Abstract: Devices and techniques for temperature informed memory refresh are described herein. A temperature counter can be updated in response to a memory device write performed under an extreme temperature. Here, the write is performed on a memory device element in the memory device. The memory device element can be sorted above other memory device elements in the memory device based on the temperature counter. Once sorted to the top of these memory device elements, a refresh can be performed the memory device element.

Abstract: Various examples are directed to systems and methods of managing a memory device. The memory device may receive a read request describing a logical address at the memory device. The memory device may obtain a table entry associated with the logical address. The table entry comprises a physical address corresponding to the logical address and a write temperature data indicating a write temperature for the logical address. The memory device may determine a corrected threshold voltage for reading the physical address based at least in part on the write temperature data and read the physical address using the corrected threshold voltage.

Abstract: Disclosed in some examples are NAND devices, firmware, systems, methods, and devices that apply smart algorithms to process ECC errors by taking advantage of excess overprovisioning. In some examples, when the amount of overprovisioned blocks are above a predetermined threshold, a first ECC block error handling mode may be implemented and when the overprovisioned blocks are equal or less than the predetermined threshold, a second mode of ECC block error handling may be utilized.

Abstract: A variety of applications can include apparatus and/or methods that include tracking data temperatures of logical block addresses for a memory device by operating multiple accumulators by one or more data temperature analyzers to count host writes to ranges of logical block addresses. Data temperature for data written by a host is a measure of how frequently data at a logical block address is overwritten. In various embodiments, tracking can include staggering the start of counting by each of the multiple accumulators to provide subsequent binning of logical block addresses bands into temperature zones, which can achieve better data segregation. Data having a logical block address received from a host can be routed to a block associated with a temperature zone based on the binning provided by the staggered operation of the multiple accumulators by one or more data temperature analyzers. Additional apparatus, systems, and methods are disclosed.

Abstract: A variety of applications can include apparatus and/or methods of operating the apparatus that include a memory device having read levels that can be calibrated. A calibration controller implemented with the memory device can trigger a read level calibration based on inputs from one or more trackers monitoring parameters associated with the memory device and a determination of an occurrence of at least one event from a set of events related to the monitored parameters. The monitored parameters can include parameters related to a selected time interval and measurements of read, erase, or write operations of the memory device. Additional apparatus, systems, and methods are disclosed.

Abstract: A variety of applications can include apparatus and/or methods that provide parity data protection to data in a memory system for a limited period of time and not stored as permanent parity data in a non-volatile memory. Parity data can be accumulated in a volatile memory for data programmed via a group of access lies having a specified number of access lines in the group. A read verify can be issued to selected pages after programming finishes at the end of programming via the access lines of the group. With the programming of the data determined to be acceptable at the end of programming via the last of the access lines of the group, the parity data in the volatile memory can be discarded and accumulation can begin for a next group having a specified number of access lines. Additional apparatus, systems, and methods are disclosed.

Abstract: Devices and techniques for read voltage calibration of a flash-based storage system based on host IO operations are disclosed. In an example, a memory device includes a NAND memory array having groups of multiple blocks of memory cells, and a memory controller to optimize voltage calibration for reads of the memory array. In an example, the optimization technique includes monitoring read operations occurring to a respective block, identifying a condition to trigger a read level calibration based on the read operations, and performing the read level calibration for the respective block or a memory component that includes the respective block. In a further example, the calibration is performed based on a threshold voltage to read the respective block, which may be considered when the threshold voltage to read the respective block is evaluated within a sampling operation performed by the read level calibration.

Abstract: Devices and techniques for NAND temperature data management are disclosed herein. A command to write data to a NAND component in the NAND device is received at a NAND controller of the NAND device. A temperature corresponding to the NAND component is obtained in response to receiving the command. The command is then executed to write data to the NAND component and to write a representation of the temperature. The data is written to a user portion and the representation of the temperature is written to a management portion that is accessible only to the controller and segregated from the user portion.

Abstract: Devices and techniques temperature sensitive NAND programming are disclosed herein. A device controller can receive a command to write data to a component of the device. A temperature can be obtained in response to the command, and the temperature can be combined with a temperature compensation value to calculate a verification level. The command can then be executed in accordance with the verification level.

Abstract: Disclosed in some examples, are methods, systems, and machine readable mediums which compensate for read-disturb effects by shifting the read voltages used to read the value in a NAND cell based upon a read counter. For example, the NAND memory device may have a read counter that corresponds to a group of NAND cells (e.g., a page, a block, a superblock). Anytime a NAND cell in the group is read, the read counter may be incremented. The read voltage, Vread, may be adjusted based on the read counter to account for the read disturb voltage.

Abstract: A memory device may receive a read request describing a logical address at the memory device. The memory device may obtain a table entry associated with the logical address. The table entry comprises a physical address corresponding to the logical address and a write temperature data indicating a write temperature for the logical address. The memory device may determine a corrected threshold voltage for reading the physical address based at least in part on the write temperature data and read the physical address using the corrected threshold voltage.

Abstract: Disclosed in some examples are systems, methods, memory devices, and machine readable mediums for a fast secure data destruction for NAND memory devices that renders data in a memory cell unreadable. Instead of going through all the erase phases, the memory device may remove sensitive data by performing only the pre-programming phase of the erase process. Thus, the NAND doesn't perform the second and third phases of the erase process. This is much faster and results in data that cannot be reconstructed. In some examples, because the erase pulse is not actually applied and because this is simply a programming operation, data may be rendered unreadable at a per-page level rather than a per-block level as in traditional erases.

Abstract: Systems and methods are disclosed, including maintaining an error recovery data structure for a set of codewords (CWs) in a storage system and performing error recovery for the set of CWs using a set of error handing (EH) steps until each CW of the set of CWs are indicated as correctable in the error recovery data structure. The error recovery can include determining if each CW of the set of CWs is correctable by an EH step, storing indications of CWs determined correctable by the EH step in the error recovery data structure, determining if one or more CW in the set of CWs are not indicated as correctable in the error recovery data structure, and, in response to determining that one or more CW in the set of CWs are not indicated as correctable in the error recovery data structure, incrementing the specific EH step.

Abstract: Devices and techniques for temperature informed memory refresh are described herein. A temperature counter can be updated in response to a memory device write performed under an extreme temperature. Here, the write is performed on a memory device element in the memory device. The memory device element can be sorted above other memory device elements in the memory device based on the temperature counter. Once sorted to the top of these memory device elements, a refresh can be performed the memory device element.

Abstract: Devices and techniques for managing partial superblocks in a NAND device are described herein. A set of superblock candidates is calculated. Here, a superblock may have a set of blocks that share a same position in each plane in each die of a NAND array of the NAND device. A set of partial super block candidates is also calculated. A partial superblock candidate is a superblock candidate that has at least one plane that has a bad block. A partial superblock use classification may then be obtained. Superblocks may be established for the NAND device by using members of the set of superblock candidates after removing the set of partial superblock candidates from the set of superblock candidates. Partial superblocks may then be established for classes of data in the NAND device according to the partial superblock use classification.

Abstract: A variety of applications can include systems and/or methods of optimizing results from scanning a memory device, where the memory device has stacked multiple reliability specifications. Information about a block of multiple blocks of a memory device can be logged, where the information is associated with a combination of reliability specifications. A refresh of the block can be triggered based on exceeding a threshold condition for the combination of reliability specifications. Additional apparatus, systems, and methods are disclosed.

Abstract: Disclosed in some examples are techniques for handling parity data of a non-volatile memory device with limited cache memory. In certain examples, user data can be programmed into the non-volatile memory of the non-volatile memory device in data stripes, and parity information can be calculated for each individual data stripe within a limited capacity cache of the non-volatile memory device. The individual parity information can be swapped between a swap block of the non-volatile memory and the limited capacity cache as additional data stripes are programmed.

Abstract: Disclosed in some examples are systems, methods, memory devices, and machine readable mediums for a fast secure data destruction for NAND memory devices that renders data in a memory cell unreadable. Instead of going through all the erase phases, the memory device may remove sensitive data by performing only the pre-programming phase of the erase process. Thus, the NAND doesn't perform the second and third phases of the erase process. This is much faster and results in data that cannot be reconstructed. In some examples, because the erase pulse is not actually applied and because this is simply a programming operation, data may be rendered unreadable at a per-page level rather than a per-block level as in traditional erases.

Abstract: Devices and techniques temperature sensitive NAND programming are disclosed herein. A device controller can receive a command to write data to a component of the device. A temperature can be obtained in response to the command, and the temperature can be combined with a temperature compensation value to calculate a verification level. The command can then be executed in accordance with the verification level.

Abstract: Various examples are directed to systems and methods for reading a memory component. A processing device may receive an indication that a read operation at a physical address of the memory component failed. The processing device may execute a plurality of read retry operations at the physical address. The processing device may access a first syndrome weight describing a first error correction operation performed on a result of a first read retry operation of the plurality of read retry operations and a second syndrome weight describing a second error correction operation performed on a result of a second read retry operation of the plurality of read retry operations. The processing device may select a first threshold voltage associated with the first read retry operation based at least in part on the first syndrome weight and the second syndrome weight.