Patents by Inventor HAO-CHUNG LEE
HAO-CHUNG LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240124298Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.Type: ApplicationFiled: January 10, 2023Publication date: April 18, 2024Inventors: Yun-Chung Wu, Jhao-Yi Wang, Hao Chun Yang, Pei-Wei Lee, Wen-Hsiung Lu
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Publication number: 20210159369Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: ApplicationFiled: February 1, 2021Publication date: May 27, 2021Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Patent number: 10910523Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: GrantFiled: June 11, 2018Date of Patent: February 2, 2021Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Patent number: 10147709Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.Type: GrantFiled: October 16, 2017Date of Patent: December 4, 2018Assignee: Genesis Photonics Inc.Inventors: Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20180294388Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: ApplicationFiled: June 11, 2018Publication date: October 11, 2018Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Patent number: 10090445Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.Type: GrantFiled: June 19, 2017Date of Patent: October 2, 2018Assignee: GENESIS PHOTONICS INC.Inventors: Chin-Hua Hung, Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20180261572Abstract: A manufacturing method of a semiconductor light-emitting device is provided. Steps of the manufacturing method includes: providing a substrate; placing at least one light-emitting unit on the substrate; encapsulating the at least one light-emitting unit onto the substrate by a phosphor layer and a reflective layer. The phosphor layer at least covers an upper surface of the at least one light-emitting unit, and the reflective layer surrounds the at least one light-emitting unit.Type: ApplicationFiled: May 8, 2018Publication date: September 13, 2018Applicant: Genesis Photonics Inc.Inventors: Chin-Hua Hung, Yu-Feng Lin, Cheng-Wei Hung, Hao-Chung Lee, Xun-Xain Zhan
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Patent number: 10064272Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.Type: GrantFiled: October 23, 2017Date of Patent: August 28, 2018Assignee: GENESIS PHOTONICS INC.Inventors: Hao-Chung Lee, Yu-Feng Lin, Meng-Ting Tsai
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Publication number: 20180240780Abstract: A package substrate is provided. The package substrate includes a base layer having a first surface and a second surface opposite to the first surface, a plurality of through holes penetrating the base layer, a first metal layer disposed on the first surface, and comprising an encircling portion and a plurality of upper pads arranged separately, wherein the encircling portion surrounds the upper pads to form a trench between the encircling portion and the upper pads, and a second metal layer disposed on the second surface and comprising a plurality of bottom pads arranged separately, wherein the bottom pads are electrically connected to the upper pads via the through holes respectively. The through holes are positioned under the upper pads and the encircling portion of the first metal layer is electrically floating.Type: ApplicationFiled: April 23, 2018Publication date: August 23, 2018Inventors: Hao-Chung Lee, Yu-Feng Lin, Xun-Xain Zhan
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Patent number: 9997676Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: GrantFiled: September 19, 2016Date of Patent: June 12, 2018Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20180151781Abstract: A light emitting device package structure and a manufacturing method thereof are provided. The light emitting device package structure includes a light emitting device and a protecting element. The light emitting device has an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface and a first electrode pad and a second electrode pad located on the lower surface and separated from each other. The protecting element encapsulates the side surface of the light emitting device and exposes at least portion of the upper surface, at least portion of a first bottom surface of the first electrode pad and at least portion of a second bottom surface of the second electrode pad.Type: ApplicationFiled: January 29, 2018Publication date: May 31, 2018Applicant: Genesis Photonics Inc.Inventors: Hao-Chung Lee, Yu-Feng Lin
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Patent number: 9953956Abstract: A package substrate is provided. The package substrate includes a base layer having a first surface and a second surface opposite to the first surface, a plurality of through holes penetrating the base layer, a first metal layer disposed on the first surface, and a second metal layer disposed on the second surface. The first metal layer includes a closed-loop trench. A part of the second metal layer is electrically connected to the first metal layer via the through holes. The through holes are positioned at an inner part the closed-loop trench.Type: GrantFiled: March 18, 2016Date of Patent: April 24, 2018Assignee: GENESIS PHOTONICS INC.Inventors: Hao-Chung Lee, Yu-Feng Lin, Xun-Xain Zhan
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Publication number: 20180049319Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.Type: ApplicationFiled: October 23, 2017Publication date: February 15, 2018Inventors: Hao-Chung Lee, Yu-Feng Lin, Meng-Ting Tsai
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Publication number: 20180040594Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.Type: ApplicationFiled: October 16, 2017Publication date: February 8, 2018Applicant: Genesis Photonics Inc.Inventors: Hao-Chung Lee, Yu-Feng Lin
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Patent number: 9801274Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.Type: GrantFiled: October 30, 2015Date of Patent: October 24, 2017Assignee: GENESIS PHOTONICS INC.Inventors: Hao-Chung Lee, Yu-Feng Lin, Meng-Ting Tsai
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Publication number: 20170288100Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.Type: ApplicationFiled: June 19, 2017Publication date: October 5, 2017Inventors: Chin-Hua Hung, Hao-Chung Lee, Yu-Feng Lin
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Patent number: D790487Type: GrantFiled: June 21, 2016Date of Patent: June 27, 2017Assignee: Genesis Photonics Inc.Inventors: Hao-Chung Lee, Yu-Feng Lin, Xun-Xain Zhan
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Patent number: D796456Type: GrantFiled: June 16, 2016Date of Patent: September 5, 2017Assignee: Genesis Photonics Inc.Inventors: Hao-Chung Lee, Yu-Feng Lin, Xun-Xain Zhan
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Patent number: D854195Type: GrantFiled: March 29, 2017Date of Patent: July 16, 2019Assignee: Genesis Photonics Inc.Inventors: Hao-Chung Lee, Xun-Xain Zhan, Yu-Feng Lin
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Patent number: D886751Type: GrantFiled: March 29, 2017Date of Patent: June 9, 2020Assignee: Genesis Photonics Inc.Inventors: Hao-Chung Lee, Xun-Xain Zhan, Yu-Feng Lin