Patents by Inventor Haiting Li

Haiting Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080186611
    Abstract: A flexible mounting slider with anti-static structure includes a slider body, an anti-static structure and a lead layer. The slider body includes an ABS, a slider back surface opposite to the ABS and a trailing edge connected with the ABS and the slider back surface. The trailing edge forms a plurality of slider pads thereon. The anti-static structure is provided on the slider back surface, which includes an insulation plate formed on the slider back surface, an anti-static plate formed on the insulation plate and a grounding element. In the invention, the anti-static plate comprises an insulation layer and an anti-static layer. The grounding element is electrically contacting with the anti-static layer of the anti-static plate and the slider back surface simultaneously. The lead layer is sandwiched between the insulation plate and the insulation layer of the anti-static plate and electrically connected with the slider pads of the slider body.
    Type: Application
    Filed: February 4, 2008
    Publication date: August 7, 2008
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Yan Liu, HaiTing Li, ZhaoYu Teng, XingHong Li, Sidney Chou
  • Publication number: 20050148145
    Abstract: A method for manufacturing ROM memory devices. The method includes forming a trench isolation structure within a cell region of a semiconductor substrate. The cell region is an array region for ROM memory devices. The method includes forming a gate structure within the cell region and forming a sidewall spacer on the gate structure, which is configured to overlap a portion of the trench isolation structure within the cell region to separate a buried bit line region of the cell region from an adjacent cell region. The method applies a refractory metal layer overlying the gate structure including sidewall spacers and exposed portion of the trench isolation structure. A step of alloying the refractory metal layer to the gate structure and exposed portions of source/drain regions to form silicided regions overlying the gate structure and source/drain regions is included. The refractory metal layer is selectively removed from sidewall spacers and exposed portion of the trench isolation structure.
    Type: Application
    Filed: February 6, 2004
    Publication date: July 7, 2005
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Herb Huang, Haiting Li, Wen Xu