Light emitting diode package
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The broken lines in the drawings are included for the purpose of illustration and form no part of the claimed design.
Claims
The ornamental design for a light emitting diode package, as shown and described.
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Type: Grant
Filed: Mar 29, 2017
Date of Patent: Jul 16, 2019
Assignee: Genesis Photonics Inc. (Tainan)
Inventors: Hao-Chung Lee (Taoyuan), Xun-Xain Zhan (Tainan), Yu-Feng Lin (Tainan)
Primary Examiner: Marcus A Jackson
Application Number: 29/598,780