Patents by Inventor Hayato TAKAKURA

Hayato TAKAKURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method of manufacturing same
    Patent number: 9173301
    Abstract: A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A projection of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion. An end surface of the projection is positioned inward from an end of the cover insulating layer. An insert portion of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of the end of the cover insulating layer. A projection of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the projection of the wiring cover layer.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: October 27, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventor: Hayato Takakura
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
    Publication number: 20150027752
    Abstract: A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A projection of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion. An end surface of the projection is positioned inward from an end of the cover insulating layer. An insert portion of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of the end of the cover insulating layer. A projection of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the projection of the wiring cover layer.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 29, 2015
    Inventor: Hayato TAKAKURA
  • PLATING APPARATUS, PLATING METHOD, METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
    Publication number: 20140311776
    Abstract: A voltage is applied between a stainless steel plate and an electrode such that the stainless steel plate is an anode, whereby a passive film formed at a portion to be plated of the stainless steel plate melts due to the reduction reaction and is removed. Thereafter, a voltage is applied between the stainless steel plate and the electrode such that the stainless steel plate is a cathode, whereby a plating underlayer is formed at the portion to be plated of the stainless steel plate from which the passive film is removed.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 23, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventor: Hayato TAKAKURA