Abstract: A system and method for processing a wafer includes a charge neutralization system. The wafer processing system includes a wafer measuring device that can measure characteristics of a surface of the semiconductor wafer. One or more wafer processing stations perform a chemical mechanical polish (CMP) process on the wafer surface. A desica cleaning station can clean and dry the semiconductor wafer. The wafer processing system further includes a charge neutralizing device that can alter a surface charge of the wafer surface.

Abstract: According to one embodiment of the invention, the gate contact is formed by a selective deposition on the gate electrode. One acceptable technique for the selective deposition is by plating. Plating is one process by which a metal structure, such as a gate contact, may be formed directly on the gate electrode. The plating is carried out by immersing the semiconductor die in a plating solution with the gate electrode exposed. The gate contact is plated onto the gate electrode and thus is ensured of being fully aligned exactly to the gate electrode. After this, the appropriate dielectric layers are formed adjacent the gate contact and over the source and drain to ensure that the gate electrode is electrically isolated from other components of the transistor.

Abstract: A semiconductor device having a gate positioned in a recess between the source region and a drain region that are adjacent either side of the gate electrode. A channel region is below a majority of the source region as well as a majority of the drain region and the entire gate electrode.

Abstract: A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.

Abstract: The invention provides compounds of Formula (I) and pharmaceutically acceptable salts thereof. The Formula (I) imidazopyridazines inhibit protein kinase activity thereby making them useful as anticancer agents.

Abstract: The invention provides compounds of Formula (I) and pharmaceutically acceptable salts thereof. The Formula (I) imidazopyridazines inhibit protein kinase activity thereby making them useful as anticancer agents.

Abstract: Personal Cloud Engine (iCloud) described in the present invention collects information relevant to a user from various data sources including personal email accounts, social network accounts, online vendors, on-line services for store and share photos and videos and on-line bank accounts. Collected data are classified, indexed, tagged and stored in a persistent data storage device. Web interface such as HTTP is provides for access data by a client, which can be web browser running on a computing device or a client application running on a smart phone. By gathering all the data, iCloud maintains a secondary copy of all valuable personal data and effectively prevents data loss. iCloud can also utilize the data and extract intrinsic value from the data stored by data mining and analytic tools.

Abstract: A packer or annular fluid includes a hydrocarbon fluid; and a gelling agent; wherein the packer fluid is a yield power law fluid. A method for preparing a packer fluid includes preparing a mixture of a hydrocarbon fluid, and a gelling agent; heating the mixture to a selected temperature; and shearing the mixture. A method for emplacing a packer fluid into an annulus includes preparing the packer fluid that includes a hydrocarbon fluid and a gelling agent, wherein the packer fluid is a yield power law fluid; and pumping the packer fluid into the annulus.

Abstract: Passive circuit elements are formed at surfaces of two integrated circuit wafers. The passive circuit elements are utilized to align the two integrated circuit wafers to form an integrated circuit wafer stack.

Abstract: The present disclosure is directed to method of forming dummy structures in accordance with the golden ratio to reduce dishing and erosion during a chemical mechanical polish. The method includes determining at least one unfilled portion of a die prior to a chemical mechanical planarization and filling the at least one unfilled portion with a plurality of dummy structures, a ratio of the dummy structures to a total area of the unfilled portion being in the range of 36 percent and 39 percent. A die formed in accordance with the method may include a plurality of metal levels and a plurality of regions at each metal level, each region having a plurality of dummy structures formed as golden rectangles.

Abstract: A method and system for detecting and controller wafer surface pressure distribution. Detecting and controlling wafer surface pressure distribution comprises measuring in situ wafer uniformity of a wafer at a plurality of locations of the wafer; and in response to the measured wafer uniformity controlling through a feedback loop in situ CMP head pressure applied at the plurality of locations of the wafer in real time to polish the wafer.

Abstract: A system and method for processing a wafer includes a charge neutralization system. The wafer processing system includes a wafer measuring device that can measure characteristics of a surface of the semiconductor wafer. One or more wafer processing stations perform a chemical mechanical polish (CMP) process on the wafer surface. A desica cleaning station can clean and dry the semiconductor wafer. The wafer processing system further includes a charge neutralizing device that can alter a surface charge of the wafer surface.

Abstract: A method that includes forming a first level of active circuitry on a substrate, forming a first probe pad electrically connected to the first level of active circuitry where the first probe pad having a first surface, contacting the first probe pad with a probe tip that displaces a portion of the first probe pad above the first surface, and performing a chemical mechanical polish on the first probe pad to planarize the portion of the first probe pad above the first surface. The method also includes forming a second level of active circuitry overlying the first probe pad, forming a second probe pad electrically connected to the second level of active circuitry, contacting the second probe pad with a probe tip that displaces a portion of the probe pad, and chemically mechanically polishing the second probe pad to remove the portion displaced.

Abstract: A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively.

Abstract: Chemical-Mechanical Polishing can be used to planarize a semiconductor wafer having a patterned overlapping layer. Isotropic etching can remove a portion of the patterned overlapping layer to produce tapered sidewalls of reduced height. A portion of the overlapping layer can be removed using CMP. The overlapping layer can have a higher polishing rate than the underlying layer so that the underlying layer remains substantially intact after removing the overlying layer.

Abstract: The present invention relates to methods and pharmaceutical compositions for treating obesity or obesity-related disorders in a subject suffering from or predisposed to developing obesity or an obesity-related disorder, or for inhibiting the infectivity of HIV, by administering oleuropein, an analogue or derivative thereof, or the major metabolites of oleuropein including oleuropein aglycone, hydroxytyrosol, and elenolic acid or their analogues, or derivatives thereof, an iridoid glycoside, or a secoiridoid glycoside or analogues or derivatives thereof, or any combination of the foregoing including olive leave extract. The invention also relates to methods for screening/diagnosing a subject having, or predisposed to having obesity or a related disorder by measuring the expression profiles of an adipogenic gene selected from PPAR?2, LPL and ?P2 gene and gene product, or other adipogenic, lipogenic, or lipolytic genes and gene products in an individual.

Abstract: A method for supporting diagnostic workflow from a medical imaging apparatus. A set of at least two images are obtained from a patient and displayed according to a user-specified image display layout selected from a plurality of image display layouts. One or more markers are associated with a region of interest in the displayed images. A list of regions of interest is generated, each having an entry for each associated marker. A classification is assigned to each entry in the list of regions of interest according to health risk.

Abstract: Disclosed herein are methods and compositions for treating neuropathies by modulating endogenous NT-3 of GDNF gene expression.

Abstract: A packer or annular fluid includes a hydrocarbon fluid; and a gelling agent; wherein the packer fluid is a yield power law fluid. A method for preparing a packer fluid includes preparing a mixture of a hydrocarbon fluid, and a gelling agent; heating the mixture to a selected temperature; and shearing the mixture. A method for emplacing a packer fluid into an annulus includes preparing the packer fluid that includes a hydrocarbon fluid and a gelling agent, wherein the packer fluid is a yield power law fluid; and pumping the packer fluid into the annulus.

Abstract: A packer or annular fluid includes a hydrocarbon fluid; and a gelling agent; wherein the packer fluid is a yield power law fluid. A method for preparing a packer fluid includes preparing a mixture of a hydrocarbon fluid, and a gelling agent; heating the mixture to a selected temperature; and shearing the mixture. A method for emplacing a packer fluid into an annulus includes preparing the packer fluid that includes a hydrocarbon fluid and a gelling agent, wherein the packer fluid is a yield power law fluid; and pumping the packer fluid into the annulus.