Patents by Inventor Hans Joachim Quenzer

Hans Joachim Quenzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11417448
    Abstract: A method for manufacturing a device having a three-dimensional magnetic structure includes applying or introducing magnetic particles onto or into a carrier element. A plurality of at least partly interconnected cavities are formed between the magnetic particles, which contact one another at points of contact, by coating the arrangement of magnetic particles and the carrier. The cavities are penetrated at least partly by the layer generated when coating, resulting in the three-dimensional magnetic structure. A conductor loop arrangement is provided on the carrier or a further carrier. When a current flows through the conductor loop, an inductance of the conductor loop is changed by the three-dimensional magnetic structure, or a force acts on the three-dimensional magnetic structure or the conductor loop by a magnetic field caused by the current flow, or when the position of the three-dimensional magnetic structure is changed, a current flow is induced through the conductor loop.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: August 16, 2022
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Thomas Lisec, Hans-Joachim Quenzer, Tim Reimer
  • Patent number: 11137364
    Abstract: This invention provides a microsystem comprising a porous thermal insulation body composed of particles of low thermal conductivity. The porous body isolates and stabilizes the microsystem.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: October 5, 2021
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Thomas Lisec, Hans-Joachim Quenzer
  • Patent number: 10752500
    Abstract: The invention relates to a method for producing optical components, wherein a first contact surface is formed by bringing a deformation element into contact with a carrier; and a second contact surface is formed by applying a functional element to the deformation element; said second contact surface at least partially overlapping the first contact surface, so that a deformation zone is formed by the area of the deformation element that lies between the overlapping areas of the two contact surfaces, wherein at least one portion of the deformation zone is heated and deformed in such a way that the functional element is deflected, in particular, shifts and/or tilts, and the functional element is joined with the deformation element during the process step of applying the functional element to the deformation element and/or during the process step of heating and deforming the deformation zone.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: August 25, 2020
    Assignee: FRAUNHOFER-GESELLSCAFT ZUR FÖRDERUNG ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Hans Joachim Quenzer, Vanessa Stenchly
  • Publication number: 20200159006
    Abstract: The invention relates to a MEMS mirror assembly for detecting a large angular range up to 180°, preferably up to 160°, and to a method for producing a MEMS mirror assembly. The mirror assembly comprises a carrier substrate (1), on which a mirror (2) vibrating about at least one axis is mounted, a transparent cover (4), which is connected in a hermetically sealed manner to the carrier substrate (1) and which comprises an ellipsoidal dome (6) having a substantially round base area, and a compensation optical system (8), which is arranged in a predefined beam path for an incident beam outside the dome (6). The middle of the mirror (2) lies in the centre point of the dome, and the compensation optical system (8) collimates the incident beam in such a way that a divergence or convergence of the beam caused by the boundary surfaces of the dome once said beam has exited from the dome (6) is substantially compensated.
    Type: Application
    Filed: July 25, 2018
    Publication date: May 21, 2020
    Inventors: Hans-Joachim Quenzer, Ulrich Hofmann, Vanessa Stenchly
  • Patent number: 10647915
    Abstract: A converter assembly for converting a primary light into a secondary light includes at least one element which has a light-converting structure with open pores and which is laterally held by a frame. The surfaces of both the light-converting structure as well as of the inner face of the frame are covered with a transparent layer such that each of the afore-mentioned elements forms a region in which a property of the incident light and preferably of the wavelength thereof is changed. In specific embodiments, the converter assembly can be part of display assemblies or of miniaturized components for example. There is also described a method for producing the converter assembly.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: May 12, 2020
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Ulrich Hofmann, Hans-Joachim Quenzer, Thomas Lisec, Thomas Von Wantoch
  • Publication number: 20200041699
    Abstract: A production method includes fixing ball elements of a semiconductor material to a carrier substrate by means of heat and pressure; and one-sided thinning of the ball elements fixed to the carrier substrate to form plano-convex lens elements of a semiconductor material.
    Type: Application
    Filed: October 8, 2019
    Publication date: February 6, 2020
    Inventors: Norman LASKE, Hans-Joachim QUENZER, Vanessa STENCHLY, Amit KULKARNI, Arne Veit SCHULZ-WALSEMANN
  • Publication number: 20190331626
    Abstract: This invention provides a microsystem comprising a porous thermal insulation body composed of particles of low thermal conductivity. The porous body isolates and stabilizes the microsystem.
    Type: Application
    Filed: September 27, 2017
    Publication date: October 31, 2019
    Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Thomas LISEC, Hans-Joachim QUENZER
  • Publication number: 20190135619
    Abstract: The invention relates to a method for producing optical components, wherein a first contact surface is formed by bringing a deformation element into contact with a carrier; and a second contact surface is formed by applying a functional element to the deformation element; said second contact surface at least partially overlapping the first contact surface, so that a deformation zone is formed by the area of the deformation element that lies between the overlapping areas of the two contact surfaces, wherein at least one portion of the deformation zone is heated and deformed in such a way that the functional element is deflected, in particular, shifts and/or tilts, and the functional element is joined with the deformation element during the process step of applying the functional element to the deformation element and/or during the process step of heating and deforming the deformation zone.
    Type: Application
    Filed: March 21, 2017
    Publication date: May 9, 2019
    Applicant: FRAUNHOFFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Hans, Joachim QUENZER, Vanessa STENCHLY
  • Patent number: 10283930
    Abstract: The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: May 7, 2019
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Wolfgang Reinert, Hans Joachim Quenzer
  • Publication number: 20180371315
    Abstract: A converter assembly for converting a primary light into a secondary light includes at least one element which has a light-converting structure with open pores and which is laterally held by a frame. The surfaces of both the light-converting structure as well as of the inner face of the frame are covered with a transparent layer such that each of the afore-mentioned elements forms a region in which a property of the incident light and preferably of the wavelength thereof is changed. In specific embodiments, the converter assembly can be part of display assemblies or of miniaturized components for example. There is also described a method for producing the converter assembly.
    Type: Application
    Filed: December 13, 2016
    Publication date: December 27, 2018
    Inventors: ULRICH HOFMANN, HANS-JOACHIM QUENZER, THOMAS LISEC, THOMAS VON WANTOCH
  • Patent number: 10101222
    Abstract: Embodiments of the present invention provide an apparatus including a micromirror, an excitation structure containing or supporting the micromirror, and at least one piezoelectric sensor. The excitation structure includes at least one piezoelectric actuator, the excitation structure being configured to resonantly excite the micromirror so as to cause a deflection of the micromirror. The at least one piezoelectric sensor is configured to provide a sensor signal dependent on the deflection of the micromirror, the piezoelectric sensor being connected to the excitation structure so that during the resonant excitation of the micromirror, the sensor signal and the deflection of the micromirror exhibit a fixed mutual phase relationship.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: October 16, 2018
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Shanshan Gu-Stoppel, Hans-Joachim Quenzer, Joachim Janes, Felix Heinrich
  • Patent number: 9912115
    Abstract: The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: March 6, 2018
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Wolfgang Reinert, Hans Joachim Quenzer
  • Patent number: 9910273
    Abstract: The method according to the invention is used for producing optical components, in particular covers for encapsulating micro-systems, wherein at least one reinforcing element, which is produced before being arranged, is arranged on a first substrate, as a result of which a stack is produced. This stack is heated after being connected to a second substrate, as a result of which the first substrate is deformed such that at least one region, covered by the reinforcing element, of the first substrate is moved and/or is inclined or the first substrate is brought into contact with the reinforcing element. In an alternative method according to the invention, the reinforcing element is arranged on the second substrate, wherein this stack is then connected to the first substrate. The first substrate is subsequently heated and deformed such that a region of the first substrate is brought into contact with the reinforcing element.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: March 6, 2018
    Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Hans Joachim Quenzer, Ulrich Hofmann, Vanessa Stenchly
  • Publication number: 20170338623
    Abstract: The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.
    Type: Application
    Filed: July 26, 2017
    Publication date: November 23, 2017
    Inventors: Wolfgang REINERT, Hans Joachim QUENZER
  • Publication number: 20170278605
    Abstract: A method for manufacturing a device having a three-dimensional magnetic structure includes applying or introducing magnetic particles onto or into a carrier element. A plurality of at least partly interconnected cavities are formed between the magnetic particles, which contact one another at points of contact, by coating the arrangement of magnetic particles and the carrier. The cavities are penetrated at least partly by the layer generated when coating, resulting in the three-dimensional magnetic structure. A conductor loop arrangement is provided on the carrier or a further carrier. When a current flows through the conductor loop, an inductance of the conductor loop is changed by the three-dimensional magnetic structure, or a force acts on the three-dimensional magnetic structure or the conductor loop by a magnetic field caused by the current flow, or when the position of the three-dimensional magnetic structure is changed, a current flow is induced through the conductor loop.
    Type: Application
    Filed: June 13, 2017
    Publication date: September 28, 2017
    Inventors: Thomas LISEC, Hans-Joachim QUENZER, Tim REIMER
  • Patent number: 9733470
    Abstract: The underlying invention presents a device which connects a vibratably suspended optical element to at least two actuators mounted fixedly on one side via curved spring elements, wherein the actuators are implemented to cause the vibratably suspended optical element to vibrate via the curved spring elements. Both the actuators and the entire system may be implemented to be more robust and be operated more reliably due to the curved shaping of the spring elements.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: August 15, 2017
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Shanshan Gu-Stoppel, Hans Joachim Quenzer, Joachim Janes
  • Patent number: 9523848
    Abstract: A micromirror system that includes a chip frame, at least one spring element, and at least one mirror plate oscillatorily suspended in the chip frame via the at least one spring element. The chip frame and the at least one spring element include at least one microchannel which is provided with an inlet opening and an outlet opening for leading through a flowing coolant.
    Type: Grant
    Filed: March 20, 2013
    Date of Patent: December 20, 2016
    Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E. V.
    Inventors: Ulrich Hofmann, Hans-Joachim Quenzer, Joachim Janes, Björn Jensen
  • Patent number: 9482651
    Abstract: The present invention relates to a method for producing a miniaturized separation column for chromatographic purposes including a porous stationary phase anchored in the column, including the following steps: (a) preparing a flat substrate of silicon, glass, glass ceramic or ceramic; (b) etching at least one channel structure into the flat substrate; (c) introducing a non-porous precursor material for the porous stationary phase into at least one portion of the channel structure (s); (d) forming a porous, three-dimensional network from the precursor material; and (e) fluid-tight covering of the channel structure(s) on the top side of the flat substrate.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: November 1, 2016
    Assignee: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
    Inventors: Gundula Piechotta, Hans-Joachim Quenzer
  • Publication number: 20160285232
    Abstract: The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.
    Type: Application
    Filed: June 3, 2016
    Publication date: September 29, 2016
    Inventors: Wolfgang REINERT, Hans Joachim QUENZER
  • Patent number: 9399573
    Abstract: The invention relates to an MEMS structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: July 26, 2016
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Shanshan Gu-Stoppel, Hans Joachim Quenzer, Ulrich Hofmann