Light emitting diode package substrate
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The broken lines are for the purpose of illustrating portions of the light emitting diode package substrate and the light emitting diode chips and form no part of the claimed design. The light shade lines on the surface portions indicate contour and not surface decoration.
Claims
The ornamental design for a light emitting diode package substrate, as shown and described.
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Type: Grant
Filed: Apr 2, 2015
Date of Patent: Nov 22, 2016
Assignee: Genesis Photonics Inc. (Tainan)
Inventors: Hao-Chung Lee (Tainan), Yu-Feng Lin (Tainan), Xun-Xain Zhan (Tainan)
Primary Examiner: Selina Sikder
Application Number: 29/522,732