Patents by Inventor Hans Wang

Hans Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250192394
    Abstract: A battery, a battery module, a battery pack, a battery monitoring system and a vehicle are provided. The battery includes a housing; a cell disposed in the housing; and a sensing structure disposed in the housing, and the sensing structure is configured to collect status data within the battery and transmit the status data to the outside of the battery.
    Type: Application
    Filed: January 14, 2025
    Publication date: June 12, 2025
    Applicant: EVE POWER CO., LTD.
    Inventors: Jiao WANG, Zhangheng QIO, Hua WANG, Dingding YUAN, Ying WU, Han WANG, Ziyang WANG, Hao LIU, Yabin YANG, Wei HE, Jincheng LIU
  • Publication number: 20250189598
    Abstract: A leakage current detection circuit and a leakage current protection circuit are disclosed. The leakage current detection circuit includes a mutual inductance module, an excitation module, a signal processing module, a feedback self-check module and a calculation module. The mutual inductance module includes a magnetic core, a first winding and a second winding. The excitation module is configured for producing an excitation current in the first winding. The signal processing module is configured for processing the output voltage signal of the first winding and outputting a processed signal, and the voltage signal corresponding to the excitation current is filtered out of the processed signal. The feedback self-check module includes a feedback circuit and a self-check circuit. The calculation module is configured for analyzing the leakage current according to the processed signals and outputting the self-check signal in the self-check mode.
    Type: Application
    Filed: December 20, 2023
    Publication date: June 12, 2025
    Applicant: Schneider Electric (China) Co., Ltd.
    Inventors: Han Wang, Jie Feng, Chunchao Hu, Jiawei Liu, Yihan Ding
  • Publication number: 20250189882
    Abstract: A pellicle for an EUV photo mask includes a first layer; a second layer; and a main layer disposed between the first layer and second layer and including a plurality of nanotubes. At least one of the first layer or the second layer includes a two-dimensional material in which one or more two-dimensional layers are stacked. In one or more of the foregoing and following embodiments, the first layer includes a first two-dimensional material and the second layer includes a second two-dimensional material.
    Type: Application
    Filed: February 12, 2025
    Publication date: June 12, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ang CHAO, Chao-Ching CHENG, Han WANG
  • Patent number: 12327738
    Abstract: Embodiments described herein relate to chamber component cleaning systems and methods for cleaning a chamber component. The chamber component cleaning system includes a spray station, at least a first cleaning station, a dry station, a component transfer mechanism, and one or more enclosures that enclose the spray station, at least the first cleaning station, the dry station, and the component transfer mechanism. The spray station has a holder to position a chamber component in a path of a flow of a cleaning spray and a movable nozzle to provide the flow of the cleaning spray at a first pressure in a path of portions of the chamber component. The first cleaning station has a push mechanism to force a cleaning fluid through features and/or holes of the chamber component and at least one movable transducer to provide ultrasonic energy to the portions of the chamber component.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: June 10, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Jenn C. Chow, David W. Groechel, Tuochuan Huang, Dorothea Buechel-Rimmel, Han Wang, Li Wu, Gang Peng
  • Publication number: 20250183168
    Abstract: A semiconductor package and a method of forming the same are provided. The semiconductor package includes an interconnect structure, first connectors, a die, second connectors, a circuit board and a mark structure. The interconnect structure includes vias and lines stacked alternately and electrically connected to each other and embedded by polymer layers. The first connectors are disposed on a first side of the interconnect structure. The die is bonded to the first connectors. The second connectors are disposed on a second side of the interconnect structure. The circuit board is bonded to the second connectors. The mark structure is embedded in a first polymer layer among the polymer layers closest to the die and electrically insulated from the vias, the lines and the first connectors.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 5, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Patent number: 12322688
    Abstract: A package structure includes a first redistribution layer, a semiconductor die and a second redistribution layer. The first redistribution layer includes a first dielectric layer, first conductive elements, second conductive elements, a top dielectric layer and an auxiliary dielectric portion. The first conductive elements and the second conductive elements are disposed on the first dielectric layer with a first pattern density and a second pattern density respectively. The top dielectric layer is disposed on the first dielectric layer and covering a top surface of the second conductive elements. The auxiliary dielectric portion is disposed in between the first dielectric layer and the top dielectric layer, and covering a top surface of the first conductive elements. The semiconductor die is disposed on the first redistribution layer. The second redistribution layer is disposed on the semiconductor die, and electrically connected to the semiconductor die and the first redistribution layer.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: June 3, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Han Wang, Sih-Hao Liao, Wei-Chih Chen, Hung-Chun Cho, Ting-Chen Tseng, Yu-Hsiang Hu, Hung-Jui Kuo
  • Patent number: 12324200
    Abstract: The present disclosure relates to a semiconductor device including first and second terminals formed on a fin region and a seal layer formed between the first and second terminals. The seal layer includes a silicon carbide material doped with oxygen. The semiconductor device also includes an air gap surrounded by the seal layer, the fin region, and the first and second terminals.
    Type: Grant
    Filed: May 2, 2023
    Date of Patent: June 3, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shuen-Shin Liang, Tetsuji Ueno, Ting-Ting Chen, Chen-Han Wang, Keng-Chu Lin
  • Patent number: 12318868
    Abstract: A system to provide a texture to a surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure comprising a processing region, a support disposed in the processing region, a photon light source to generate a stream of photons, an optical module operably coupled to the photon light source, and a lens. The optical module includes a beam modulator to create a beam of photons from the stream of photons generated from the photon light source, and a beam scanner to scan the beam of photons across the surface of the component. The lens is used to receive the beam of photons from the beam scanner and distribute the beam of photons at a wavelength in a range between about 345 nm and about 1100 nm across the surface of the component to form a plurality of features on the component.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: June 3, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Gang Peng, David W. Groechel, Jenn C. Chow, Tuochuan Huang, Han Wang
  • Publication number: 20250174644
    Abstract: A disordered rocksalt (DRS) having improved characteristic has a cation comprised of lithium and one other metal and an anion comprised of oxygen and fluorine, and one or more of phosphorous, sulfur, and nitrogen. The substitution of one or more of P, S, and N on the oxygen anion site may realize improved cycle life of the battery and/or may be useful to make safer batteries.
    Type: Application
    Filed: June 1, 2023
    Publication date: May 29, 2025
    Inventors: Tanghong Yi, Han Wang, Bin Li
  • Publication number: 20250174645
    Abstract: It has been discovered that improved disordered rocksalts comprise of Mn are made by method comprising mixing a lithium compound with a metal precursor compound comprised of Mn having an oxidation state of 2 to form a mixture and heating the mixture to a temperature to form a disordered rocksalt structure. The method may realize improved cycle life with altered metal and oxygen redox of the disordered rocksalt.
    Type: Application
    Filed: June 1, 2023
    Publication date: May 29, 2025
    Inventors: Tanghong Yi, Han Wang, Bin Li
  • Publication number: 20250167662
    Abstract: A power electronic transformer includes three modules, the three modules each including: a first submodule; a second submodule; and a third submodule including a first power conversion module including N first power conversion units having input ports connected to the N output ports of the first submodule in one-to-one correspondence, and a second power conversion module including M first power conversion units having input ports connected to the M output ports of the second submodule in one-to-one correspondence, the first input port of the first submodule of the three modules has one terminal connected to three phases of a first three-phase alternating current in one-to-one correspondence, and the other terminal connected to three phases of a second three-phase alternating current in one-to-one correspondence, output ports of the N first power conversion units are connected in parallel to output ports of the M first power conversion units.
    Type: Application
    Filed: July 2, 2024
    Publication date: May 22, 2025
    Inventors: Jianwen ZHANG, Jianqiao ZHOU, Han WANG, Gang SHI, Xu CAI
  • Publication number: 20250156198
    Abstract: Systems and methods are provided for facilitating the discovery and presentations of skills and data within blocks of a canvas displayed to a user within a user interface. The data is presented to provide personalized and contextually relevant experiences as the user interacts with the data and interfaces.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 15, 2025
    Inventors: PalaniRaj KALIYAPERUMAL, Kuralmani ELANGO, Deepanjan BHOL, Jennifer J. GREGORY, Christina M. RAMSEY, Kyle Jay RINDAHL, Tom R. WEIDMAIER, Han WANG, Sai Krishna YANAMANDRA, Lily Xinchen LIU, Caeli April Ales MACLENNAN, Farhaz KARMALI, Julie STRAUSS, Per G. MIKKELSEN, Juliette Danielle WEISS
  • Patent number: 12298667
    Abstract: A method includes the following steps. A photoresist is exposed to a first light-exposure through a first mask, wherein the first mask includes a first stitching region, and a first portion of the photoresist corresponding to a first opaque portion of the first stitching region is unexposed. The photoresist is exposed to a second light-exposure through a second mask, wherein the second mask includes a second stitching region, and a second portion of the photoresist corresponding to a second opaque portion of the second stitching region is unexposed and is overlapping with the first portion of the photoresist.
    Type: Grant
    Filed: December 28, 2023
    Date of Patent: May 13, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Che Tu, Po-Han Wang, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20250148202
    Abstract: Embodiments of the present disclosure relate to semantic parsing for short text. According to embodiments of the present disclosure, a method is proposed. The method comprises: obtaining a set of sentences associated with a short text, each of the set of sentences containing all of words in the short text; determining a set of syntactic features associated with the set of sentences, each of the set of syntactic features indicating at least one of a constituency relation and a dependency relation of the corresponding sentence; and determining a semantic structure of the short text based on the set of syntactic features.
    Type: Application
    Filed: January 10, 2025
    Publication date: May 8, 2025
    Inventors: Hongyu XIONG, Han WANG, Rui LI, Yiqi FENG, Yuan GAO, Xiangyu ZENG, Qingyi LU, Bin LIU
  • Publication number: 20250140647
    Abstract: A semiconductor package and a formation method thereof are provided. The method includes: providing a device wafer, with a barrier layer covering a back surface of a semiconductor substrate, and having a through substrate via (TSV) penetrating through the barrier layer and extending into the semiconductor substrate; defining an alignment mark over the back surface of the semiconductor substrate; forming a seed layer over the back surface of the semiconductor substrate, wherein the seed layer has a recess portion corresponding to the alignment mark; forming a mask layer on the seed layer; performing a lithography process by using a redefined alignment mark formed by the recess portion of the seed layer, to form an opening through the mask layer and overlapping the TSV; filling a conductive structure in the opening; removing the mask layer and portions of the seed layer around the conductive structure; and singulating the processed device wafer.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 1, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jhih-Yu Wang, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20250143046
    Abstract: A light emitting diode package structure includes one or more lead frame units, a light emitting element, and an encapsulation unit that completely covers the light emitting element and partially covers the lead frame units. Each lead frame unit includes a chip-mounted portion, a first electrode portion, and a second electrode portion. The first and the second electrode portion extend along a first direction, and are disposed on two sides of the chip-mounted portion. Each lead frame unit further includes multiple first connecting portions extending from the chip-mounted portion along the first direction, and multiple second connecting portions formed by extension of the first and the second electrode portion along a second direction. The light emitting element is fixed to the chip-mounted portion and electrically connected to the electrode portions. A lead frame that includes the at least one lead frame unit is also provided.
    Type: Application
    Filed: October 25, 2024
    Publication date: May 1, 2025
    Inventors: HSIN-HUI LIANG, CHENG-HONG SU, CHEN-HSIU LIN, CHIH-LI YU, CHENG-HAN WANG, SHENG-YUN WANG
  • Publication number: 20250140724
    Abstract: A method includes forming a conductive pillar over and connecting to a conductive pad, dispensing a first polymer layer, wherein the first polymer layer contacts a lower portion of a sidewall of the conductive pillar, curing the first polymer layer, and dispensing a second polymer layer on the first polymer layer. The second polymer layer contacts an upper portion of the sidewall of the conductive pillar. The second polymer layer is then cured.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 1, 2025
    Inventors: Meng-Che Tu, Po-Nan Yeh, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20250134683
    Abstract: The present disclosure belongs to the technical field of drug delivery and biomimetic structures inducing cell proliferation and differentiation, and in particular relates to a micro-nano medical stent for directional, quantitative and timed controlled release of drug and a preparation method thereof. The micro-nano medical stent provided by the present disclosure is composed of an ordered fiber structure electrospun as a skeleton layer and a disordered fiber structure electrospun as an ECM layer that can both load drugs. The micro-nano medical stent can achieve directional, quantitative and timed release of drugs.
    Type: Application
    Filed: March 29, 2024
    Publication date: May 1, 2025
    Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY
    Inventors: Xun CHEN, Rongguang ZHANG, Xuanzhi ZHANG, Xin CHEN, Han WANG, Jingsong YAO
  • Patent number: 12285747
    Abstract: A method of utilizing humic acid to prepare layered humic acid/manganese oxide composite catalyst and its application, the method includes the steps of: adding sodium hypochlorite, manganese salt and humic acid to a water source, stirring and mixing; then introducing into a filter device having a filter material of manganese and a support medium, and generating a layered humic acid/manganese oxide composite catalyst on a surface of the filter material while directing a continuous water flow of the water source into the filter device with a short empty bed contact time for a short time. The catalyst can be used to effectively remove manganese to maintain an effluent with a Mn2+ concentration of not more than 20 ?g/L and to effectively remove heavy metals such as iron, manganese, arsenic, thallium, molybdenum or lead from the water source under neutral, acidic or alkaline conditions with a removal rate of 95% more.
    Type: Grant
    Filed: August 31, 2023
    Date of Patent: April 29, 2025
    Inventors: Panpan Wang, Han Wang, Jun Ma, Shiyi Qiu, Junda Yi
  • Patent number: D1074703
    Type: Grant
    Filed: March 12, 2023
    Date of Patent: May 13, 2025
    Assignee: Beijing Zitiao Network Technology Co., Ltd.
    Inventors: Han Wang, Yi Xian