Abstract: Disclosed is a method for producing single microlenses or an arrays of microlenses composed of a glass-type material, in which method a first substrate is provided with a surface containing impressions over which a second substrate composed of a glass-type material is placed at least partially overlapping it and is joined therewith under vacuum conditions. The substrate composite is tempered in such a manner that the second substrate softens and flows into the impressions of the first substrate, thereby structuring the side of the second substrate facing away from the first substrate in order to form at least one microlens surface.

Abstract: Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface, the tool is able to conduct the metal ions of the substrate and an electric potential is applied so that an electric potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.

Abstract: Etching solution for etching a layer system that has at least one layer of aluminum, at least one layer of copper and at least one third layer, selected from nickel vanadium, nickel and alloys thereof, which is arranged between the at least one aluminum layer and the at least one copper layer, wherein the solution contains phosphoric acid, nitric acid, deionized water and at least one salt that can release halogen ions, or comprises these components. The claimed etching solution is the basis for a one-step structuring method of a UBM layer system which is used in the production of components that are produced by semiconductor technology methods.

Abstract: Disclosed is a method for structuring a flat substrate consisting of a glass-type material.

Abstract: A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract: A beam-shaping element comprises a carrier substrate (1) bearing a thin-layer metallization which is structured for shaping the beam of optical radiation. The thin-layer metallization includes at least two metallic layers (2, 3), which, upon impingement of the optical radiation (4), react with each other accompanied by a permanent change in color in response to a certain intensity and/or an irradiation period of the optical radiation (4).

Abstract: The invented method is distinguished by a combination of the following method steps: provision of a semiconductor planar substrate composed of a semiconductor material, reduction of the thickness of the semiconductor planar substrate inside at least one surface region of the semiconductor planar substrate in order to form a raised surface region in relation to the surface planar region of reduced thickness, structuring the raised surface region of the semiconductor planar substrate by means of local mechanical removal of material in order to place impressions inside the raised surface regions, joining the structured surface of the semiconductor planar substrate with the glasslike planar substrate in such a manner that the glasslike planar substrate at least partially covers the surface planar region of reduced thickness, tempering the joined planar substrates in such a manner that in a first tempering phase, which is conducted under vacuum conditions, the glasslike planar substrate covering the surface reg

Abstract: The invented method is distinguished by a combination of the following method steps: provision of a semiconductor planar substrate composed of a semiconductor material, reduction of the thickness of the semiconductor planar substrate inside at least one surface region of the semiconductor planar substrate in order to form a raised surface region in relation to the surface planar region of reduced thickness, structuring the raised surface region of the semiconductor planar substrate by means of local mechanical removal of material in order to place impressions inside the raised surface regions, joining the structured surface of the semiconductor planar substrate with the glasslike planar substrate in such a manner that the glasslike planar substrate at least partially covers the surface planar region of reduced thickness, tempering the joined planar substrates in such a manner that in a first tempering phase, which is conducted under vacuum conditions, the glasslike planar substrate covering the surface region

Abstract: The invention relates to a method and a device for follow-up treatment of the contour of the surface of at least one optical lens, in particular a microlens which is made of glass or a glass-type material and which has a convex lens surface delimited by a circumferential line abutting on a plane section surrounding said circumferential line and which has a lens underside facing the convex lens surface.

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type substrate in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract: Disclosed is a sol solution and a method for producing this sol solution, which serves as a coating agent for producing glass coatings for electrically conductive materials that can be used in anodic bonding. The sol solution is a mix of an organosol consisting of SiO2 dissolved in at least one n-alkanol or a mixture of a multiplicity of n-alkanols, a tetraethyl orthosilicate (TEOS) and/or a triethoxy silane or a trimethoxy silane as well as an acid or a base and water and the mixture being partially polymerized. The sol mixture is distinguished in that the mix contains an alkali alcoholate.

Abstract: The present invention relates to a beam-shaping element for optical radiation, in particular for UV laser radiation, as well as to a method for producing the beam-shaping element. This beam-shaping element comprises a carrier substrate (1) bearing a thin-layer metallization which is structured for shaping the beam of said optical radiation. The thin-layer metallization is composed of at least two metallic layers (2, 3), which, upon impingement of said optical radiation (4), react with each other accompanied by a permanent change in color as of a certain intensity and/or irradiation period of said optical radiation (4).

Abstract: A tunable high-frequency capacitor includes first and second fixed electrodes, the first fixed electrode having a high-frequency input connection, and the second fixed electrode having a high-frequency output connection. A movable electrode is arranged facing and spaced apart from the fixed electrodes and is supported by means of a suspension which causes a displacement of the movable electrode in relation to the fixed electrode depending on a control signal that is applied.

Abstract: Disclosed is a method for structuring a flat substrate consisting of a glass-type material.

Abstract: A sensor element for electrically measuring the position of liquid levels, comprising a substrate (2) and a plurality of electrodes (3) that can be contacted individually and that are mounted on the substrate, characterized in that the electrodes comprise sensor-active partial electrodes (5) that are networked with electrical connections (7), with the partial electrodes of two respective electrodes always being positioned opposite one another, separated by a distance, as partial electrode pairs (11) and with the electrode pairs (8) thus formed recurring periodically over the length of the sensor. Quasi-digital measuring methods are derived from the behavior of the impedance of the electrode pairs, whereby the liquid level is measured by detecting a conductivity boundary in a capillary filling.

Abstract: The present invention relates to an assembly of variable capacitance as well as to a method of operating the assembly. In the assembly, a variable capacitor is formed by a variable coverage or a variable distance of at least one first (4) and one second electrically conductive region (5). The first electrically conductive region (4) is configured on or in a substrate (1) and said second electrically conductive region (5) is configured on or in an actuator element (3) of a first micro-mechanical actuator (2). The actuator (2) is disposed on the substrate (1) in such a way that it can perform a movement of the actuator element (3) with the second region (5) along a surface of the substrate (1) at different positions relative to the first region (4), at which positions the second region (5) overlaps the first region (4) at least partly.

Abstract: The invention relates to a micro reactor arrangement, particularly for a micro relay. It comprises a substrate (1) with two thermomechanical micro actuators (3, 4). In response to thermal stimulation, the first micro actuator (3) performs a movement in parallel with the substrate surface (2), while the second micro actuator moves in a direction orthogonal on the substrate surface (2). Both thermomechanical micro actuators are so disposed relative to each other that the first micro actuator (3), in the extended state, reaches under the second micro actuator (4). With these provisions, the first micro actuator (3) can be maintained in this position without supply of power when the second micro actuator (4) is de-energized. With the present micro actuator arrangement, one can achieve the advantages of a high activation force and long positioning travels of thermomechanical micro actuators for micro relays, without the necessity to supply energy for maintaining the individual switching states.

Abstract: The present invention relates to an assembly of variable capacitance as well as to a method of operating the assembly. In the assembly, a variable capacitor is formed by a variable coverage or a variable distance of at least one first (4) and one second electrically conductive region (5). The first electrically conductive region (4) is configured on or in a substrate (1) and said second electrically conductive region (5) is configured on or in an actuator element (3) of a first micro-mechanical actuator (2). The actuator (2) is disposed on the substrate (1) in such a way that it can perform a movement of the actuator element (3) with the second region (5) along a surface of the substrate (1) at different positions relative to the first region (4), at which positions the second region (5) overlaps the first region (4) at least partly.