Abstract: There is provided an optical recording medium-manufacturing apparatus that is capable of accurately transferring a disk-shaped apparatus during a manufacturing process, and at the same time occupies a small installation area. A control section causes a cut-forming machine installed at a cut-forming location to form a cut in a resin layer of a disk-shaped substrate, then causes an indexing mechanism to rotate a transfer stage to thereby transfer the disk-shaped substrate formed with the cut to a central hole-forming location, and then causes a punching machine to punch a central hole.

Abstract: When manufacturing an optical recording medium by forming a resin layer on a surface of a substrate and then forming a center hole that passes through the substrate and the resin layer, a method of manufacturing an optical recording medium according to the present invention forms the center hole by forming, in the resin layer, a circular cut with a larger diameter than the center hole so as to surround a formation position of the center hole and then pressing in a punching blade for forming the center hole from a rear surface side of the substrate. By doing so, detachment of the resin layer and the production of burrs at or near the center hole can be avoided while reducing the manufacturing cost.

Abstract: An optical recording medium-manufacturing apparatus which is capable of reducing wear of a cut-forming blade section used for forming a cut in a resin layer, without increasing the component costs of the apparatus. An ultrasonic horn includes a hollow-cylindrical cut-forming blade section for being pushed into a resin layer formed on one side of a disk-shaped substrate, thereby forming a circular cut in the resin layer. A control section controls motion of the ultrasonic horn caused by a moving mechanism. The control section causes the ultrasonic horn to be pushed in to the resin layer while causing ultrasonic vibration thereof to thereby form the cut, and while maintaining a state of ultrasonic vibration of the abutment section and a pushed-in state of the cut-forming blade section, causes the punching blade section to be pushed into the disk-shaped substrate, to form the central hole.

Abstract: The invention is directed to reduction of torque by reduction of an outside diameter of a mounting head. A cylindrical cam rotation motor is provided under a nozzle rotation motor. A first rotation axis member as a rotor of the nozzle rotation motor is provided along an axis line of a nozzle holder and penetrates into the nozzle rotation motor and the cylindrical cam rotation motor. A second rotation axis member as a rotor of the cylindrical cam rotation motor is provided along an axis line of a cylindrical cam member and penetrates into the cylindrical cam rotation motor. A suction nozzle to be used protrudes from a lower end surface of the nozzle holder at a protrusion position.

Abstract: The invention is directed to performing electronic component mounting operations by the suction nozzles of the mounting heads in each of the plurality of the rotary tables independently, moving each of the positioning tables for positioning a printed board in a component mounting position independently, and performing the electronic component mounting operation on the plurality of the printed boards independently. A component feeding device moves a plurality of component feeding tables having a plurality of component feeding units in an arraying direction thereof respectively and independently. Mounting heads having a plurality of suction nozzles for picking up electronic components from the component feeding devices respectively are provided at predetermined intervals corresponding to intermittent pitches on an outer circumference of two rotary tables intermittently rotating.

Abstract: This invention is directed to the prevention of the deterioration of the accuracy in component mounting by suppressing the temperature rise of the moving member as much as possible by cooling the moving member, which is the heat source of a linear motor. The moving member 48 of the linear motor 14 is configured in the following manner for achieving the objective of this invention. That is, the heat dissipation portion, the axis 17 made of the material with efficient thermal conduction such as aluminum, pierces through the iron core 18 around which coils 20 are wound. The moving member except a part of the axis 17 is molded with synthetic resin, and at one end of the axis 17, the heat dissipation fin 19 which makes heat dissipation area larger is formed. And this heat dissipation fin 19 is placed to face the air exhaust port 67.

Abstract: An optical recording medium-manufacturing apparatus which is capable of reducing wear of a cut-forming blade section used for forming a cut in a resin layer, without increasing the component costs of the apparatus. An ultrasonic horn includes a hollow-cylindrical cut-forming blade section for being pushed into a resin layer formed on one side of a disk-shaped substrate, thereby forming a circular cut in the resin layer. A control section controls motion of the ultrasonic horn caused by a moving mechanism. The control section causes the ultrasonic horn to be pushed in to the resin layer while causing ultrasonic vibration thereof to thereby form the cut, and while maintaining a state of ultrasonic vibration of the abutment section and a pushed-in state of the cut-forming blade section, causes the punching blade section to be pushed into the disk-shaped substrate, to form the central hole.

Abstract: There is provided an optical recording medium-manufacturing apparatus that is capable of accurately transferring a disk-shaped apparatus during a manufacturing process, and at the same time occupies a small installation area. A control section causes a cut-forming machine installed at a cut-forming location to form a cut in a resin layer of a disk-shaped substrate, then causes an indexing mechanism to rotate a transfer stage to thereby transfer the disk-shaped substrate formed with the cut to a central hole-forming location, and then causes a punching machine to punch a central hole.

Abstract: There is provided an optical recording medium-manufacturing apparatus that is capable of avoiding breakage of a substrate while avoiding formation of a central hole off-center with respect to the substrate. A control section causes the vertical movement section to move an ultrasonic horn in directions toward and away from the cutting edge of a punching blade section to thereby cause the ultrasonic horn to press the disk-shaped substrate and at the same cause an ultrasonic generator to perform ultrasonic vibration at least from a time point at which the disk-shaped substrate is brought into contact with the cutting edge of the punching blade section to a time point at which the punching of the central hole is completed.

Abstract: There is provided a cut-forming machine which is capable of preventing movement of a substrate caused by movement of a cut-forming blade section, a vertical movement mechanism moves at least one of a table for supporting a disk-shaped substrate and a cut-forming blade section toward the other of them, thereby pushing the cut-forming blade section into a light transmission layer of the substrate. A spring urges an urging portion disposed in a central portion of the cut-forming blade section, from at least a time point of completion of pushing the cut-forming blade section into the light transmission layer to a time point of removal of the cut-forming blade section from the light transmission layer, thereby causing the urging portion to urge a central portion of the disk-shaped substrate toward the table.

Abstract: The present invention provides a silicon nitride ceramic substrate composed of a silicon nitride sintered body in which maximum size of pore existing in grain boundary phase of the sintered body is 0.3 &mgr;m or less, and having a thermal conductivity of 50 W/mK or more and a three point bending strength of 500 MPa or more, wherein a leak current is 1000 nA or less when an alternative voltage of 1.5 kV-100 Hz is applied to a portion between front and back surfaces of the silicon nitride sintered body under conditions of a temperature of 25° C. and a relative humidity of 70%. According to the above structure of the present invention, there can be provided a silicon nitride ceramic substrate capable of effectively suppressing a leak current generation when the above substrate is assembled into various power modules and circuit boards, and capable of greatly improving insulating property and operative reliability of power modules in which output power and capacity are greatly increased.

Abstract: The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit portion bonded to at least one main surface of the ceramic substrate; wherein each of ratios of Ra1/Ra2 and Ra2/Ra1 is 1.5 or less in which a surface roughness in terms of arithmetical average surface roughness Ra in arbitral one direction of the ceramic substrate is Ra1 while a surface roughness Ra in a direction normal to the one direction of the ceramic substrate is Ra2, and a breakdown voltage of the ceramic substrate is 20 kV/mm or more. According to the above structure of the present invention, there can be provided a ceramic circuit board having an excellent heat-cycle resistance and bending strength characteristics without impairing a heat radiating property, and capable of increasing an operating reliability as electronic device.

Abstract: Apparatus for feeding electronic components comprises a slide base, a plurality of tape cassettes mounted on the slide base, a linear motor 14, and a control unit for the motor. The control unit includes a motor driver 61, a memory device 66, and a control device 67 which controls the motor driver 61 using data stored in the memory device 66. The control device 67 adjusts the data for controlling the motor according to the load weight of the slide base. The data is used for properly moving the slide base carrying a plurality of tape cassettes to a position for feeding the components.

Abstract: The present invention provides a silicon nitride ceramic substrate composed of a silicon nitride sintered body in which maximum size of pore existing in grain boundary phase of the sintered body is 0.3 &mgr;m or less, and having a thermal conductivity of 50 W/mK or more and a three point bending strength of 500 MPa or more, wherein a leak current is 1000 nA or less when an alternative voltage of 1.5 kV-100 Hz is applied to a portion between front and back surfaces of the silicon nitride sintered body under conditions of a temperature of 25° C. and a relative humidity of 70%. According to the above structure of the present invention, there can be provided a silicon nitride ceramic substrate capable of effectively suppressing a leak current generation when the above substrate is assembled into various power modules and circuit boards, and capable of greatly improving insulating property and operative reliability of power modules in which output power and capacity are greatly increased.

Abstract: The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit portion bonded to at least one main surface of the ceramic substrate; wherein each of ratios of Ra1/Ra2 and Ra2/Ra1 is 1.5 or less in which a surface roughness in terms of arithmetical average surface roughness Ra in arbitral one direction of the ceramic substrate is Ra1 while a surface roughness Ra in a direction normal to the one direction of the ceramic substrate is Ra2, and a breakdown voltage of the ceramic substrate is 20 kV/mm or more. According to the above structure of the present invention, there can be provided a ceramic circuit board having an excellent heat-cycle resistance and bending strength characteristics without impairing a heat radiating property, and capable of increasing an operating reliability as electronic device.

Abstract: This invention is directed to the prevention of the deterioration of the accuracy in component mounting by suppressing the temperature rise of the moving member as much as possible by cooling the moving member, which is the heat source of a linear motor. The moving member 48 of the linear motor 14 is configured in the following manner for achieving the objective of this invention. That is, the heat dissipation portion, the axis 17 made of the material with efficient thermal conduction such as aluminum, pierces through the iron core 18 around which coils 20 are wound. The moving member except a part of the axis 17 is molded with synthetic resin, and at one end of the axis 17, the heat dissipation fin 19 which makes heat dissipation area larger is formed. And this heat dissipation fin 19 is placed to face the air exhaust port 67.

Abstract: Apparatus for feeding electronic components comprises a slide base, a plurality of tape cassettes mounted on the slide base, a linear motor 14, and a control unit for the motor. The control unit includes a motor driver 61, a memory device 66, and a control device 67 which controls the motor driver 61 using data stored in the memory device 66. The control device 67 adjusts the data for controlling the motor according to the load weight of the slide base. The data is used for properly moving the slide base carrying a plurality of tape cassettes to a position for feeding the components.