DING
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Publication number: 20210225742Abstract: Present disclosure provides a lead frame, including a die paddle and a plurality of leads surrounding the die paddle. Each of the leads including a finger portion proximal to the die paddle and a lead portion distal from the die paddle. The finger portion includes a main body and at least one support structure. The respective support structures on adjacent leads are mutually isolated, and a distance between the support structure and the die paddle is smaller than a distance between the lead portion and the die paddle. A semiconductor package structure including the lead frame described herein and a semiconductor package assembly including the semiconductor package structure described herein are also provided.Type: ApplicationFiled: January 22, 2020Publication date: July 22, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jyun-Chi JHAN, Guo-Cheng LIAO
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Publication number: 20210202410Abstract: A semiconductor device package includes a first surface and a second surface opposite to the first surface. The semiconductor device package further includes a first supporting structure disposed on the first surface of the substrate and a second supporting structure disposed on the first surface of the substrate. The first supporting structure has a first surface spaced apart from the first surface of the substrate by a first distance. The second supporting structure has a first surface spaced apart from the first surface of the substrate by a second distance. The second distance is different from the first distance. The semiconductor device package further includes a first antenna disposed above the first surface of the substrate. The first antenna is supported by the first surface of the first supporting structure and the first surface of the second supporting structure.Type: ApplicationFiled: December 31, 2019Publication date: July 1, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Guo-Cheng LIAO, Yi Chuan DING
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Publication number: 20210125945Abstract: A semiconductor device package includes a substrate, a support structure and a first antenna. The substrate has a first surface and a second surface opposite to the first surface. The support structure is disposed on the first surface of the substrate. The first antenna is disposed on the support structure. The first antenna has a first surface facing the substrate, a second surface opposite to the first surface and a lateral surface extending between the first surface and a second surface of the first antenna. The lateral surface of the first antenna is exposed to the external of the semiconductor device package. The first antenna includes a dielectric layer and an antenna pattern disposed within the dielectric layer and penetrating the dielectric layer.Type: ApplicationFiled: October 24, 2019Publication date: April 29, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ting Ruei CHEN, Guo-Cheng LIAO
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Patent number: 10971798Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.Type: GrantFiled: April 4, 2019Date of Patent: April 6, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Guo-Cheng Liao, Yi Chuan Ding
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Patent number: 10847470Abstract: A semiconductor package structure includes a first conductive structure, a second conductive structure, a first semiconductor component, a second semiconductor component and a first encapsulant. The first semiconductor component is disposed on the first conductive structure. The first conductive structure includes a first redistribution layer. The second semiconductor component is disposed on the second conductive structure. The second conductive structure includes a second redistribution layer, and the first conductive structure is electrically connected to the second conductive structure. The first encapsulant covers the first semiconductor component and the first conductive structure. A lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.Type: GrantFiled: February 5, 2018Date of Patent: November 24, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Guo-Cheng Liao, Chia Ching Chen, Yi Chuan Ding
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Publication number: 20200127366Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure.Type: ApplicationFiled: April 4, 2019Publication date: April 23, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Guo-Cheng LIAO, Yi Chuan DING
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Publication number: 20200126881Abstract: A package substrate includes a first dielectric layer, a first patterned conductive layer and a first set of alignment marks. The first patterned conductive layer is disposed on the first dielectric layer. The first set of alignment marks is disposed on the first dielectric layer and adjacent to a first edge of the first dielectric layer. The first set of alignment marks includes a plurality of alignment marks. Distances between the alignment marks of the first set of alignment marks and the first edge are different from each other.Type: ApplicationFiled: October 3, 2019Publication date: April 23, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Guo-Cheng LIAO, Yi Chuan DING
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Publication number: 20190363056Abstract: A substrate structure includes a substrate body, a bottom circuit layer, a first bottom protection structure and a second bottom protection structure. The substrate body has a top surface and a bottom surface opposite to the top surface. The bottom circuit layer is disposed adjacent to the bottom surface of the substrate body, and includes a plurality of pads. The first bottom protection structure is disposed on the bottom surface of the substrate body, and covers a portion of the bottom circuit layer. The second bottom protection structure is disposed on the bottom surface of the substrate body, and covers a portion of the bottom circuit layer. A second thickness of the second bottom protection structure is greater than a first thickness of the first bottom protection structure.Type: ApplicationFiled: May 22, 2019Publication date: November 28, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Guo-Cheng LIAO, Yi Chuan DING
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Publication number: 20190244907Abstract: A semiconductor package structure includes a first conductive structure, a second conductive structure, a first semiconductor component, a second semiconductor component and a first encapsulant. The first semiconductor component is disposed on the first conductive structure. The first conductive structure includes a first redistribution layer. The second semiconductor component is disposed on the second conductive structure. The second conductive structure includes a second redistribution layer, and the first conductive structure is electrically connected to the second conductive structure. The first encapsulant covers the first semiconductor component and the first conductive structure. A lateral surface of the first conductive structure and a lateral surface of the first encapsulant are non-coplanar.Type: ApplicationFiled: February 5, 2018Publication date: August 8, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Guo-Cheng LIAO, Chia Ching CHEN, Yi Chuan DING