Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.

Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

Abstract: An electronic device may be provided with a cover layer and a phased antenna array mounted against the cover layer. Each antenna in the array may include a first patch element that is directly fed using first and second feeds and a second patch element that is directly fed using third and fourth feeds. A slot element may be formed in the first patch element. The first patch element may radiate in a first frequency band through the cover layer. The slot element may radiate in a second frequency band that is higher than the first frequency band through the cover layer. The second patch element may indirectly feed the slot element. Locating the radiating elements for each frequency band in the same plane may allow the antenna to radiate through the cover layer in both frequency bands with satisfactory antenna efficiency.

Abstract: An electronic device may be provided with first and second sidewalls, a rear wall, and a display. Multiple antenna panels may be used to convey radio-frequency signals at frequencies greater than 10 GHz. A first antenna panel may radiate through the display while second and third panels radiate through the first and second sidewalls. The second and third panels may be tilted at non-zero angles with respect to the sidewalls. The non-zero angles may be of opposite sign. The non-zero angles may have the same magnitude. The magnitude may be equal to 15 degrees, as one example. Tilting the panels in this way may allow the panels to collectively cover as much of a sphere around the device as possible, including out of coverage areas behind the rear wall caused by conductive material in the rear wall, without requiring additional panels to be disposed within the device.

Abstract: An electronic device may be provided with an antenna module. A phased antenna array of dielectric resonator antennas may be disposed within the antenna module. The dielectric resonator antennas may include dielectric columns excited by feed probes. A flexible printed circuit may include transmission lines coupled to the feed probes. The flexible printed circuit may have a first end coupled to the antenna module and extending towards peripheral conductive housing structures forming an additional antenna and a second end coupled to transceiver circuitry. Ground traces on the flexible printed circuit may be shorted to ground structures at the first and second ends to improve the antenna efficiency of the additional antenna. The flexible printed circuit may include an elongated slot with overlapping conductive structures and laterally surrounded by a fence of conductive vias to improve the flexibility of the flexible printed circuit while providing satisfactory antenna performance.

Abstract: An electronic device may be provided with a phased antenna array that radiates at a frequency greater than 10 GHz. The array may include a dielectric resonator antenna having a dielectric column with non-planar sidewalls that include planar portions and corrugated portions with grooves and ridges, that include sidewall steps, and/or that include angled sidewall portions. The dielectric resonator antenna may include a first dielectric column and a second dielectric column stacked on the first dielectric column. The second column may be narrower and may have a higher dielectric constant than the first column or may have the same width but a lower dielectric constant than the first column. This may serve to broaden the bandwidth of the dielectric resonator antenna relative to scenarios where the dielectric resonator antenna includes only a single dielectric resonating element having only planar sidewalls.

Abstract: A radio frequency system package may include waveguides and loading blocks. The loading blocks may include dielectric material having a high dielectric constant between 13 and 20. Additionally, the loading blocks may be made of mold, epoxy, or the like material, and the loading blocks may fit into a region cut out of the waveguides. Moreover, the loading blocks may lower the cut-off frequency for wireless communication otherwise provided by the waveguides without the loading blocks (e.g., 28 GHz). In particular, the loading blocks may facilitate communication in low mmWave frequencies, such as 24 GHz.

Abstract: An electronic device may have a first conductive sidewall at an upper end, a second conductive sidewall at a lower end, and a conductive rear wall. First and second antennas may be formed at the upper end and may include slots with edges defined by the first sidewall and the rear wall. Third, fourth, fifth, and sixth antennas may be formed at the lower end and may include slots with edges defined by the second sidewall and the rear wall. Each antenna may cover multiple frequency bands. First order and third order modes of the slots may contribute to the frequency responses of the third through sixth antennas. A display controller may be mounted at the lower end and may impose a lower limit on the frequencies covered by the third through sixth antennas. The first and second antennas may cover lower frequencies than the third through sixth antennas.

Abstract: An electronic device may be provided with a sidewall and an antenna module pressed against an interior surface of the sidewall. The module may include a phased antenna array. The sidewall may have apertures aligned with respective antenna in the array. The antennas may convey radio-frequency signals in first and second frequency bands greater than 10 GHz and with vertical and horizontal polarizations. Each aperture may include a corresponding cavity with non-linear cavity walls. The antennas may excite resonant cavity modes of the cavities that cause the cavities to radiate the radio-frequency signals as waveguide radiators. At the same time, the apertures may form a smooth impedance transition between the antennas and free space for the radio-frequency signals of both the horizontal and vertical polarizations.

Abstract: A testing system may include a test electronic device having a test antenna disposed in a first signal path of a first antenna array of an electronic device. The test antenna may receive a first signal from the first antenna array. The testing system may also include a reflector disposed in a second signal path of a second antenna array of the electronic device. The reflector may reflect a second signal from the second antenna array to the test antenna. The reflector may include a flat, parabolic, or elliptical curvature that reflects a radio frequency signal emitted by the second antenna array to the test antenna.

Abstract: An electronic device may have an antenna that conveys radio-frequency signals at frequencies greater than 10 GHz. The antenna may be embedded in a substrate. The substrate may have routing layers, first antenna layers on the routing layers, second antenna layers on the first antenna layers, and a third antenna layers on the second antenna layers. The antenna may include first traces on the first antenna layers, second traces on the second antenna layers, and third traces on the third antenna layers. The first antenna layers may have a first bulk dielectric permittivity. The second layers may have a second bulk dielectric permittivity. The third layers may have a third bulk dielectric permittivity. At least one of the first, second, and third bulk dielectric permittivities may be different from the others. This may differentially load the antenna across the antenna layers, thereby broadening the bandwidth of the antenna.

Abstract: An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.

Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

Abstract: An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.

Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

Abstract: An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

Abstract: An electronic device may be provided with an antenna module. A phased antenna array of dielectric resonator antennas may be disposed within the antenna module. The dielectric resonator antennas may include dielectric columns excited by feed probes. A flexible printed circuit may include transmission lines coupled to the feed probes. The flexible printed circuit may have a first end coupled to the antenna module and extending towards peripheral conductive housing structures forming an additional antenna and a second end coupled to transceiver circuitry. Ground traces on the flexible printed circuit may be shorted to ground structures at the first and second ends to improve the antenna efficiency of the additional antenna. The flexible printed circuit may include an elongated slot with overlapping conductive structures and laterally surrounded by a fence of conductive vias to improve the flexibility of the flexible printed circuit while providing satisfactory antenna performance.

Abstract: An electronic device may be provided with a transceiver, a substrate, and antennas mounted to the substrate. The transceiver and antennas may convey signals between 10 GHz and 300 GHz. A radio-frequency connector may be mounted to the substrate. A coaxial cable may couple the transceiver to the connector. A stripline in the substrate may couple the connector to the antennas. Impedance matching structures may be embedded in the substrate for matching an impedance of the stripline to an impedance of the coaxial cable. The impedance matching structures may include a fence of conductive vias, landing pads, and a volume of the dielectric substrate defined by the fence of conductive vias and the landing pads. The impedance matching structures may be configured to perform impedance matching over a relatively wide bandwidth that includes the frequency band of operation for the antennas.

Abstract: An electronic device may have an antenna that conveys radio-frequency signals at frequencies greater than 10 GHz. The antenna may be embedded in a substrate. The substrate may have routing layers, first antenna layers on the routing layers, second antenna layers on the first antenna layers, and a third antenna layers on the second antenna layers. The antenna may include first traces on the first antenna layers, second traces on the second antenna layers, and third traces on the third antenna layers. The first antenna layers may have a first bulk dielectric permittivity. The second layers may have a second bulk dielectric permittivity. The third layers may have a third bulk dielectric permittivity. At least one of the first, second, and third bulk dielectric permittivities may be different from the others. This may differentially load the antenna across the antenna layers, thereby broadening the bandwidth of the antenna.

Abstract: An electronic device may be provided with a phased antenna array that radiates at a frequency greater than 10 GHz through a display. The array may include a dielectric resonator antenna having a dielectric column. The dielectric column may have a first surface mounted to a circuit board and a second surface that faces the display. A conductive cap may be formed on the second surface. The conductive cap may allow the dimensions of dielectric column to be reduced while still allowing the dielectric resonator antenna to cover a frequency band of interest. If desired, the phased antenna array may include multiple sets of dielectric resonator antennas for covering different frequency bands. The sets may have different dielectric column heights and/or different conductive cap sizes.