Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.

Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.

Abstract: A light-emitting diode (LED) package including a rectangular carrier, an LED chip, and an encapsulant is provided. The rectangular carrier has an upper surface. The LED chip is mounted on the upper surface and is electrically connected to the rectangular carrier. The encapsulant has a curved convex surface and covers the entire upper surface and the LED chip. The encapsulant is doped with a phosphor material for converting at least parts of light emitted from the LED chip. The encapsulant doped with the phosphor material is visually neon orange when the LED chip does not emit the light.

Abstract: A package substrate is provided. The package substrate includes a base layer having a first surface and a second surface opposite to the first surface, a plurality of through holes penetrating the base layer, a first metal layer disposed on the first surface, and a second metal layer disposed on the second surface. The first metal layer includes a closed-loop trench. A part of the second metal layer is electrically connected to the first metal layer via the through holes. The through holes are positioned at an inner part the closed-loop trench.

Abstract: A semiconductor light-emitting device that includes a substrate, at least one light-emitting unit arranged on the substrate, a phosphor layer at least covering an upper surface of the at least one light-emitting unit, and a reflective layer arranged on the substrate is provided. The reflective layer surrounds the at least one light-emitting unit. A manufacturing method of a semiconductor light-emitting device is also provided.

Abstract: A chip package structure and method of manufacturing the same are provided. The chip package structure includes a substrate with a carrier surface, a chip having a first surface and a second surface positioned oppositely and a side surface connecting the first surface and the second surface, an encapsulation layer and a fluorescent layer. The second surface of the chip is disposed on the carrier surface of the substrate. The fluorescent layer fully covers the first surface of the chip. The encapsulation layer covers the carrier surface of the substrate and the side surface of the chip. A reflectivity of the encapsulation layer is at least greater than 90%.

Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.

Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

Abstract: A light emitting device package structure and a manufacturing method thereof are provided. The light emitting device package structure includes a light emitting device and a protecting element. The light emitting device has an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface and a first electrode pad and a second electrode pad located on the lower surface and separated from each other. The protecting element encapsulates the side surface of the light emitting device and exposes at least portion of the upper surface, at least portion of a first bottom surface of the first electrode pad and at least portion of a second bottom surface of the second electrode pad.

Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.

Abstract: A light emitting diode (LED) package structure including a carrier substrate, a LED and an electrostatic protection device is provided. The carrier substrate includes two leadframes separated from each other and a reflective member. The reflective member encapsulates the leadframes and exposes a carrier surface of each of the leadframes. The reflective member has a cavity, and a bottom surface of the cavity is aligned with the carrier surface of each of the leadframes. The LED is disposed inside the cavity and bridges the leadframes. The electrostatic protection device is disposed inside the cavity and bridges the leadframes. The LED is connected in anti-parallel to the electrostatic protection device.

Abstract: A quartz glass liquid level sensor includes a support frame, a light masking plate, a quartz glass tube, and a sensor module. The light masking plate is movably mounted on the support frame. The quartz glass tube is movably mounted to the support frame. One end of the quartz glass tube is securely fixed to the light masking plate. The sensor module is mounted on the support frame, for sensing a position of the light masking plate relative to the support frame.

Abstract: A support mechanism used in an electro plasma polishing process includes a support beam, a first electrically conducting assembly, and a second electrically conducting assembly. The first electrically conducting assembly and the second electrically conducting assembly are mounted on the support beam. The first electrically conducting assembly is electrically insulated from the second electrically conducting assembly.

Abstract: A cleaning device includes a first linearly driving assembly, a second linearly driving assembly, a rotation driving assembly, and a sprayer connected one by one in that order. The first linearly driving assembly drives the second linearly driving assembly, the rotation driving assembly, and the sprayer to move along a first direction. The second linearly driving assembly drives the rotation driving assembly and the sprayer to move along a second direction. The rotation driving assembly rotates the sprayer along an axis perpendicular to the first direction and the second direction.

Abstract: A system for electrolytic deburring of metal workpieces includes a power supply case, an electrolyte chamber, an anode, a cathode and a nozzle. The power supply case includes an anode connector and a cathode connector. Electrolyte is received in the electrolyte chamber. The anode holds at least one of workpiece and is immersed in the electrolyte, and electrically connected to the anode connector. The cathode is positioned in the electrolyte chamber and electrically connected to the cathode connector , and at least a part of the cathode is immersed in the electrolyte. The nozzle is positioned in the electrolyte chamber and sprays the electrolyte under pressure to form a vortex and turbulence for deburring metal. The disclosure also supplies a method of electrolytic deburring of metal.

Abstract: A support mechanism used in an electro plasma polishing process includes a support beam, a first electrically conducting assembly, and a second electrically conducting assembly. The first electrically conducting assembly and the second electrically conducting assembly are mounted on the support beam. The first electrically conducting assembly is electrically insulated from the second electrically conducting assembly.