Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: An inkjet printing device includes an ink reservoir that stores ink containing particles, an inkjet head part that receives the ink from the ink reservoir and ejects the ink onto a target substrate and a driver for rotating the ink reservoir.

Abstract: A display device includes a base layer including a pixel area, and a pixel in the pixel area. The pixel includes a first area, and a second area enclosing the first area in a plan view, bank patterns at the pixel area, extending in a first direction, spaced from each other by a first distance in the first area, and spaced from each other by a third distance that is greater than the first distance in the second area, a first electrode and a second electrode at an area of the bank patterns, and spaced from each other by a second distance that is less than the first distance in the first area, a first insulating layer at a portion of the pixel area including the first area to cover the first electrode and the second electrode and removed from another portion of the pixel area including opposite edge portions.

Abstract: An electronic device module includes: a substrate; a sealing portion disposed on a first surface of the substrate; an exothermic device disposed on the first surface of the substrate and embedded in the sealing portion; and a heat radiating portion at least partially embedded in the sealing portion. A lower surface of the heat radiating portion is bonded to one surface of the exothermic device. A side surface of the heat radiating portion is curved and is entirely in contact with the sealing portion. A plurality of grooves are disposed in the side surface of the heat radiating portion.

Abstract: A vehicle seat support assembly includes: a front link; and a front link bracket coupled to an upper rail of a vehicle seat and including a sagging support portion configured to inhibit sagging of the front link toward the upper rail. In particular, the front link is pivotally coupled to the front link.

Abstract: A display device includes a substrate and a pixel on the substrate. The pixel has an alignment area, and the alignment area has a first alignment area, a second alignment area spaced apart from the first alignment area in a first direction, and a non-alignment area extending around a periphery of the alignment area. The pixel includes: a first electrode and a second electrode extending in the first direction across the alignment area and being spaced apart from each other; a first bank in the non-alignment area and extending along a boundary of the pixel; an alignment control layer including a first alignment control pattern, the first alignment control pattern being spaced apart from the first bank in the non-alignment area between the first alignment area and the second alignment area; and a first light emitting element between the first electrode and the second electrode in the first alignment area.

Abstract: A semiconductor device includes: a pair of wire patterns configured to extend in a first direction and formed on a substrate to be spaced apart from each other in a second direction, the pair of wire patterns disposed closest to each other in the second direction; a gate electrode configured to extend in the second direction on the substrate, the gate electrode configured to surround the wire patterns; and first isolation layers configured to extend in the first direction between the substrate and the gate electrode and formed to be spaced apart from each other in the second direction, the first isolation layers overlapping the pair of wire patterns in a third direction perpendicular to the first and second directions.

Abstract: A method for network communication across application containers in a computer server system includes executing, by a computer system, a host operating system (OS). The host OS is an instance of an OS. The host OS includes multiple application containers operatively coupled to a memory. The method further includes executing, by the host OS, a virtual network interface for each of the application containers. The method further includes implementing, by the host OS, a remote direct memory access (RDMA) transparently for communications amongst the application containers by utilizing shared memory communications.

Abstract: A semiconductor package includes a substrate, an electronic component mounted on an upper surface of the substrate so that a lower surface of the electronic component faces the upper surface of the substrate, a heat slug disposed on an upper surface of the electronic component so that a lower surface of the heat slug faces the upper surface of the electronic component, a bonding material bonding the heat slug to the upper surface of the electronic component, and an encapsulant in which the heat slug and the electronic component are embedded. A side surface of the heat slug extending between an edge of the lower surface of the heat slug and an edge of an upper surface of the heat slug forms a recess with the upper surface of the electronic component.

Abstract: The present disclosure provides a composite material layer including a core layer and a shell layer. The core layer includes foamed elastomers. The shell layer encapsulates the core layer and continuously covered surfaces of the foamed elastomers, wherein the shell layer includes a material having light absorption. The melting point of the core layer is higher than the melting point of the shell layer.

Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a shielding wall mounted on the first surface of the substrate; a sealing portion disposed on the first surface of the substrate such that the at least one electronic device and the shielding wall are embedded in the sealing portion; and a shielding layer disposed on one surface of the sealing portion. At least a portion of the sealing portion is disposed externally of the shielding wall. The shielding wall and the shielding layer are formed of different materials.

Abstract: An apparatus for manufacturing a light emitting display device includes a substrate transfer stage including a plurality of support plates arranged at an interval in a first direction, each of the plurality of support plates extending in a second direction; and at least one electric-field application module disposed on at least one side of the substrate transfer stage. The at least one electric-field application module includes a probe head including at least one probe pin; and a driver connected to the probe head to move the probe head at least up and down.

Abstract: Embodiments of the present disclosure relate to a computer-implemented method for container scheduling in a container orchestration system (COS). According to the method, a new unit comprising one or more containers are detected. Available memory for each of a plurality of candidate nodes deployed in the COS is predicted based on page sharing information of each candidate node. The plurality of candidate nodes filtered to obtain a set of filtered nodes are, wherein the available memory of each of the set of filtered node meets a memory size limitation of the new unit. Priorities of the set of filtered nodes are ranked according to one or more priority functions. The new unit is deployed to one of the filtered nodes based on the priorities.

Abstract: A semiconductor package includes a substrate, a plurality of electronic components mounted on a first surface of the substrate, and an encapsulant disposed on the first surface of the substrate so that at least one of the plurality of electronic components is embedded in the encapsulant. The substrate includes a flow preventing portion including at least one flow preventing groove disposed in the first surface and adjacent to the encapsulant and/or at least one dam disposed on the first surface and adjacent to the encapsulant.

Abstract: A semiconductor device includes: a pair of wire patterns configured to extend in a first direction and formed on a substrate to be spaced apart from each other in a second direction, the pair of wire patterns disposed closest to each other in the second direction; a gate electrode configured to extend in the second direction on the substrate, the gate electrode configured to surround the wire patterns; and first isolation layers configured to extend in the first direction between the substrate and the gate electrode and formed to be spaced apart from each other in the second direction, the first isolation layers overlapping the pair of wire patterns in a third direction perpendicular to the first and second directions.

Abstract: A processor for performing deep learning is provided herein. The processor includes a processing element unit including a plurality of processing elements arranged in a matrix form including a first row of processing elements and a second row of processing elements. The processing elements are fed with filter data by a first data input unit which is connected to the first row processing elements. A second data input unit feeds target data to the processing elements. A shifter composed of registers feeds instructions to the processing elements. A controller in the processor controls the processing elements, the first data input unit and second data input unit to process the filter data and target data, thus providing sum of products (convolution) functionality.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: Provided are an anti-reflective film, a polarizing plate comprising same, and an optical display device comprising same, wherein in the anti-reflective film, a base layer, a high-refractive layer, and a low-refractive layer are sequentially stacked, the low-refractive layer comprising inorganic hollow particles having an average particle diameter of about 70 nm to about 150 nm, the low-refractive layer comprising a single layer arrangement of the inorganic hollow particles.

Abstract: A master mold for manufacturing a wire grid polarizer includes a mold substrate and a mold part disposed on the mold substrate, in which the mold part includes a plurality of embossed portions extending in a first direction substantially in parallel with one another, a plurality of debossed portions, at least some of which are disposed between adjacent embossed portions, extending in the first direction and separating adjacent embossed portions, and an embossed bridge portion arranged in a second direction intersecting the first direction and connecting the plurality of embossed portions separated by the debossed portions. A wire grid polarizer and a method of manufacturing a wire grid polarizer are also disclosed.

Abstract: Disclosed are a component for a fuel injector and a method for coating the same. The component for the fuel injector may include a base material, a bonding layer laminated on the base material, a support layer laminated on the outer surface of the bonding layer, and an NbSiCN functional layer including an NbCN layer and an SiCN layer and alternately laminated on the outer surface of the support layer, thereby reducing friction, high hardness, shock resistance, heat resistance, and durability of the component for the fuel injector.