Abstract: A method of managing place data for a mobile device, the method comprising storing place data for the mobile device in a centralized place data store, the centralized place data store storing location data for each of a plurality of places defined by the mobile device, and in response to place data requests from a plurality of applications executing on the mobile device, providing the place data from the centralized place data store to the plurality of applications.

Abstract: A method of managing place data for a mobile device, the method comprising storing place data for the mobile device in a centralized place data store, the centralized place data store storing location data for each of a plurality of places defined by the mobile device, and in response to place data requests from a plurality of applications executing on the mobile device, providing the place data from the centralized place data store to the plurality of applications.

Abstract: A method of managing place data for a mobile device, the method comprising storing place data for the mobile device in a centralized place data store, the centralized place data store storing location data for each of a plurality of places defined by the mobile device, and in response to place data requests from a plurality of applications executing on the mobile device, providing the place data from the centralized place data store to the plurality of applications.

Abstract: A method of managing place data for a mobile device, the method comprising storing place data for the mobile device in a centralized place data store, the centralized place data store storing location data for each of a plurality of places defined by the mobile device, and in response to place data requests from a plurality of applications executing on the mobile device, providing the place data from the centralized place data store to the plurality of applications.

Abstract: A memory circuit includes a memory including a plurality of primary memory elements, and an error correction circuit coupled to the memory and operative to detect an error in at least one of the primary memory elements and to provide corrected data corresponding to the primary memory element. The memory circuit further includes at least one spare memory element and a control circuit operative to replace at least one of the primary memory elements with the spare memory element as a function of results generated by the error correction circuit.

Abstract: A memory device comprises a memory array and error correction circuitry coupled to the memory array. The error correction circuitry is configured to identify, in a data word retrieved from the memory array, at least one bit position corresponding to a predetermined defect location in the memory array, and to generate a corrected data word by automatically inverting a logic value at the identified bit position. This automatic logic inversion approach is particularly well suited for use in correcting output data errors associated with via defects and weak bit defects in high-density ROM devices.

Abstract: A memory device comprises a memory array and a phase distribution circuit coupled to the memory array. In one aspect, the phase distribution circuit is operative to control respective durations of a precharge phase and an active phase of a memory cycle of the memory array based on relative transistor characteristics of a tracked precharge transistor of a first conductivity type and a tracked memory cell transistor of a second conductivity type different than the first conductivity type. For example, the phase distribution circuit may comprise a first tracking transistor of the first conductivity type for tracking the precharge transistor of the first conductivity type and a second tracking transistor of the second conductivity type for tracking the memory cell transistor of the second conductivity type. The relative transistor characteristics may comprise relative strengths of the tracked precharge and memory cell transistors.

Abstract: A memory device comprises a memory array and a phase distribution circuit coupled to the memory array. In one aspect, the phase distribution circuit is operative to control respective durations of a precharge phase and an active phase of a memory cycle of the memory array based on relative transistor characteristics of a tracked precharge transistor of a first conductivity type and a tracked memory cell transistor of a second conductivity type different than the first conductivity type. For example, the phase distribution circuit may comprise a first tracking transistor of the first conductivity type for tracking the precharge transistor of the first conductivity type and a second tracking transistor of the second conductivity type for tracking the memory cell transistor of the second conductivity type. The relative transistor characteristics may comprise relative strengths of the tracked precharge and memory cell transistors.

Abstract: A memory circuit includes a plurality of memory cells and a plurality of bit lines and row lines connected to the memory cells for accessing selected memory cells. The memory circuit includes a programmable voltage source adapted for connection to at least one bit line and operative to precharge the bit line to a prescribed voltage level prior to accessing a selected one of the memory cells coupled to the bit line. A control circuit coupled to the bit line is operative to oppose discharge of the bit line during at least a portion of a given memory read cycle. A tracking circuit connected to the control circuit is operative to control a delay in activation of the control circuit and/or a duration of time the control circuit is active as a function of a parameter affecting signal development time of a data signal on the bit line.

Abstract: A memory cell comprises a storage element including a transistor and an inverter. The inverter has an input coupled to a first source/drain of the transistor at a first node and has an output coupled to a gate of the transistor at a second node. The transistor has a second source/drain coupled to a voltage supply of the memory circuit. The memory cell further includes a switching element coupled to the storage element at the first node and being operative to selectively access the storage element as a function of a control signal supplied to a control input of the switching element. The storage element is operative to store at least first and second data states. The first data state is retained in the storage element by maintaining the first node at a first voltage level by leakage current and by maintaining the second node at a second voltage level by active current.

Abstract: Certain embodiments of the inventions provide an integrated circuit (IC) having a processor operatively coupled to a PVT (process-voltage-temperature) source and an adjustable memory. The processor receives from the source an input characterizing the present PVT condition and generates a command for the memory based on that input. In response to the command, the memory adjusts its internal circuit structure, clock speed, and/or operating voltage(s) to optimize its performance for the present PVT condition. Advantageously, the ability to adjust the memory so that it can maintain its functionality and deliver an acceptable level of performance under unfavorable PVT conditions provides additional flexibility in choosing circuit design options, which can produce area savings and/or increase the yield of acceptable ICs during manufacture.

Abstract: An electronic circuit includes multiple circuit elements arranged into multiple distinct subdivisions, each subdivision having a separate voltage supply connection for conveying power to the subdivision. The electronic circuit further includes a controller including multiple outputs, each of the outputs being connected to a corresponding one of the voltage supply connections. When a given one of the subdivisions does not include a weak circuit element, the controller supplies a first voltage level to the given subdivision via the corresponding voltage supply connection. When the given subdivision includes at least one weak circuit element, the controller is operative to supply at least a second voltage level to the given subdivision via the corresponding voltage supply connection, the second voltage level being greater than the first voltage level.

Abstract: A memory device comprises a memory array, at least one buffer coupled to the memory array, and test circuitry coupled to the buffer. The buffer comprises switching circuitry configured to multiplex first and second inputs of the buffer to a given output of the buffer based at least in part on a control signal generated by the test circuitry. The control signal is generated as a function of both a test signal indicative of a test mode of operation of the memory device and a power-down signal indicative of a power-down mode of operation of the memory device. The buffer further comprises current reduction circuitry responsive to the control signal for reducing an amount of current consumed by the buffer in the power-down mode of operation. The buffer may comprise an input data buffer or an address buffer of the memory device.

Abstract: A memory circuit includes a memory including a plurality of primary memory elements, and an error correction circuit coupled to the memory and operative to detect an error in at least one of the primary memory elements and to provide corrected data corresponding to the primary memory element. The memory circuit further includes at least one spare memory element and a control circuit operative to replace at least one of the primary memory elements with the spare memory element as a function of results generated by the error correction circuit.

Abstract: A sense amplifier includes a first sensing element and a second sensing element redundant to the first sensing element. The sense amplifier further comprises a switch circuit configured to switch between the first and second sensing elements when an offset of the sense amplifier is greater than a prescribed amount.

Abstract: A memory circuit having reduced power consumption includes a plurality of memory sub-arrays and a shared circuit coupled to each of the memory sub-arrays. Each memory sub-array includes at least one row circuit, at least one column circuit, and a plurality of memory cells operatively coupled to the row and column circuits. The row and column circuits are operative to provide selective access to one or more of the memory cells. The shared circuit includes circuitry, external to the memory sub-arrays, which is operative to control one or more functions of the memory sub-arrays as a function of at least one control signal supplied to the memory circuit. The memory circuit is operative, with at least one of the memory sub-arrays operative, with one or more of the memory sub-arrays powered and concurrently with one or more of the memory sub-arrays unpowered.

Abstract: A word line driver circuit for use in a memory array including multiple memory cells and multiple word lines coupled to the memory cells for selectively accessing the memory cells includes a driver adapted to generate a word line signal as a function of a first set of address signals received by the word line driver circuit. The circuit further includes a switching circuit having a plurality of output nodes, the output nodes connected to respective ones of the plurality of word lines, and having an input node connected to an output of the driver and adapted to receive the word line signal. The switching circuit is operative to direct the word line signal to a selected one of the word lines during a memory access as a function of at least one control signal. Between a given pair of memory accesses, the output nodes and the input node of the switching circuit are held to a same prescribed voltage level to thereby substantially eliminate a leakage current path in the switching circuit.

Abstract: A memory circuit includes a plurality of memory cells and a plurality of bit lines and row lines connected to the memory cells for accessing selected memory cells. The memory circuit includes a programmable voltage source adapted for connection to at least one bit line and operative to precharge the bit line to a prescribed voltage level prior to accessing a selected one of the memory cells coupled to the bit line. A control circuit coupled to the bit line is operative to oppose discharge of the bit line during at least a portion of a given memory read cycle. A tracking circuit connected to the control circuit is operative to control a delay in activation of the control circuit and/or a duration of time the control circuit is active as a function of a parameter affecting signal development time of a data signal on the bit line.

Abstract: An electronic circuit includes multiple circuit elements arranged into multiple distinct subdivisions, each subdivision having a separate voltage supply connection for conveying power to the subdivision. The electronic circuit further includes a controller including multiple outputs, each of the outputs being connected to a corresponding one of the voltage supply connections. When a given one of the subdivisions does not include a weak circuit element, the controller supplies a first voltage level to the given subdivision via the corresponding voltage supply connection. When the given subdivision includes at least one weak circuit element, the controller is operative to supply at least a second voltage level to the given subdivision via the corresponding voltage supply connection, the second voltage level being greater than the first voltage level.

Abstract: A memory device comprises a memory array, at least one buffer coupled to the memory array, and test circuitry coupled to the buffer. The buffer comprises switching circuitry configured to multiplex first and second inputs of the buffer to a given output of the buffer based at least in part on a control signal generated by the test circuitry. The control signal is generated as a function of both a test signal indicative of a test mode of operation of the memory device and a power-down signal indicative of a power-down mode of operation of the memory device. The buffer further comprises current reduction circuitry responsive to the control signal for reducing an amount of current consumed by the buffer in the power-down mode of operation. The buffer may comprise an input data buffer or an address buffer of the memory device.