Abstract: A conversion device includes a primary side circuit, a secondary side circuit, a transformer, and a control circuit. The primary side circuit includes a primary side switch and is configured to receive an input voltage. The secondary side circuit outputs an output voltage to a load. The transformer comprises a primary winding and a secondary winding, the primary winding is electrically coupled to the primary side circuit and the secondary winding electrically coupled to the secondary side circuit. The control circuit is configured to control a peak value of the current of the primary side switch, to be limited in a band range.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first conductive structure arranged over a substrate. A memory layer is arranged over the first conductive structure, below a second conductive structure, and includes a ferroelectric material. An annealed seed layer is arranged between the first and second conductive structures and directly on a first side of the memory layer. An amount of the crystal structure that includes an orthorhombic phase is greater than about 35 percent.

Abstract: A sheathing system that envelops a building structure is provided, combining lightweight structural layers and a high R-value insulation layer to provide a unique solution. The collective layers of the sheathing system offer the benefits of decreased thickness, reduced weight, improved thermal insulation, improved structural strength, improved nailability, improved fire and smoke performance, and enhanced energy efficiency. All aspects of the disclosed sheathing system can contribute to the overall improved performance and sustainability of a building structure.

Abstract: A sheathing system that envelops a building structure is provided, combining lightweight structural layers and a high R-value insulation layer. The insulation layer includes a coated insulation product with a reduced fluorinated blowing agent concentration, while maintaining acceptable thermal properties. The coated insulation product includes a foam product that is coated with a barrier coating. The barrier coating includes a polymer having a minimum degree of crystallinity and at least one additive. The collective layers of the sheathing system offer the benefits of decreased thickness, reduced weight, improved thermal insulation, improved structural strength, improved nailability, improved fire performance, and enhanced energy efficiency.

Abstract: A sheathing system that envelops a building structure combines lightweight structural layers and a high R-value insulation layer. The insulation layer includes a coated insulation product formed with a low GWP blowing agent composition that is capable of achieving a 180-day R/in insulation value of at least 5. The coated insulation product includes a foam product that is coated with a barrier coating. The collective layers of the sheathing system offer the benefits of decreased thickness, reduced weight, improved thermal insulation, improved structural strength, improved nailability, improved fire performance, and enhanced energy efficiency.

Abstract: A roofing material is provided that includes an asphalt impregnated substrate comprising a first surface defining an upper side of the shingle and an opposed a second surface defining a lower side of the shingle, wherein the substrate includes a headlap portion, a tab portion, and a nail zone situated between the headlap portion and the tab portion; an adhesive on the lower side of the shingle; a plurality of granules embedded in the first asphalt coating, forming a top face that includes the granules and a partially exposed first asphalt coating; and at least one anti-stick coating located on the first surface of the shingle on at least one of the headlap portion and the tab portion.

Abstract: Asphalt-based roofing materials, such as shingles, are disclosed that include a band of a parting material. The asphalt-based roofing material includes at least one asphalt-coated substrate that defines a headlap portion and a tab portion each having opposed top and bottom surfaces; a layer of backdust applied to at least a portion of the bottom surface of the headlap portion and to at least a portion of the bottom surface of the tab portion; a release section of parting material applied to the layer of backdust, where the parting material is included in the in the range of 0.0005 kg/m2 to 1 kg/m2; and an adhesive.

Abstract: A hinge used for being installed between a door leaf and a door frame or between a sash and a window frame (7). The hinge includes a gear and rack unit and an inclined draw bar (1). The gear and rack unit is installed on the door frame or window frame (7). A gear (5) is rotatably installed on the door frame or window frame (7). A rack is located on one side of the gear (5). The gear (5) is meshed with the rack. A gear installation portion (51) is arranged on one side of the gear (5). Both ends of the inclined draw bar (1) are installed on the door leaf and door frame or the sash and window frame (7) respectively. According to the present invention, the problem that the existing hinge is unreasonably stressed and prone to damage is effectively solved.

Abstract: A method using drive test data for propagation model calibration includes: step 1, obtaining original drive test data; step 2, selecting the data from the drive test data according to predefined conditions as effective drive test data; and step 3, extracting the effective drive test data to form a data file used for propagation model calibration. An apparatus using drive test data for propagation model calibration includes: a drive test data obtaining module, configured to obtain the drive test data in the regions to be calibrated; an effective drive test data generation module, configured to generate effective drive test data from the drive test data according to predefined conditions; and a data file generation module, configured to extract the effective drive test data to form a data file used for propagation model calibration. The present invention utilizes drive test data of existing networks to largely decrease the CW test work and reduce the network building cost.

Abstract: A method using drive test data for propagation model calibration includes: step 1, obtaining original drive test data; step 2, selecting the data from the drive test data according to predefined conditions as effective drive test data; and step 3, extracting the effective drive test data to form a data file used for propagation model calibration. An apparatus using drive test data for propagation model calibration includes: a drive test data obtaining module, configured to obtain the drive test data in the regions to be calibrated; an effective drive test data generation module, configured to generate effective drive test data from the drive test data according to predefined conditions; and a data file generation module, configured to extract the effective drive test data to form a data file used for propagation model calibration. The present invention utilizes drive test data of existing networks to largely decrease the CW test work and reduce the network building cost.

Abstract: A hinge used for being installed between a door leaf and a door frame or between a sash and a window frame (7). The hinge includes a gear and rack unit and an inclined draw bar (1). The gear and rack unit is installed on the door frame or window frame (7). A gear (5) is rotatably installed on the door frame or window frame (7). A rack is located on one side of the gear (5). The gear (5) is meshed with the rack. A gear installation portion (51) is arranged on one side of the gear (5). Both ends of the inclined draw bar (1) are installed on the door leaf and door frame or the sash and window frame (7) respectively. According to the present invention, the problem that the existing hinge is unreasonably stressed and prone to damage is effectively solved.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.

Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.

Abstract: A method using drive test data for propagation model calibration includes: step 1, obtaining original drive test data; step 2, selecting the data from the drive test data according to predefined conditions as effective drive test data; and step 3, extracting the effective drive test data to form a data file used for propagation model calibration. An apparatus using drive test data for propagation model calibration includes: a drive test data obtaining module, configured to obtain the drive test data in the regions to be calibrated; an effective drive test data generation module, configured to generate effective drive test data from the drive test data according to predefined conditions; and a data file generation module, configured to extract the effective drive test data to form a data file used for propagation model calibration. The present invention utilizes drive test data of existing networks to largely decrease the CW test work and reduce the network building cost.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.

Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.