Abstract: The present invention provides a nanowire sensor comprising nanowires, in which the nanowires are stacked to form a three-dimensional structure so that they have a large exposed surface area compared to that of a conventional straight nanowire sensor in the same limited area, thereby increasing the probability of attachment of a target material to the nanowires to thereby increase the measurement sensitivity of the sensor. Thus, a change in the electrical conductivity (conductance or resistance) of the nanowires can be sensed with higher sensitivity, suggesting that the sensor has increased sensitivity.

Abstract: A user terminal device includes a display, a communicator configured to perform communication with a digital signage device and a processor configured to control the display to display user interface (UI) screens for managing a content to be displayed on the digital signage device and schedules sequentially, configured to combine information input from each of the UI screens displayed sequentially and configured to transmit the combined information to the digital signage device.

Abstract: Provided are semiconductor devices and methods of fabricating the same. The methods may include forming a molding layer on a semiconductor substrate. A storage electrode passing through the molding layer is formed. A part of the storage electrode is exposed by partially etching the molding layer. A sacrificial oxide layer is formed by oxidizing the exposed part of the storage electrode. The partially-etched molding layer and the sacrificial oxide layer are removed. A capacitor dielectric layer is formed on the substrate of which the molding layer and the sacrificial oxide layer are removed. A plate electrode is formed on the capacitor dielectric layers.

Abstract: Disclosed herein is a touch sensor module, including: a window substrate; a touch sensor formed to face the window substrate and having an electrode pattern on a surface; an adhesive layer coupling the window substrate with the touch sensor; and a first moisture prevention layer formed along an outer edge of the touch sensor.

Abstract: A semiconductor package includes a substrate in which a plurality of wires are formed; at least one semiconductor chip electrically connected to portions of the plurality of wires; and a shielding can mounted on the substrate, surrounding the at least one semiconductor chip, electrically connected to at least one wire of the plurality of wires and including a soft magnetic material. The semiconductor package can prevent or substantially reduce electromagnetic interference (EMI).

Abstract: Provided are semiconductor devices and methods of fabricating the same. The methods may include forming a molding layer on a semiconductor substrate. A storage electrode passing through the molding layer is formed. A part of the storage electrode is exposed by partially etching the molding layer. A sacrificial oxide layer is formed by oxidizing the exposed part of the storage electrode. The partially-etched molding layer and the sacrificial oxide layer are removed. A capacitor dielectric layer is formed on the substrate of which the molding layer and the sacrificial oxide layer are removed. A plate electrode is formed on the capacitor dielectric layers.

Abstract: A wireless power transmission device may include a power transmitter configured to transmit power for charging, a power receiver configured to perform a communication protocol with the power transmitter and receive the power transmitted from the power transmitter, and an interface configured to exchange information for performing the charging based on the power receiver and the communication protocol and control power transmission from the power transmitter to the power receiver depending on the exchange of the information.

Abstract: An ammonia gas detection apparatus includes an ammonia sensor that is configured to detect an ammonia gas in a gas stream and to generate a first output signal when the ammonia gas is detected in the gas stream. The ammonia sensor does not detect the ammonia gas in the gas stream when the gas stream further includes an interference gas that disrupts operation of the ammonia sensor. A discoloration gauge includes a reaction solution that changes from a first color to a second color responsive to exposure to the ammonia gas in the gas stream, regardless of the presence of the interference gas, and a detector that generates a second output signal responsive to the reaction solution changing from the first color to the second color. A communication interface outputs the first and second output signal to a host computer that detects presence of the ammonia gas.

Abstract: An example embodiment relates to a patterning process including forming a photoresist pattern on a structure. The photoresist pattern includes a cross-linked surface that is insoluble in an organic solvent. The process also includes spin-on coating a dielectric layer on the photoresist pattern, partially removing the dielectric layer to form a plurality of dielectric spacers surrounding the photoresist pattern, and removing the photoresist pattern.

Abstract: The present invention provides a nanowire sensor comprising nanowires, in which the nanowires are stacked to form a three-dimensional structure so that they have a large exposed surface area compared to that of a conventional straight nanowire sensor in the same limited area, thereby increasing the probability of attachment of a target material to the nanowires to thereby increase the measurement sensitivity of the sensor. Thus, a change in the electrical conductivity (conductance or resistance) of the nanowires can be sensed with higher sensitivity, suggesting that the sensor has increased sensitivity.

Abstract: Provided are semiconductor devices and methods of fabricating the same. The methods may include forming a molding layer on a semiconductor substrate. A storage electrode passing through the molding layer is formed. A part of the storage electrode is exposed by partially etching the molding layer. A sacrificial oxide layer is formed by oxidizing the exposed part of the storage electrode. The partially-etched molding layer and the sacrificial oxide layer are removed. A capacitor dielectric layer is formed on the substrate of which the molding layer and the sacrificial oxide layer are removed. A plate electrode is formed on the capacitor dielectric layers.

Abstract: A nanowire sensor having a nanowire in a network structure includes: source and drain electrodes formed over a substrate; a nanowire formed between the source and drain electrodes and having a network structure in which patterns of intersections are repeated; and a detection material fixed to the nanowire and selectively reacting with a target material introduced from outside.

Abstract: Embodiments of the invention provide a touch sensor, including a base substrate, first electrode patterns formed on one surface of the base substrate in parallel with each other, and second electrode patterns formed on the other surface of the base substrate to intersect with a direction in which the first electrode patterns are formed. The first electrode patterns are formed in patterns corresponding to the second electrode patterns to cover the second electrode patterns in a region in which the first electrode patterns and the second electrode patterns intersect each other.

Abstract: Embodiments of the invention provide a touch sensor, which includes a base substrate, and an electrode pattern, which is formed on the base substrate and is formed in a mesh pattern formed by intersecting at least one metal wire. Dot patterns are formed on a region between the metal wires.

Abstract: A semiconductor device and a method for fabricating the same are provided. The semiconductor device includes a device isolation region, a trench formed in the device isolation region, a void connected to the trench in the device isolation region, a first mask pattern formed along sidewalls of the trench and protruding inwardly with respect to the void, a gate insulating film formed along the sidewall of the void, and a gate electrode filling the trench and at least a portion of the void.

Abstract: Provided are semiconductor devices and methods of fabricating the same. The methods may include forming a molding layer on a semiconductor substrate. A storage electrode passing through the molding layer is formed. A part of the storage electrode is exposed by partially etching the molding layer. A sacrificial oxide layer is formed by oxidizing the exposed part of the storage electrode. The partially-etched molding layer and the sacrificial oxide layer are removed. A capacitor dielectric layer is formed on the substrate of which the molding layer and the sacrificial oxide layer are removed. A plate electrode is formed on the capacitor dielectric layers.

Abstract: A method of forming a reticle includes: loading a blank reticle; projecting an electron beam; moving a second aperture plate having a first pattern aperture and a second pattern aperture so that the first pattern aperture is directly overlapped by a first aperture of a first aperture plate, the electron beam passing through the first pattern aperture after passing the first aperture; exposing the blank reticle with the electron beam after the electron beam passes the first pattern aperture, to form a first exposure pattern; moving the second aperture plate so that the second pattern aperture is directly overlapped by the first aperture of the first aperture plate, the electron beam passing through the second pattern aperture after passing the first aperture; exposing the blank reticle with the electron beam after the electron beam passes the second pattern aperture, to form a second exposure pattern; and developing the blank reticle having the first and second exposure patterns to form the reticle having firs

Abstract: Disclosed herein is a touch sensor module, including: a base substrate having electrode patterns formed thereon and including an electrode pad transferring an electrical signal of the electrode pattern to the outside; a flexible cable including an adhesive layer formed to transfer the electrical signal by contacting one surface of the electrode pad; and a coating layer coating the electrode patterns, wherein an adhesive solution and a coating solution each flowing out by pressuring the adhesive layer and the coating layer, respectively are formed so as to be overlapped with each other.

Abstract: Embodiments of the invention provide a touch sensor module, which includes a flexible cable having one or more terminal parts, and an adhesive layer contacting one surface of the terminal parts to transfer electrical signals. The touch sensor module further includes a base substrate including electrode pads formed to correspond to the terminal parts and contacting the other surface of the adhesive layer, and protecting layers formed along edges of the electrode pads.

Abstract: Disclosed herein is a touch sensor module, including: a window substrate; a touch sensor formed to face the window substrate and having an electrode pattern on a surface; an adhesive layer coupling the window substrate with the touch sensor; and a first moisture prevention layer formed along an outer edge of the touch sensor.