Bridge rectifier package with heat sink

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Description

FIG. 1 is a perspective view, left top of a first embodiment of a new bridge rectifier package with heat sink;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a left of front view thereof;

FIG. 5 is a right of front view thereof;

FIG. 6 is a front view thereof; and

FIG. 7 is a back view thereof;

FIG. 8 is a perspective view, left top of an second embodiment of a new bridge rectifier package with heat sink;

FIG. 9 is a top view thereof;

FIG. 10 is a bottom view thereof;

FIG. 11 is a left of front view thereof;

FIG. 12 is a right of front view thereof;

FIG. 13 is a front view thereof; and,

FIG. 14 is a back view thereof.

Claims

We claim the ornamental design for a new bridge rectifier package with heat sink, as shown and described.

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Patent History
Patent number: D573116
Type: Grant
Filed: Oct 19, 2006
Date of Patent: Jul 15, 2008
Assignee: Vishay General Semiconductor LLC (Hauppauge, NY)
Inventors: Ta-Te Chou (Taipei), Xiong-Jie Zhang (Tianjin), Xian Li (Tianjin), Hai Fu (Tianjin), Yong-Qi Tian (Tianjin)
Primary Examiner: Selina Sikder
Attorney: Mayer & Williams PC
Application Number: 29/267,653