Patents by Inventor Hayato TAKAKURA
Hayato TAKAKURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220192010Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.Type: ApplicationFiled: March 5, 2020Publication date: June 16, 2022Applicant: NITTO DENKO CORPORATIONInventors: Ryosuke SASAOKA, Yasunari OYABU, Hiroaki MACHITANI, Hayato TAKAKURA
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Patent number: 11297711Abstract: A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.Type: GrantFiled: September 5, 2018Date of Patent: April 5, 2022Assignee: NITTO DENKO CORPORATIONInventors: Yoshihiro Kawamura, Shusaku Shibata, Hayato Takakura, Masaki Ito
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Patent number: 11266024Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.Type: GrantFiled: April 22, 2021Date of Patent: March 1, 2022Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Takahiro Takano, Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki
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Publication number: 20220007507Abstract: A wiring circuit board includes a base insulating layer, a conductive layer, and a metal protective film in order toward one side in a thickness direction. The conductive layer includes a signal wiring and a terminal continuous therewith. The signal wiring has one surface in the thickness direction, and first and second surfaces continuous with the one surface and disposed to face each other in a width direction. The terminal has one surface in the thickness direction, and the other surface disposed to face the one surface at the other side in the thickness direction at spaced intervals thereto. The other surface of the terminal is exposed from the base insulating layer toward the other side in the thickness direction. The metal protective film covers the one surface of the signal wiring and one surface of the terminal but not both first or second surfaces.Type: ApplicationFiled: October 28, 2019Publication date: January 6, 2022Applicant: NITTO DENKO CORPORATIONInventors: Rihito FUKUSHIMA, Hayato TAKAKURA, Shuichi WAKAKI
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Patent number: 11183448Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.Type: GrantFiled: April 23, 2018Date of Patent: November 23, 2021Assignee: NITTO DENKO CORPORATIONInventors: Hayato Takakura, Shuichi Wakaki, Shusaku Shibata, Yoshihiro Kawamura, Masaki Ito
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Publication number: 20210298175Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.Type: ApplicationFiled: June 3, 2021Publication date: September 23, 2021Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Hayato TAKAKURA, Masaki ITO, Yoshihiro KAWAMURA, Shuichi WAKAKI
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Patent number: 11122676Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.Type: GrantFiled: April 25, 2018Date of Patent: September 14, 2021Assignee: NITTO DENKO CORPORATIONInventors: Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki, Shusaku Shibata
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Publication number: 20210243900Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.Type: ApplicationFiled: April 22, 2021Publication date: August 5, 2021Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Takahiro TAKANO, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
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Patent number: 11081437Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.Type: GrantFiled: April 4, 2018Date of Patent: August 3, 2021Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Yoshihiro Kawamura, Hayato Takakura, Takahiro Takano, Shuichi Wakaki
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Patent number: 11058002Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.Type: GrantFiled: September 6, 2018Date of Patent: July 6, 2021Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Hayato Takakura, Masaki Ito, Yoshihiro Kawamura, Shuichi Wakaki
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Publication number: 20210195070Abstract: An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.Type: ApplicationFiled: October 2, 2018Publication date: June 24, 2021Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Hayato TAKAKURA, Yoshihiro KAWAMURA, Masaki ITO, Shuichi WAKAKI
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Patent number: 11032913Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.Type: GrantFiled: November 6, 2017Date of Patent: June 8, 2021Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Takahiro Takano, Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki
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Publication number: 20210084750Abstract: A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.Type: ApplicationFiled: September 5, 2018Publication date: March 18, 2021Applicant: NITTO DENKO CORPORATIONInventors: Yoshihiro KAWAMURA, Shusaku SHIBATA, Hayato TAKAKURA, Masaki ITO
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Publication number: 20200344888Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.Type: ApplicationFiled: November 6, 2017Publication date: October 29, 2020Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Takahiro TAKANO, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
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Patent number: 10813221Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.Type: GrantFiled: April 25, 2018Date of Patent: October 20, 2020Assignee: NITTO DENKO CORPORATIONInventors: Shusaku Shibata, Hayato Takakura, Yoshihiro Kawamura, Shuichi Wakaki
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Publication number: 20200288575Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.Type: ApplicationFiled: September 6, 2018Publication date: September 10, 2020Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Hayato TAKAKURA, Masaki ITO, Yoshihiro KAWAMURA, Shuichi WAKAKI
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Publication number: 20200154016Abstract: A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.Type: ApplicationFiled: April 25, 2018Publication date: May 14, 2020Applicant: NITTO DENKO CORPORATIONInventors: Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI, Shusaku SHIBATA
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Publication number: 20200105656Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.Type: ApplicationFiled: April 4, 2018Publication date: April 2, 2020Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Yoshihiro KAWAMURA, Hayato TAKAKURA, Takahiro TAKANO, Shuichi WAKAKI
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Publication number: 20200077520Abstract: A mounted board includes a base insulating layer, a conductive pattern, and a cover insulating layer sequentially toward one side in a thickness direction. The entire lower surface of the base insulating layer is exposed downwardly. A total thickness of the base insulating layer and the cover insulating layer is 16 ?m or less. The base insulating layer contains an insulating material having a hygroscopic expansion coefficient of 15×10?6/% RH or less.Type: ApplicationFiled: April 25, 2018Publication date: March 5, 2020Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Hayato TAKAKURA, Yoshihiro KAWAMURA, Shuichi WAKAKI
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Publication number: 20200075474Abstract: A wiring circuit board includes a first insulating layer, a terminal, a second insulating layer disposed at one side in a thickness direction of the terminal, and a wire continuous to the terminal in a direction crossing the thickness direction. The first insulating layer has an opening portion passing through the first insulating layer in the thickness direction and having the opening cross-sectional area increasing as being closer to one side in the thickness direction. The terminal has a peripheral end portion and a solid portion. The peripheral end portion contacts with an inner side surface of the first insulating layer. The inner side surface forms the opening portion. The solid portion integrally disposed with the peripheral end portion at the inner side of the peripheral end portion. The peripheral end portion and the solid portion fill the entire opening portion.Type: ApplicationFiled: April 23, 2018Publication date: March 5, 2020Applicant: NITTO DENKO CORPORATIONInventors: Hayato TAKAKURA, Shuichi WAKAKI, Shusaku SHIBATA, Yoshihiro KAWAMURA, Masaki ITO