Abstract: Manufacturing method of semiconductor package includes following steps. Bottom package is provided. The bottom package includes a die and a redistribution structure electrically connected to die. A first top package and a second top package are disposed on a surface of the redistribution structure further away from the die. An underfill is formed into the space between the first and second top packages and between the first and second top packages and the bottom package. The underfill covers at least a side surface of the first top package and a side surface of the second top package. A hole is opened in the underfill within an area overlapping with the die between the side surface of the first top package and the side surface of the second top package. A thermally conductive block is formed in the hole by filling the hole with a thermally conductive material.

Abstract: A method includes forming a protruding fin, and forming a first dielectric layer including a first dielectric layer and a second dielectric layer over the first dielectric layer. The first dielectric layer includes a first top portion on a top surface of the protruding fin, and a sidewall portion on a sidewall of the protruding fin. The second dielectric layer is over the first top portion and the top surface of the protruding fin, and is formed using an anisotropic deposition process. The method further includes forming a dummy gate electrode on the second dielectric layer, forming a gate spacer on a sidewall of the dummy gate electrode, removing the dummy gate electrode, and forming a replacement gate electrode in a space left by the dummy gate electrode.

Abstract: A semiconductor package includes an interposer that has a first side and a second side opposing the first side. A semiconductor device that is on the first side of the interposer and an optical device that is on the first side of the interposer and next to the semiconductor device. A first encapsulant layer includes a first portion and a second portion. The first portion of the first encapsulant layer is on the first side of the interposer and along sidewalls of the semiconductor device. A gap is between a first sidewall of the optical device and a second sidewall of the first portion of the first encapsulant layer. A substrate is over the second side of the interposer. The semiconductor device and the optical device are electrically coupled to the substrate through the interposer.

Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

Abstract: A wireless device includes a satellite receiver to receive data from multiple satellites. The wireless device also includes processing circuitry and memory. The memory stores one or more neural network models. The processing circuitry is operative to identify a neural network model that has been trained to adapt to a region in which the wireless device operates, classify satellite raw measurements from each satellite at a given time into a corresponding quality level using the neural network model, and identify satellite raw measurements with a quality level higher than a threshold. The location of the wireless device is calculated using the identified satellite raw measurements.

Abstract: A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.

Abstract: A package structure including a first substrate and a second substrate is provided. The first substrate includes first bumps with first lateral dimension and second bumps with second lateral dimension. The first bumps are distributed in a first region of the first substrate, and the second bumps are distributed in the second region of the first substrate, wherein the first lateral dimension is greater than the second lateral dimension, and a first bump height of the first bumps is smaller than a second bump height of the second bumps. The second substrate includes conductive terminals electrically connected to the first bumps and the second bumps.

Abstract: Aspects of the invention include techniques for improving the accuracy of access-limited neural network inference in low-voltage regimes. A non-limiting example method includes training a first machine learning model to perform input transformation for reducing low-voltage bit errors for a deep neural network operating in a low-voltage regime. The training includes inputting training data into the first machine learning model such that, in response, the first machine learning model produces transformed training data; inputting the transformed training data into a clean machine learning model and into perturbed machine learning models, the perturbed machine learning models being generated by applying random bit errors to the clean machine learning model; and optimizing the first machine learning model based on a comparison of output of the clean machine learning model and of the perturbed machine learning models compared to groundtruth labels for the training data.

Abstract: Semiconductor devices and methods of manufacture are presented. In embodiments a method of manufacturing the semiconductor device includes forming a fin from a plurality of semiconductor materials, depositing a dummy gate over the fin, depositing a plurality of spacers adjacent to the dummy gate, removing the dummy gate to form an opening adjacent to the plurality of spacers, widening the opening adjacent to a top surface of the plurality of spacers, after the widening, removing one of the plurality of semiconductor materials to form nanowires, and depositing a gate electrode around the nanowires.

Abstract: An electronic device, including a display module, a viewing angle switchable panel, a switching element, and a driving element, is provided. The display module has multiple first units and multiple second units. The first units have a first color, and the second units have a second color. The first color and the second color are different. The switching element is used to switch the viewing angle switchable panel between a first viewing angle mode and a second viewing angle mode. The driving element is used to provide a first data voltage to at least one of the first units of the display module in the first viewing angle mode, and provide a second data voltage to the at least one of the first units in the second viewing angle mode. The first data voltage and the second data voltage are different.

Abstract: The disclosure provides an electronic device including a viewing angle control structure. The viewing angle control structure includes a first substrate, a second substrate disposed opposite to the first substrate, an adjustable dielectric layer disposed between the first substrate and the second substrate, a first alignment layer disposed between the first substrate and the adjustable dielectric layer, and a second alignment layer disposed between the second substrate and the adjustable dielectric layer. One of the first alignment layer and the second alignment layer is in a horizontal alignment and the other of the first alignment layer and the second alignment layer is in a vertical alignment.

Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against a top of the shell and the brake plate. When the fan is inactive, the electromagnet is energized to produce magnetic poles that repel the magnetic member and compress the elastic element, such that the brake pin is magnetically pushed toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.

Abstract: A light-emitting device is provided. The light-emitting device includes a display panel including a substrate and a plurality of scan lines disposed on the substrate and extending in a first direction, a backlight module disposed under the display panel, and an optical film disposed above the backlight module and including a plurality of light-blocking portions and a plurality of light-transmission portions which are arranged alternately. The light blocking portions extend in a second direction, and the first direction and the second direction are not parallel.

Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against the brake plate and the electromagnet. When the fan is powered off, the electromagnet is energized and produces magnetic poles that magnetically repel the magnetic member, such that the brake pin is pushed by a magnetic force and the elastic element toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.

Abstract: A fan brake structure includes a fan and a brake device. The fan has a frame body, a fan impeller and a stator. The brake device is disposed under a bottom of a bearing cup. The brake device has a driving member, a brake member and an elastic member. The elastic member abuts against one end of the brake member. The other end of the brake member has a boss body. The driving member has a spiral rail. When the driving member rotates, the boss body moves along the spiral rail, whereby the brake member linearly reciprocally moves upward to brake the fan impeller or linearly reciprocally moves downward to release the fan impeller from the braking.

Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against a top of the shell and the brake plate. When the fan is inactive, the electromagnet is energized to produce magnetic poles that repel the magnetic member and compress the elastic element, such that the brake pin is magnetically pushed toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.

Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against the brake plate and the electromagnet. When the fan is powered off, the electromagnet is energized and produces magnetic poles that magnetically repel the magnetic member, such that the brake pin is pushed by a magnetic force and the elastic element toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.

Abstract: A fan brake structure includes a fan and a brake device. The fan has a frame body, a fan impeller and a stator. The brake device is disposed under a bottom of a bearing cup. The brake device has a driving member, a brake member and an elastic member. The elastic member abuts against one end of the brake member. The other end of the brake member has a boss body. The driving member has a spiral rail. When the driving member rotates, the boss body moves along the spiral rail, whereby the brake member linearly reciprocally moves upward to brake the fan impeller or linearly reciprocally moves downward to release the fan impeller from the braking.

Abstract: An electronic device, including a display module, a viewing angle switchable panel, a switching element, and a driving element, is provided. The display module has multiple first units and multiple second units. The first units have a first color, and the second units have a second color. The first color and the second color are different. The switching element is used to switch the viewing angle switchable panel between a first viewing angle mode and a second viewing angle mode. The driving element is used to provide a first data voltage to at least one of the first units of the display module in the first viewing angle mode, and provide a second data voltage to the at least one of the first units in the second viewing angle mode. The first data voltage and the second data voltage are different.

Abstract: An electronic device is provided. The electronic device includes first and second viewing angle adjusting units, a display unit, and first to third polarizers. The display unit is disposed between the first and second viewing angle adjusting units. The first and second viewing angle adjusting units are respectively disposed between the first and second polarizers and between the second and third polarizers. The first viewing angle adjusting unit and the display unit share the second polarizer. The first polarizer have a first side and a second side closer to the display unit than the first side. A light from the display unit passes through the first viewing angle adjusting unit and the first polarizer to provide an output light from the first side. An angle of an absorption axis of the second polarizer and an angle of an absorption axis of the third polarizer are the same.