Abstract: A process module configured for performing concurrent epitaxial deposition of material layers is disclosed. The module comprises a common chamber housing with two chamber bodies disposed within it. Each chamber body includes a ceramic weldment with upper and lower walls, injection and exhaust chamber flanges, and exhaust flanges with inner and outer sealing surfaces. Cover plates form seals with the outer sealing surfaces of the exhaust flanges. The module also features pressure cylinders with pistons that apply compressive forces between the exhaust and injection chamber flanges. A semiconductor processing system including such process modules are also disclosed.

Abstract: Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a peripheral region of a substrate. Methods, systems, and assemblies can be used to obtain desired (e.g. composition and/or thickness) profiles of material on a substrate surface.

Abstract: A method of operating a reactor system to provide multi-zone substrate temperature control. The method includes, with a first pyrometer, sensing a temperature of a first zone of a substrate supported in the reactor system, and, with a second pyrometer, sensing a temperature of a second zone of the substrate. The method further includes, with a controller, comparing the temperatures of the first and second zones to setpoint temperatures for the first and second zones and, in response, generating control signals to control heating of the substrate. The method also includes controlling, based on the control signals, operations of a heater assembly operating to heat the substrate.

Abstract: A method of operating a reactor system to provide multi-zone substrate temperature control. The method includes, with a first pyrometer, sensing a temperature of a first zone of a substrate supported in the reactor system, and, with a second pyrometer, sensing a temperature of a second zone of the substrate. The method further includes, with a controller, comparing the temperatures of the first and second zones to setpoint temperatures for the first and second zones and, in response, generating control signals to control heating of the substrate. The method also includes controlling, based on the control signals, operations of a heater assembly operating to heat the substrate.

Abstract: A chamber arrangement includes a chamber body, a substrate support, and an upper heater element array. The chamber body has injection and longitudinally opposite exhaust ends, the substrate support is arranged within the chamber body and supported therein for rotation about a rotation axis, and the upper heater element array is supported above the chamber body and include a laterally-inner first upper linear lamp and a laterally-inner second upper linear lamp. The laterally-inner first upper linear lamp is separated from the rotation axis by a first lateral spacing distance, the laterally-inner second upper linear lamp is separated from the rotation axis by a second lateral spacing distance, and one of the first lateral spacing distance and the second lateral spacing distance is greater than the other of the first lateral spacing distance the second lateral spacing distance. Semiconductor processing systems and material layer deposition methods are also described.

Abstract: A chamber arrangement includes a chamber body having a chamber body with an injection end and a longitudinally opposite exhaust end, a substrate support arranged within the chamber body and supported for rotation therein rotation about a rotation axis, and an upper reflector supported above the chamber body and defining therein a laterally-outer first arcuate recess and a laterally-outer second arcuate recess. The laterally-outer first arcuate recess is separated from the rotation axis by a first arcuate recess lateral offset, the laterally outer second arcuate recess separated from the rotation axis by a second arcuate recess lateral offset, and the second arcuate recess lateral offset greater than or less than the first arcuate recess lateral offset. Semiconductor processing systems and material layer deposition methods are also described.

Abstract: A lift pin includes a lift pin body arranged along a lift pin axis having a contact pad, a stem segment, a neck segment, and a span feature. The contact pad is defined at a first end of the lift pin body, the stem segment extends from the contact pad, and the neck segment extends from the stem segment. The span feature is defined at a second end of the lift pin body, is connected to the contact pad by the neck segment and the stem segment, and has a minor and major widths. The minor width is equivalent to a neck diameter defined by the neck segment, the major with is greater than the minor width, and the major width is greater than a stem diameter defined by the stem segment. Lift pin arrangements, semiconductor processing systems, and methods of making semiconductor processing systems are also described.

Abstract: A shaft member includes a cylindrical body formed from a ceramic material and having a drive segment, a frustoconical segment, and an end key segment. The drive segment extends about a rotation axis, the frustoconical segment is offset from the drive segment along the rotation axis, and the end key segment extends axially from the frustoconical segment and is axially separated from the drive segment by the frustoconical segment of the shaft member. The end key segment has a first circumferential facet and a second circumferential facet circumferentially opposite the first circumferential facet to fix the shaft member in rotation about the rotation axis relative to a support member seated when the end key segment is slidably received within an end key socket defined within the support member. Process kits, semiconductor processing systems, and methods of making semiconductor processing systems are also described.

Abstract: A chamber arrangement includes a chamber body, a substrate support, and a laser source. The substrate support is arranged within the chamber body and supported for rotation about a rotation axis relative to the chamber body. The laser source is arranged outside of the chamber body and optically coupled to the substrate support along a lasing axis. The lasing axis intersects the substrate support at a location radially outward from an outer periphery of a substrate seated on the substrate support. A semiconductor processing system and a material layer deposition method are also described.

Abstract: Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a peripheral region of a substrate. Methods, systems, and assemblies can be used to obtain desired (e.g. composition and/or thickness) profiles of material on a substrate surface.

Abstract: Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a lower chamber area of a reactor. Methods, systems, and assemblies can be used to obtain desired etching and purging of the lower chamber area.

Abstract: A method of operating a reactor system to provide multi-zone substrate temperature control. The method includes, with a first pyrometer, sensing a temperature of a first zone of a substrate supported in the reactor system, and, with a second pyrometer, sensing a temperature of a second zone of the substrate. The method further includes, with a controller, comparing the temperatures of the first and second zones to setpoint temperatures for the first and second zones and, in response, generating control signals to control heating of the substrate. The method also includes controlling, based on the control signals, operations of a heater assembly operating to heat the substrate.

Abstract: A substrate support and lift assembly configured to support and lift a substrate from a susceptor is disclosed. The substrate support and lift assembly can include a susceptor support and a lift pin. The susceptor support can be configured to support the susceptor thereon. The susceptor support includes a plurality of support arms each extending radially from a central portion of the susceptor support to a terminus. Each of the plurality of support arms includes an aperture extending therethrough. The lift pin can be configured to fit through the aperture of a corresponding support arm to lift a substrate on the susceptor.

Abstract: The present invention provides a manufacturing method of an array substrate, comprising steps of: forming a gate and a gate line on a substrate; forming a gate insulating layer on the gate and the gate line; forming a pixel electrode on the gate insulating layer; and forming a first connecting via in a portion of the gate insulating layer in a non-display region and corresponding to the gate line, wherein the first connecting via is configured to connect a scanning signal trace to the gate line.

Abstract: The present invention provides a manufacturing method of an array substrate, comprising steps of: forming a gate and a gate line on a substrate; forming a gate insulating layer on the gate and the gate line; forming a pixel electrode on the gate insulating layer; and forming a first connecting via in a portion of the gate insulating layer in a non-display region and corresponding to the gate line, wherein the first connecting via is configured to connect a scanning signal trace to the gate line.

Abstract: A method of managing a call center that includes a plurality of agents may include receiving functional data associated with the plurality of call center agents over a time period, for each data curve, normalizing the data points to create a plurality of normalized functional data points, determining a variation associated with each normalized functional data point, determining one or more threshold values associated with each normalized functional data point, determining whether one or more of the normalized functional data points have a value that exceeds the associated threshold value, and identifying each of the normalized functional data points having a value that exceeds the associated threshold value as an outlier. The method may include identifying the call center agent associated with each curve that has an outlier and presenting information pertaining to one or more identified call center agents to a user.

Abstract: A method of managing a call center that includes a plurality of agents may include receiving functional data associated with the plurality of call center agents over a time period, for each data curve, normalizing the data points to create a plurality of normalized functional data points, determining a variation associated with each normalized functional data point, determining one or more threshold values associated with each normalized functional data point, determining whether one or more of the normalized functional data points have a value that exceeds the associated threshold value, and identifying each of the normalized functional data points having a value that exceeds the associated threshold value as an outlier. The method may include identifying the call center agent associated with each curve that has an outlier and presenting information pertaining to one or more identified call center agents to a user.

Abstract: A system implements a method of assessing performance of a call center agent that includes identifying a set of the one-time caller calls that the agent has handled. A first issue resolution rate is determined for the calls in the set that were released by the customer, and a second issue resolution rate is determined for the calls in the set that were released by the call center agent. The method also includes determining a difference between the first issue resolution rate and the second issue resolution rate. The determined difference is used to generate a performance assessment for the call center agent.

Abstract: A system implements a method of assessing performance of a call center agent that includes identifying a set of the one-time caller calls that the agent has handled. A first issue resolution rate is determined for the calls in the set that were released by the customer, and a second issue resolution rate is determined for the calls in the set that were released by the call center agent. The method also includes determining a difference between the first issue resolution rate and the second issue resolution rate. The determined difference is used to generate a performance assessment for the call center agent.