Bridge rectifier package with heat sink

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Description

FIG. 1 is a left, top perspective view of a new bridge rectifier package with heat sink showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a left view thereof;

FIG. 5 is a right view thereof;

FIG. 6 is a front view thereof; and,

FIG. 7 is a back view thereof.

Claims

The ornamental design for a new bridge rectifier package with heat sink, as shown and described.

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Patent History
Patent number: D654881
Type: Grant
Filed: Apr 6, 2010
Date of Patent: Feb 28, 2012
Assignee: Vishay General Semiconductor LLC (Hauppauge, NY)
Inventors: Ta-Te Chou (Taipei), Xiong-Jie Zhang (Tianjin), Xian Li (Tianjin), Hai Fu (Tianjin), Yong-Qi Tian (Tianjin)
Primary Examiner: Selina Sikder
Attorney: Mayer & Williams PC
Application Number: 29/359,100