Abstract: An AI-assisted automatic labeling system and a method thereof are disclosed. The method comprises steps: selecting images from microscopic images as candidate images, using a pre-labeling module to automatically label cells in the candidate images, and dividing the labeled images into training data and verification data; using a training module and the training data to train a basic model; using a verification module to verify and modify the basic model, wherein the verification module respectively verifies at least one cell area and at least one background area of the verification data to converge the basic model and form an automatic labeling model; using the automatic labeling model to automatically label cells in redundant images of the microscopic images. The basic model trained by the present invention can use few labeled images to perform regressive training and verification and then automatically labels the redundant images accurately and efficiently.

Abstract: The present disclosure provides a method and apparatus for uploading and acquiring features of wireless signals. The method for acquiring features is applied to a service end and includes: acquiring a signal feature set of wireless signals detected by a delivery party in an execution process of at least one delivery service, where delivered objects corresponding to the at least one delivery service are from a same pick-up place; identifying a target feature subset corresponding to an object pick-up stage in the signal feature set, wherein the object pick-up stage is a stage of the execution process after the delivery party arrives at the pick-up place and before the delivery party leaves the pick-up place; based on the target feature subset, determining signal features of wireless signals corresponding to the pick-up place.

Abstract: A display panel and a display device are provided. The display panel includes a display region and a non-display region. The non-display region includes a demultiplexing circuit, a fanout wire, and a clock signal line. An input terminal of the demultiplexing circuit is electrically connected to the fanout wire, an output terminal of the demultiplexing circuit is electrically connected to a data line in the display region, and a control terminal of the demultiplexing circuit is electrically connected to the clock signal line. The display panel further includes an isolation signal line including an isolation portion, and an orthographic projection of the isolation portion on a plane where a substrate is located is between an orthographic projection of the clock signal line on the plane where the substrate is located and an orthographic projection of the fanout wire on the plane where the substrate is located.

Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: A method for depth of field tracking and controlling of a pet companion robot device to interact with a pet includes the steps of: locating a target pet within a field of view of the camera; drawing a minimum target rectangle around the target pet, with sides of the minimum target rectangle parallel with the corresponding sides of the field of view of the camera; locating a center point P of the minimum target rectangle. When P is located in quadrangles I and II, adjusting the pet companion robot device to the right to make P overlap with the vertical center line of the field of view of the camera; and when P is located in quadrangles III and IV, adjusting the pet companion robot device to the left to make P overlap with the vertical center line of the field of view of the camera.

Abstract: The present invention relates to a compound of formula (I) capable of inhibiting plasmin activity and having blood coagulation and hemostasis activity, and a pharmaceutically acceptable salt, hydrate, isomer, prodrug and mixture thereof, wherein R1 to R3 are as defined in the description.

Abstract: A method for a crawl algorithm includes obtaining a plurality of web pages for a web crawler to crawl. The method also includes determining an available bandwidth for the web crawler. The method includes, for each respective web page of the plurality of web pages, determining a respective crawl value for the respective web page based on the available bandwidth and determining that the respective crawl value of the respective web page satisfies a threshold value. The method includes, in response to determining that the respective crawl value of the respective web page satisfies the threshold value, updating the respective web page in a cache memory.

Abstract: A system for remotely controlling microscopic machinery and a method thereof are provided. The system includes at least one local device and a remote host for sending a control command thereto. A microslide is placed on a microscopic camera device in the local device, and the microscopic camera device captures an image of the microslide according to a capture command in the control command. The local device transmits the image to the remote host in a video format. A motorized stage moves to a next preset position according to a movement command in the control command to capture another image of the microslide. The steps of capturing and transmitting the image and the step of moving are repeated until the microslide is captured completely. The invention can solve the problem of time delay when the image captured by the remote control microscopic camera device is displayed.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A semiconductor structure includes a first channel layer and a first barrier layer on the first channel layer. The first channel layer has a first potential well adjacent to the interface between the first channel layer and the first barrier layer. The semiconductor structure further includes a second channel layer on the first barrier layer, a second barrier layer on the second channel layer, and an intermediate layer between the second channel layer and the second barrier layer. The second channel layer has a second potential well adjacent to the interface between the second channel layer and the intermediate layer. The intermediate layer has a greater energy gap than either the first barrier layer or the second barrier layer. The energy gap of the first barrier layer is no less than the energy gap of the second barrier layer.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.

Abstract: Semiconductor structures and methods are provided. An exemplary method includes depositing a first conductive material layer over a substrate, patterning the first conductive material layer to form a first conductor plate over the substrate, forming a first high-K dielectric layer over the first conductor plate, forming a second high-K dielectric layer on the first high-K dielectric layer, forming a third high-K dielectric layer on the second high-K dielectric layer, and forming a second conductor plate over the third high-K dielectric layer and vertically overlapped with the first conductor plate, where a composition of the first high-K dielectric layer is the same as a composition of the third high-K dielectric layer and is different from a composition of the second high-K dielectric layer.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.

Abstract: The present disclosure provides a separator plate suitable for use in a proton-exchange membrane fuel cell. Also provided is a fuel cell and an article including the separator plate. Further, the present disclosure provides a fuel cell stack where each fuel cell includes the separator plate. Additionally, a closed-cathode proton-exchange membrane fuel cell stack is disclosed.

Abstract: A display device includes: a frame, including a frame body, a first protrusion disposed on the frame body, and a second protrusion disposed on the frame body, the second protrusion including at least one stepped portion; a display panel, located on a side of one stepped portion of the at least one stepped portion close to a light emitting surface of the display device and located on an inner side of the frame body; and a planar back housing, fixed on the inner side of the frame body and a side of the first protrusion away from the light emitting surface.

Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.

Abstract: This application provides techniques comprising creating a main thread and at least two task threads; determining, by the main thread, a target task thread based on a data packet corresponding to a data transmission task in response to detecting the data transmission task associated with a client device, and sending the data packet to the target task thread, where the target task thread is any one of the at least two task threads; and receiving, by the target task thread, the data packet sent by the main thread, determining, based on the data packet, a first file descriptor corresponding to the client device, and communicating with the client device by using the first file descriptor to perform data transmission.

Abstract: Disclosed herein is an electro-synthesizer unit comprising a first compartment comprising a cathode and a first electrolyte, a second compartment comprising an anode and a second electrolyte and a third compartment comprising a third electrolyte. The unit is configured to produce acid and base solution at desired concentrations. Also disclosed are methods of using the electro-synthesizer unit and producing the acid and base solution at desired concentrations.