Patents by Inventor Hayato TAKAKURA

Hayato TAKAKURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200154016
    Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.
    Type: Application
    Filed: April 25, 2018
    Publication date: May 14, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI, Shusaku SHIBATA
  • Publication number: 20200105656
    Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.
    Type: Application
    Filed: April 4, 2018
    Publication date: April 2, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Yoshihiro KAWAMURA, Hayato TAKAKURA, Takahiro TAKANO, Shuichi WAKAKI
  • Publication number: 20200077520
    Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.
    Type: Application
    Filed: April 25, 2018
    Publication date: March 5, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku SHIBATA, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
  • Publication number: 20200075474
    Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.
    Type: Application
    Filed: April 23, 2018
    Publication date: March 5, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Shuichi WAKAKI, Shusaku SHIBATA, Yoshihiro KAWAMURA, Masaki ITO
  • Patent number: 9173301
    Abstract: A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A projection of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion. An end surface of the projection is positioned inward from an end of the cover insulating layer. An insert portion of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of the end of the cover insulating layer. A projection of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the projection of the wiring cover layer.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: October 27, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventor: Hayato Takakura
  • Publication number: 20150027752
    Abstract: A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A projection of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion. An end surface of the projection is positioned inward from an end of the cover insulating layer. An insert portion of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of the end of the cover insulating layer. A projection of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the projection of the wiring cover layer.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 29, 2015
    Inventor: Hayato TAKAKURA
  • Publication number: 20140311776
    Abstract: A voltage is applied between a stainless steel plate and an electrode such that the stainless steel plate is an anode, whereby a passive film formed at a portion to be plated of the stainless steel plate melts due to the reduction reaction and is removed. Thereafter, a voltage is applied between the stainless steel plate and the electrode such that the stainless steel plate is a cathode, whereby a plating underlayer is formed at the portion to be plated of the stainless steel plate from which the passive film is removed.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 23, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventor: Hayato TAKAKURA