Patents by Inventor Guobiao Zhang

Guobiao Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210083670
    Abstract: A configurable processor singlet is a single die comprising monolithically integrated three-dimensional memory (3D-M) arrays and arithmetic-logic circuits (ALC's). The preferred singlet also comprises an array of configurable computing elements (CCE's). Each CCE comprises at least a 3D-M array, an ALC, and inter-storage-processor (ISP) connections.
    Type: Application
    Filed: October 8, 2020
    Publication date: March 18, 2021
    Applicant: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao ZHANG
  • Publication number: 20210082899
    Abstract: A discrete three-dimensional (3-D) processor comprises first and second dice. The first die comprises 3-D memory (3D-M) arrays, whereas the second die comprises logic circuits and at least an off-die peripheral-circuit component of the 3D-M array(s). The first die does not comprise the off-die peripheral-circuit component. The first and second dice are communicatively coupled by a plurality of inter-die connections. The preferred discrete 3-D processor can be applied to mathematical computing, computer simulation, configurable gate array, pattern processing and neural network.
    Type: Application
    Filed: November 15, 2020
    Publication date: March 18, 2021
    Applicant: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao ZHANG
  • Publication number: 20210083669
    Abstract: A configurable processor doublet comprises a pair of face-to-face bonded three-dimensional memory (3D-M) die and processing die. The 3D-M die comprises 3D-M arrays, whereas the processing die comprises arithmetic-logic circuits (ALC's). The preferred doublet also comprises an array of configurable computing elements (CCE's). Each CCE comprises at least a 3D-M array, an ALC, and inter-storage-processor (ISP) connections.
    Type: Application
    Filed: October 8, 2020
    Publication date: March 18, 2021
    Applicant: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao ZHANG
  • Patent number: 10937834
    Abstract: In a shared three-dimensional vertical memory (3D-MV), each horizontal address line comprises at least two regions: a lightly-doped region and a low-resistivity region. The lightly-doped region is formed around selected memory holes and shared by a plurality of low-leakage memory cells. The low-resistivity region forms a conductive network to reduce the resistance of the horizontal address line.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: March 2, 2021
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao Zhang
  • Publication number: 20210013162
    Abstract: A three-dimensional (3-D) module with integrated passive components includes a plurality of vertically stacked sub-modules. Each sub-module comprises a device level comprising a high-k dielectric (e.g. ceramic) material and an interconnect level comprising a low-k dielectric (e.g. organic) material. The passive components in the device level are fired integrally, whereas the device level and the interconnect level are fired independently.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 14, 2021
    Applicant: Southern University of Science and Technology
    Inventors: Guobiao ZHANG, Hongyu YU, Yuejin GUO, Shengming ZHOU, Guoxing ZHANG, Guangzhao LIU, Mingtao HU, Wang ZHANG
  • Patent number: 10848158
    Abstract: A configurable processor comprises at least an array of configurable computing elements (CCE's). Each CCE comprises at least a three-dimensional (3-D) memory (3D-M) array; an arithmetic logic circuit (ALC); and, a plurality of inter-storage-processor (ISP) connections. Not penetrating through any semiconductor substrate, the ISP-connections are short, small and numerous.
    Type: Grant
    Filed: November 24, 2019
    Date of Patent: November 24, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao Zhang
  • Publication number: 20200356345
    Abstract: A three-dimensional processor (3D-processor) for parallel computing includes a plurality of computing elements. Each computing element comprises at least a three-dimensional memory (3D-M) array for storing at least a portion of a look-up table (LUT) for a mathematical function and an arithmetic logic circuit (ALC) for performing arithmetic operations on the LUT data. Deficiency in latency is offset by a large scale of parallelism.
    Type: Application
    Filed: July 26, 2020
    Publication date: November 12, 2020
    Applicant: HangZhou HaiCun Information Technology Co., Ltd.
    Inventors: Guobiao ZHANG, Chen SHEN
  • Publication number: 20200350030
    Abstract: The present invention discloses a multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAMMB). It comprises a plurality of RRAM cells stacked above a semiconductor substrate. Each RRAM cell comprises a RRAM layer, which is switched from a high-resistance state to a low-resistance state during programming. By adjusting the programming current, the programmed RRAMs have different resistances.
    Type: Application
    Filed: July 6, 2020
    Publication date: November 5, 2020
    Applicant: Southern University of Science and Technology
    Inventors: Guobiao ZHANG, Hongyu YU, Yuejin GUO, Shengming ZHOU, Guoxing ZHANG, Guangzhao LIU, Mingtao HU, Wang ZHANG, Mei Shen, Yida Li, Xiaodong Xiang
  • Publication number: 20200287001
    Abstract: A GaN-on-Si output transistor array comprises a plurality of small monolithic output transistors. Multiple pieces of the small monolithic GaN films are grown epitaxially on the silicon substrate. Each small monolithic output transistor is formed in a respective small monolithic GaN film. The normal transistors are connected in serial, while the defective transistors are not connected.
    Type: Application
    Filed: May 25, 2020
    Publication date: September 10, 2020
    Applicant: HangZhou HaiCun Information Technology Co., Ltd.
    Inventors: Guobiao ZHANG, Peter Y. YU
  • Patent number: 10763861
    Abstract: The present invention discloses a processor comprising three-dimensional memory (3D-M) array (3D-processor). Instead of logic-based computation (LBC), the 3D-processor uses memory-based computation (MBC). It comprises an array of computing elements, with each computing element comprising an arithmetic logic circuit (ALC) and a 3D-M-based look-up table (3DM-LUT). The ALC performs arithmetic operations on the LUT data, while the 3DM-LUT is stored in at least one 3D-M array.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: September 1, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventors: Guobiao Zhang, Chen Shen
  • Patent number: 10737617
    Abstract: To detect front-parked vehicles at night (i.e. a vehicle is parked with its head facing the inside of a parking space), a detection device uses the light beam from a passing-by vehicle to extract at least a reflection of at least a tail light or at least a portion of a back bumper from an image captured for a parking space.
    Type: Grant
    Filed: September 8, 2019
    Date of Patent: August 11, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao Zhang
  • Patent number: 10714172
    Abstract: A bi-sided pattern processor comprises a plurality of storage-processing units (SPU's). Each of the SPU's comprises at least a memory array and a pattern-processing circuit. The preferred pattern processor further comprises a semiconductor substrate with opposing first and second surfaces. The memory array is disposed on the first surface, whereas the pattern-processing circuit is disposed on the second surface. The memory array stores patterns; the pattern-processing circuit processes these patterns; and, they are communicatively coupled by a plurality of inter-surface connections.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: July 14, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao Zhang
  • Patent number: 10706945
    Abstract: A double-biased three-dimensional one-time-programmable read-only memory (3D-OTP) comprises an OTP array stacked on a semiconductor substrate. The OTP array comprises a dummy word line, a plurality of data word lines and data bit lines. The dummy OTP cells at the intersections of the dummy word line and all data bit lines are unprogrammed. During read, both voltages on the dummy word line and a selected data word line are raised.
    Type: Grant
    Filed: September 9, 2018
    Date of Patent: July 7, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao Zhang
  • Patent number: 10704913
    Abstract: A positioning method using music pieces continuously provides positioning service. At each signature burst (i.e., a highly unique short musical segment suitable for positioning), sounds of a music piece are used for positioning. Between signature bursts, dead reckoning (DR) is used.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: July 7, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao Zhang
  • Patent number: 10707308
    Abstract: A GaN-on-Si output transistor array comprises a plurality of small monolithic output transistors. The substrate surface has multiple grids, upon which multiple pieces of the small monolithic GaN films are grown epitaxially on the silicon substrate. Each small monolithic output transistor is formed in a respective small monolithic GaN film. By disabling defective transistors, the overall yield/reliability is improved.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: July 7, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventors: Guobiao Zhang, Peter Y. Yu
  • Patent number: 10704914
    Abstract: A positioning method using music pieces continuously provides positioning service. At each signature burst (i.e., a highly unique short musical segment suitable for positioning), sounds of a music piece are used for positioning. Between signature bursts, dead reckoning (DR) is used.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: July 7, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao Zhang
  • Patent number: 10700686
    Abstract: A configurable computing array comprises at least an array of configurable interconnects, at least an array of configurable logic elements and at least an array of configurable computing elements. Each configurable computing element comprises at least a programmable memory for storing a look-up table (LUT) for a math function.
    Type: Grant
    Filed: November 11, 2018
    Date of Patent: June 30, 2020
    Assignees: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao Zhang
  • Publication number: 20200185371
    Abstract: A discrete 3-D processor comprises first and second dice. The first die comprises three-dimensional memory (3D-M) arrays, whereas the second die comprises logic circuits and at least an off-die peripheral-circuit component of the 3D-M array(s). The first die does not comprise the off-die peripheral-circuit component. The first and second dice are communicatively coupled by a plurality of inter-die connections. The preferred discrete 3-D processor can be applied to mathematical computing, computer simulation, configurable gate array, pattern processing and neural network.
    Type: Application
    Filed: January 16, 2019
    Publication date: June 11, 2020
    Applicant: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao ZHANG
  • Publication number: 20200127665
    Abstract: A configurable processor comprises at least an array of configurable computing elements (CCE's). Each CCE comprises at least a three-dimensional (3-D) memory (3D-M) array; an arithmetic logic circuit (ALC); and, a plurality of inter-storage-processor (ISP) connections. Not penetrating through any semiconductor substrate, the ISP-connections are short, small and numerous.
    Type: Application
    Filed: November 24, 2019
    Publication date: April 23, 2020
    Applicant: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao ZHANG
  • Publication number: 20200091232
    Abstract: In a shared three-dimensional vertical memory (3D-MV), each horizontal address line comprises at least two regions: a lightly-doped region and a low-resistivity region. The lightly-doped region is formed around selected memory holes and shared by a plurality of low-leakage memory cells. The low-resistivity region forms a conductive network to reduce the resistance of the horizontal address line.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 19, 2020
    Applicant: HangZhou HaiCun Information Technology Co., Ltd.
    Inventor: Guobiao ZHANG