Abstract: There is disclosed in one example a communication system, including: a data transmission interface; and a wavelength division multiplexing (WDM) silicon laser source to provide modulated data on a carrier laser via the data transmission interface, the WDM laser including a single laser cavity to generate an internally multiplexed multi-wavelength laser, the single laser cavity including a filter having a first grating period to generate a first wavelength and a second grating period to generate a second wavelength, the second grating period superimposed on the first grating period.

Abstract: Embodiments include apparatuses, methods, and systems including a semiconductor photonic device having a waveguide disposed above a substrate. The waveguide has a first section including amorphous silicon with a first refractive index, and a second section including crystalline silicon with a second refractive index different from the first refractive index. The semiconductor photonic device further includes a heat element at a vicinity of the first section of the waveguide. The heat element is arranged to generate heat to transform the amorphous silicon of the first section of the waveguide to partially or completely crystallized crystalline silicon with a third refractive index. The amorphous silicon in the first section may be formed with silicon lattice defects caused by an element implanted into the first section. Other embodiments may also be described and claimed.

Abstract: Embodiments herein may relate to an optoelectronic receiver that includes a photonic integrated circuit (PIC) coupled with a light source. Respective PIC sections of the PIC may include a photodiode and a junction capacitor. The optoelectronic receiver may further include an electronic integrated circuit (EIC) coupled with the PIC. Respective EIC sections of the EIC may be communicatively coupled to respective ones of the PIC sections. Other embodiments may be described and/or claimed.

Abstract: Embodiments include apparatuses, methods, and systems including a semiconductor photonic device having a substrate, a waveguide disposed above the substrate, a phase change layer disposed above the waveguide, and a heater disposed above the phase change layer. The waveguide has a modifiable refractive index based at least in part on a state of a phase change material included in the phase change layer. The phase change material of the phase change layer is in a first state of a set of states, and the waveguide has a first refractive index determined based on the first state of the phase change material. The heater is to generate heat to transform the phase change material to a second state of the set of states, and the waveguide has a second refractive index determined based on the second state of the phase change material. Other embodiments may also be described and claimed.

Abstract: Embodiments herein relate to photonic integrated circuits with an on-chip optical isolator. A photonic transmitter chip may include a laser and an on-chip isolator optically coupled with the laser that includes an optical waveguide having a section coupled with a magneto-optic liquid phase epitaxy grown garnet film. In some embodiments, a cladding may be coupled with the garnet film, the on-chip isolator may be arranged in a Mach-Zehnder interferometer configuration, the waveguide may include one or more polarization rotators, and/or the garnet film may be formed of a material from a rare-earth garnet family. Other embodiments may be described and/or claimed.

Abstract: Embodiments include apparatuses, methods, and systems including a laser device having a 1×3 MMI coupler within a semiconductor layer. A front arm is coupled to the MMI coupler and terminated by a front reflector. In addition, a coarse tuning arm is coupled to the MMI coupler and terminated by a first back reflector for coarse wavelength tuning, a fine tuning arm is coupled to the MMI coupler and terminated by a second back reflector for fine wavelength tuning, and a SMSR and power tuning arm is coupled to the MMI coupler and terminated by a third back reflector. A gain region is above the front arm and above the semiconductor layer. Other embodiments may also be described and claimed.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a photonic apparatus with a photodetector with bias control to provide substantially constant responsivity. The apparatus includes a first photodetector, to receive an optical input and provide a corresponding electrical output; a second photodetector coupled with the first photodetector, wherein the second photodetector is free from receipt of the optical input; and circuitry coupled with the first and second photodetectors, to generate a bias voltage, based at least in part on a dark current generated by the second photodetector in an absence of the optical input, and provide the generated bias voltage to the first photodetector. The first photodetector is to provide a substantially constant ratio of the electrical output to optical input in response to the provision of the generated bias voltage. Additional embodiments may be described and claimed.

Abstract: A portion of an optical waveguide extending laterally within a photonic integrated circuit (PIC) chip is at least partially freed from the substrate to allow physical displacement of a released waveguide end relative to the substrate and relative to an adjacent photonic device also fabricated in the substrate. The released waveguide end may be displaced to modulate interaction between the photonic device and an optical mode propagated by the waveguide. In embodiments where the photonic device is an optical coupler, employing for example an Echelle grating or arrayed waveguide grating (AWG), mode propagation through the coupler may be modulated via physical displacement of the released waveguide end. In one such embodiment, thermal sensitivity of an integrated optical wavelength division multiplexer (WDM) is reduced by displacing the released waveguide end relative to the coupler in a manner that counters a temperature dependence of the optical coupler.

Abstract: There is disclosed in one example a communication system, including: a data transmission interface; and a wavelength division multiplexing (WDM) silicon laser source to provide modulated data on a carrier laser via the data transmission interface, the WDM laser including a single laser cavity to generate an internally multiplexed multi-wavelength laser, the single laser cavity including a filter having a first grating period to generate a first wavelength and a second grating period to generate a second wavelength, the second grating period superimposed on the first grating period.

Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.

Abstract: Technology for light detection and ranging (LIDAR) sensor can include an optical signal source, an optical modulation array and optical detector on the same integrated circuit (IC) chip, multi-chip module (MCM) or similar solid-state package.

Abstract: Embodiments herein may relate to an optoelectronic receiver that includes a photonic integrated circuit (PIC) coupled with a light source. Respective PIC sections of the PIC may include a photodiode and a junction capacitor. The optoelectronic receiver may further include an electronic integrated circuit (EIC) coupled with the PIC. Respective EIC sections of the EIC may be communicatively coupled to respective ones of the PIC sections. Other embodiments may be described and/or claimed.

Abstract: A transmission circuit includes an array of subarrays of emitters with quasi-periodic spacing. A first subarray of emitters emits a source signal, and a second subarray of emitters emits the source signal. The first and second subarrays are separated by a subarray spacing that quasi-periodic, wherein the spacing between different subarrays is different. The quasi-periodic subarray spacing is to cause constructive interference of a main lobe of the emissions from the subarrays, and to cause non-constructive interference of sidelobes of the emissions. The spacing between emitters in the subarrays can vary from one subarray to another.

Abstract: A transmission circuit includes an array of subarrays of emitters with quasi-periodic spacing. A first subarray of emitters emits a source signal, and a second subarray of emitters emits the source signal. The first and second subarrays are separated by a subarray spacing that quasi-periodic, wherein the spacing between different subarrays is different. The quasi-periodic subarray spacing is to cause constructive interference of a main lobe of the emissions from the subarrays, and to cause non-constructive interference of sidelobes of the emissions. The spacing between emitters in the subarrays can vary from one subarray to another.

Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.

Abstract: Apparatuses, methods and storage medium associated with an optical iso-modulator are disclosed herein. In embodiments, an apparatus may include an optical waveguide formed on one or more layers, such as an isolation layer and a handling layer. A modulator driver may be coupled to a first side of the one or more layers. A magneto-optical (MO) die may be coupled to a second side of the one or more layers that is opposite the first side. Other embodiments may be disclosed and/or claimed.

Abstract: Embodiments herein relate to a photonic integrated circuit (PIC) with an on-chip optical isolator. The PIC may comprise a laser, a waveguide coupled with the laser, and a closed loop resonator coupled to the laser through the waveguide. A magneto-optical (MO) layer is over and in contact with the waveguide and the closed loop resonator. The closed loop resonator may comprise a first polarization rotator (PR) and a second PR. A light from the laser in transverse electric (TE) mode through the waveguide is rotated in the first PR to a light in transverse magnetic (TM) mode, and the light in TM mode is rotated in the second PR to light in TE mode. The isolator may further comprise a micro-heater over or along a side of the waveguide and separated from the closed loop resonator; and a feedback control loop connected to the closed loop resonator and the micro-heater.

Abstract: Embodiments herein relate to a photonic integrated circuit (PIC) with an on-chip optical isolator. The PIC may comprise a laser, a waveguide coupled with the laser, and a closed loop resonator coupled to the laser through the waveguide. A magneto-optical (MO) layer is over and in contact with the waveguide and the closed loop resonator. The closed loop resonator may comprise a first polarization rotator (PR) and a second PR. A light from the laser in transverse electric (TE) mode through the waveguide is rotated in the first PR to a light in transverse magnetic (TM) mode, and the light in TM mode is rotated in the second PR to light in TE mode. The isolator may further comprise a micro-heater over or along a side of the waveguide and separated from the closed loop resonator; and a feedback control loop connected to the closed loop resonator and the micro-heater.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a single mode optical coupler device. In some embodiments, the device may include a multi-stage optical taper to convert light from a first mode field diameter to a second mode field diameter larger than the first mode field diameter, and a mirror formed in a dielectric layer under an approximately 45 degree angle with respect to a plane of the dielectric layer to reflect light from the multi-stage optical taper substantially perpendicularly to propagate the light in a single mode fashion. Other embodiments may be described and/or claimed.

Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.