Patents by Inventor Han SU

Han SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
    Publication number: 20210243901
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 5, 2021
    Inventors: Yun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG
  • ANTI-REFLECTIVE FILM, POLARIZING PLATE COMPRISING SAME, AND OPTICAL DISPLAY DEVICE COMPRISING SAME
    Publication number: 20210223438
    Abstract: Provided are an anti-reflective film, a polarizing plate comprising same, and an optical display device comprising same, wherein in the anti-reflective film, a base layer, a high-refractive layer, and a low-refractive layer are sequentially stacked, the low-refractive layer comprising inorganic hollow particles having an average particle diameter of about 70 nm to about 150 nm, the low-refractive layer comprising a single layer arrangement of the inorganic hollow particles.
    Type: Application
    Filed: December 13, 2018
    Publication date: July 22, 2021
    Inventors: Il Woong BAEK, Seo Young KANG, Yoo Jin KIM, Han Su KIM, Dong Yoon SHIN, Yeon Ju JUNG
  • Master mold for wire grid polarizer, wire grid polarizer and manufacturing method thereof, and display device having wire grid polarizer
    Patent number: 11065785
    Abstract: A master mold for manufacturing a wire grid polarizer includes a mold substrate and a mold part disposed on the mold substrate, in which the mold part includes a plurality of embossed portions extending in a first direction substantially in parallel with one another, a plurality of debossed portions, at least some of which are disposed between adjacent embossed portions, extending in the first direction and separating adjacent embossed portions, and an embossed bridge portion arranged in a second direction intersecting the first direction and connecting the plurality of embossed portions separated by the debossed portions. A wire grid polarizer and a method of manufacturing a wire grid polarizer are also disclosed.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: July 20, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Han Su Kim, Dong Eon Lee, Se Hee Han
  • COMPONENT FOR FUEL INJECTOR AND METHOD FOR COATING THE SAME
    Publication number: 20210190024
    Abstract: Disclosed are a component for a fuel injector and a method for coating the same. The component for the fuel injector may include a base material, a bonding layer laminated on the base material, a support layer laminated on the outer surface of the bonding layer, and an NbSiCN functional layer including an NbCN layer and an SiCN layer and alternately laminated on the outer surface of the support layer, thereby reducing friction, high hardness, shock resistance, heat resistance, and durability of the component for the fuel injector.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 24, 2021
    Inventors: Han Su Park, Heon Joon Park, Sung Chul Cha
  • CALIBRATION METHOD FOR FINGERPRINT SENSOR AND DISPLAY DEVICE USING THE SAME
    Publication number: 20210158069
    Abstract: Provided herein are a calibration method for a fingerprint sensor and a display device using the calibration method, where, in the calibration method for a fingerprint sensor, the fingerprint sensor includes a substrate, a light-blocking layer located on a first surface of the substrate and having openings formed in a light-blocking mask, a light-emitting element layer located on the light-blocking layer and having a plurality of light-emitting elements, and a sensor layer located on a second surface of the substrate and having a plurality of photosensors; and the calibration method includes generating calibration data through white calibration and dark calibration, and applying offsets to the plurality of photosensors using the calibration data.
    Type: Application
    Filed: September 1, 2020
    Publication date: May 27, 2021
    Inventors: Mun Su Kim, Kee Yong Kim, Jung Hun Sin, Han Su Cho
  • Printed circuit board and method of fabricating the same
    Patent number: 11019731
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: May 25, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yun Mi Bae, Soon Gyu Kwon, Sang Hwa Kim, Sang Young Lee, Jin Hak Lee, Han Su Lee, Dong Hun Jeong, In Ho Jeong, Dae Young Choi, Jung Ho Hwang
  • GATE OXIDE FORMING PROCESS
    Publication number: 20210134679
    Abstract: A gate oxide forming process includes the following steps. A substrate including a first area and a second area is provided. A first oxide layer, a silicon containing cap layer and a second oxide layer on the substrate of the first area and the second area are sequentially and blanketly formed. The silicon containing cap layer and the second oxide layer in the first area are removed. An oxidation process is performed to oxidize the silicon containing cap layer and a gate oxide layer is formed in the second area.
    Type: Application
    Filed: October 30, 2019
    Publication date: May 6, 2021
    Inventors: Yuan-Cheng Yang, Yi-Han Su, Sheng-Chen Chung, Chen-An Kuo, Chun-Lin Chen, Chiu-Te Lee, Chih-Chung Wang
  • Electronic element module and method for manufacturing the same
    Patent number: 10991658
    Abstract: An electronic element module includes: a substrate including ground wirings; at least one electronic element mounted on a first surface of the substrate; a sealing portion embedding the at least one electronic element therein and disposed on the substrate; connection conductors partially disposed on side surfaces of the substrate and having lower ends connected to the ground wirings; and a shielding portion disposed along the sealing portion, and connected to the connection conductors.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: April 27, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Han Su Park
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210120677
    Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Inventors: Jung Ho HWANG, Han Su LEE, Dae Young CHOI, Soon Gyu KWON, Dong Hun JEONG, In Ho JEONG, Kil Dong SON, Sang Hwa KIM, Sang Young LEE, Jae Hoon JEON, Jin Hak LEE, Yun Mi BAE
  • Gate oxide forming process
    Patent number: 10985071
    Abstract: A gate oxide forming process includes the following steps. A substrate including a first area and a second area is provided. A first oxide layer, a silicon containing cap layer and a second oxide layer on the substrate of the first area and the second area are sequentially and blanketly formed. The silicon containing cap layer and the second oxide layer in the first area are removed. An oxidation process is performed to oxidize the silicon containing cap layer and a gate oxide layer is formed in the second area.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: April 20, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yuan-Cheng Yang, Yi-Han Su, Sheng-Chen Chung, Chen-An Kuo, Chun-Lin Chen, Chiu-Te Lee, Chih-Chung Wang
  • Mold for wire grid polarizer and manufacturing method thereof
    Patent number: 10981301
    Abstract: A mold for a wire grid polarizer includes a hard mold and a soft mold, in which the hard mold includes a main body, an oxidization layer provided on the main body, and a SAM layer provided on the oxidization layer and including an additive, the soft mold includes a substrate, and a protrusions and depressions portion including a polymerized releasing agent, and a region that is hydrophobic in the polymerized releasing agent is arranged on a surface of the protrusions and depressions portion.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: April 20, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Min Hyuck Kang, Yukihiro Miyazawa, Myeong Hee Kim, Jung Woo Park, Han Su Kim, Dong Eon Lee, Gug Rae Jo, Seung-Yeon Chae, Atsushi Takakuwa
  • GEL-STATE ELECTROLYTE AND FABRICATING METHOD THEREOF, AND LITHIUM BATTERY
    Publication number: 20210111431
    Abstract: A gel-state electrolyte and a fabricating method thereof, and a lithium battery are described. The fabricating method of the gel-state electrolyte has steps of: adding a polyacrylonitrile type material and a polyalcohol type material to a liquid electrolyte to form a mixture, wherein the liquid electrolyte comprises a lithium salt; performing a crosslinking reaction by heating the mixture to between 70 and 80° C. for more than 4 hours, so as to form a transparent solution; and cooling the transparent solution to form the gel-state electrolyte. The fabricating method has a simple production process.
    Type: Application
    Filed: December 2, 2019
    Publication date: April 15, 2021
    Inventors: YU-HSIEN TSENG, YI-HAN SU, YU-CHENG CHEN, YU-SHING LIN, YU-CHENG TSENG, HSISHENG TENG, SHENG-SHU HOU
  • LITHIUM SECONDARY BATTERY COMPRISING INORGANIC ELECTROLYTE SOLUTION
    Publication number: 20210098826
    Abstract: A lithium secondary battery including a positive electrode, a negative electrode, a separator interposed between the positive electrode and the negative electrode, and a sulfur dioxide-based inorganic electrolyte solution. The negative electrode includes a negative electrode active material which includes a carbon material having a coating comprising titanium oxide (TiOx, 0<x<2). The titanium oxide improves the wettability of the carbon material negative electrode to the inorganic electrolyte solution and the charge transfer reaction on the surface and minimizes the interfacial resistance of the carbon material/inorganic electrolyte solution, thereby improving the high-rate charge/discharge characteristics.
    Type: Application
    Filed: July 12, 2019
    Publication date: April 1, 2021
    Applicants: LG CHEM, LTD., IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Seung-Hyun CHUNG, Jeong-Gil KIM, Bum-Young JUNG, Han-Su KIM, A-Young KIM, Ju-Hye SONG, Ho-Jae JUNG
  • Electronic component module
    Patent number: 10937710
    Abstract: An electronic component module includes a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant encapsulating the electronic element; a first shielding member disposed on a first surface of the encapsulant to surround the electronic element; a second shielding member disposed on a second surface of the encapsulant and spaced apart from the first shielding member; a shielding layer covering the first shielding member and the second shielding member; and a connection member connecting the electronic element to the second shielding member.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: March 2, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Han Su Park, Jong Woo Choi
  • Pre-charge circuit of SRAM controller and pre charging method thereof
    Patent number: 10937489
    Abstract: A pre-charge circuit of a static random access memory (SRAM) controller and a pre-charging method thereof are provided. The pre-charge circuit of the SRAM controller includes a first switch, a second switch and a third switch. A first terminal of the first switch is coupled to a working voltage, a second terminal of the first switch is coupled to a first bit line of the SRAM controller, and the first switch is controlled by a first turn-on signal. A first terminal of the second switch is coupled to the working voltage, a second terminal of the second switch is coupled to a second bit line of the SRAM controller, and the second switch is controlled by a second turn-on signal. The third switch is coupled between the first bit line and the second bit line, and the third switch is controlled by a third turn-on signal.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: March 2, 2021
    Assignee: Novatek Microelectronics Corp.
    Inventors: Pin-Han Su, Jen-Hao Liao
  • SEMI-CONDUCTOR PACKAGE
    Publication number: 20210057299
    Abstract: A semiconductor package includes a substrate, a plurality of electronic components mounted on a first surface of the substrate, and an encapsulant disposed on the first surface of the substrate so that at least one of the plurality of electronic components is embedded in the encapsulant. The substrate includes a flow preventing portion including at least one flow preventing groove disposed in the first surface and adjacent to the encapsulant and/or at least one dam disposed on the first surface and adjacent to the encapsulant.
    Type: Application
    Filed: January 30, 2020
    Publication date: February 25, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn HONG, Han Su PARK
  • Page sharing for containers
    Patent number: 10929305
    Abstract: This disclosure provides methods, systems and computer program products for page sharing among a plurality of containers running on a host. The method comprises in response to a first container accessing a first file not cached by the first container, checking whether a second file equivalent to the first file is shared in a memory of the host by a second container, wherein the checking is based on a record in which related information of at least one shared file is stored. The method further comprises in response to the checking indicating there is no second file, allocating in the memory at least one page for the first file, loading the first file into the at least one page, and storing related information of the first file into the record.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: February 23, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Qin Yue Chen, Chao Jun Wei, Han Su, Fei Fei Li
  • SOUND INSPECTION METHOD AND INSPECTION APPARATUS FOR DISPLAY DEVICE INCLUDING SOUND GENERATOR
    Publication number: 20210048339
    Abstract: A sound inspection method of a display device and a sound inspection device including preparing a display device including a display panel and a sound generator disposed on a first surface of the display panel, placing a vibration sensor on a second surface opposite to the first surface of the display panel, vibrating the sound generator at a first reference frequency, vibrating the display panel, and then sensing a vibration of the vibration sensor that vibrates along with a vibration of the display panel; and determining whether a frequency of the vibration of the vibration sensor is included in a first threshold frequency region.
    Type: Application
    Filed: August 10, 2020
    Publication date: February 18, 2021
    Inventors: Kee Yong Kim, Chang Yeob Kim, Jung Hun Sin, Han Su Cho
  • SEMICONDUCTOR PACKAGE
    Publication number: 20210043536
    Abstract: A semiconductor package includes a substrate, an electronic component mounted on an upper surface of the substrate so that a lower surface of the electronic component faces the upper surface of the substrate, a heat slug disposed on an upper surface of the electronic component so that a lower surface of the heat slug faces the upper surface of the electronic component, a bonding material bonding the heat slug to the upper surface of the electronic component, and an encapsulant in which the heat slug and the electronic component are embedded. A side surface of the heat slug extending between an edge of the lower surface of the heat slug and an edge of an upper surface of the heat slug forms a recess with the upper surface of the electronic component.
    Type: Application
    Filed: January 30, 2020
    Publication date: February 11, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Mok JANG, Han Su PARK, Hyun Kook CHO
  • Method of manufacturing printed circuit board
    Patent number: 10912202
    Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: February 2, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jung Ho Hwang, Han Su Lee, Dae Young Choi, Soon Gyu Kwon, Dong Hun Jeong, In Ho Jeong, Kil Dong Son, Sang Hwa Kim, Sang Young Lee, Jae Hoon Jeon, Jin Hak Lee, Yun Mi Bae