Abstract: A waveguide type optical module is provided which includes a temperature control element supported on pedestals inside a casing, and an optical waveguide provided on the temperature control element. The heating control element includes a plate having a heater or heat absorber provided on a non-heating side thereof or buried therein. The plate is supported on the pedestals with less than 30% of the area thereof being in contact with the plate. Because of such a structure, the waveguide type optical module has a good wavelength demultiplexing characteristic, and the temperature controller and control element for use in the optical module incur less occurrence of particle separation and shows a high homogeneity of plate-surface temperature distribution.

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.

Abstract: A passivation layer is formed over a semiconductor wafer carrying a plurality of independent circuits. The passivation layer includes openings to expose bond pads on the wafer. A conductive adhesion material is then deposited over the wafer and an optional protection layer is deposited over the conductive adhesion material. The wafer is then cut up into individual microelectronic dice. During a subsequent packaging process, one or more microelectronic dice are fixed within a package core to form a die/core assembly. Expanded bond pads are then formed over the die/core assembly. The adhesion material on each die enhances the adhesion between the expanded bond pads and the passivation material on the die. One or more metal layers are then built up over the die/core assembly to provide, for example, conductive communication between the terminals of the die and the external contacts/leads of the package.

Abstract: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

Abstract: A passivation layer is formed over a semiconductor wafer carrying a plurality of independent circuits. The passivation layer includes openings to expose bond pads on the wafer. A conductive adhesion material is then deposited over the wafer and an optional protection layer is deposited over the conductive adhesion material. The wafer is then cut up into individual microelectronic dice. During a subsequent packaging process, one or more microelectronic dice are fixed within a package core to form a die/core assembly. Expanded bond pads are then formed over the die/core assembly. The adhesion material on each die enhances the adhesion between the expanded bond pads and the passivation material on the die. One or more metal layers are then built up over the die/core assembly to provide, for example, conductive communication between the terminals of the die and the external contacts/leads of the package.