Patents by Inventor Hayato TAKAKURA

Hayato TAKAKURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11183448
    Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: November 23, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hayato Takakura, Shuichi Wakaki, Shusaku Shibata, Yoshihiro Kawamura, Masaki Ito
  • Publication number: 20210298175
    Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Masaki ITO, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Patent number: 11122676
    Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: September 14, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki, Shusaku Shibata
  • Publication number: 20210243900
    Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.
    Type: Application
    Filed: April 22, 2021
    Publication date: August 5, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takahiro TAKANO, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Patent number: 11081437
    Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: August 3, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Yoshihiro Kawamura, Hayato Takakura, Takahiro Takano, Shuichi Wakaki
  • Patent number: 11058002
    Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: July 6, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Hayato Takakura, Masaki Ito, Yoshihiro Kawamura, Shuichi Wakaki
  • Publication number: 20210195070
    Abstract: An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.
    Type: Application
    Filed: October 2, 2018
    Publication date: June 24, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Yoshihiro KAWAMURA, Masaki ITO, Shuichi WAKAKI
  • Patent number: 11032913
    Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: June 8, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Takahiro Takano, Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki
  • Publication number: 20210084750
    Abstract: A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.
    Type: Application
    Filed: September 5, 2018
    Publication date: March 18, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshihiro KAWAMURA, Shusaku SHIBATA, Hayato TAKAKURA, Masaki ITO
  • Publication number: 20200344888
    Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.
    Type: Application
    Filed: November 6, 2017
    Publication date: October 29, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Takahiro TAKANO, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Patent number: 10813221
    Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: October 20, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shusaku Shibata, Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki
  • Publication number: 20200288575
    Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.
    Type: Application
    Filed: September 6, 2018
    Publication date: September 10, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Masaki ITO, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Publication number: 20200154016
    Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.
    Type: Application
    Filed: April 25, 2018
    Publication date: May 14, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI, Shusaku SHIBATA
  • Publication number: 20200105656
    Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.
    Type: Application
    Filed: April 4, 2018
    Publication date: April 2, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Yoshihiro KAWAMURA, Hayato TAKAKURA, Takahiro TAKANO, Shuichi WAKAKI
  • Publication number: 20200075474
    Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.
    Type: Application
    Filed: April 23, 2018
    Publication date: March 5, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Shuichi WAKAKI, Shusaku SHIBATA, Yoshihiro KAWAMURA, Masaki ITO
  • Publication number: 20200077520
    Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.
    Type: Application
    Filed: April 25, 2018
    Publication date: March 5, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Patent number: 9173301
    Abstract: A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A projection of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion. An end surface of the projection is positioned inward from an end of the cover insulating layer. An insert portion of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of the end of the cover insulating layer. A projection of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the projection of the wiring cover layer.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: October 27, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventor: Hayato Takakura
  • Publication number: 20150027752
    Abstract: A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A projection of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion. An end surface of the projection is positioned inward from an end of the cover insulating layer. An insert portion of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of the end of the cover insulating layer. A projection of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the projection of the wiring cover layer.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 29, 2015
    Inventor: Hayato TAKAKURA
  • Publication number: 20140311776
    Abstract: A voltage is applied between a stainless steel plate and an electrode such that the stainless steel plate is an anode, whereby a passive film formed at a portion to be plated of the stainless steel plate melts due to the reduction reaction and is removed. Thereafter, a voltage is applied between the stainless steel plate and the electrode such that the stainless steel plate is a cathode, whereby a plating underlayer is formed at the portion to be plated of the stainless steel plate from which the passive film is removed.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 23, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventor: Hayato TAKAKURA