Abstract: The electronic device for diagnosing dementia with Lewy bodies (DLB) or predicting morbidity to DLB according to the present invention includes a processor that measures cortical thicknesses for a plurality of regions of the brain by using brain MRI images of a normal group and a DLB patient group, generates a DLB pattern matrix by using a residual matrix according to a difference between the average cortical thickness and the cortical thickness for each region, applies a first cortical thickness matrix generated by using a brain MRI image of the subject to the DLB pattern to calculate a first DLB pattern score, and diagnoses the subject as DLB or predicting morbidity to DLB by using the first DLB pattern score.

Abstract: An electronic device and a control method therefor are disclosed. The disclosed electronic device includes an input part, a communication part, a processor, and a memory, wherein the memory may include instructions for controlling the communication part such that the processor requests identification information including a call word for using an artificial intelligence assistant function to another electronic device when an event for requesting configuration of a first mode in which the artificial intelligence assistant function of the other electronic device can be used occurs, for controlling the communication part to receive the identification information from the other electronic device through the communication part in response to the request, and transmit a user command to the other electronic device based on the identification information if the user command is received during operation of the first mode of the artificial intelligence assistant.

Abstract: A power conversion device for controlling a DC voltage of a DC link may comprise a first diode, a second diode, a first switching element, a second switching element, a third switching element, and a fourth switching element, wherein: a cathode terminal of the first diode is connected to a positive terminal of the DC link; an anode terminal of the first diode is connected to one end of the first switching element and one end of the third switching element; the other end of the first switching element is connected to an alternating current terminal and one end of the second switching element; the other end of the second switching element is connected to one end of the second diode and one end of the fourth switching element; the other end of the second diode is connected to a negative terminal of the DC link.

Abstract: A device for increasing a slew rate of a driving amplifier includes a driving amplifier, a slew rate improvement circuit, and a controller. The driving amplifier is configured to amplify an input voltage and output an output voltage. The slew rate improvement circuit is configured to provide or receive a current to increase the slew rate of the driving amplifier. The controller is configured to control an operation of the slew rate improvement circuit based on a difference between a first code corresponding to the input voltage of the driving amplifier during a current horizontal line time and a second code corresponding to the input voltage during a next horizontal line time.

Abstract: The present application relates to a method for manufacturing an inverse opal structure membrane filter, the method comprising the steps of: preparing a mixed solution by mixing a nanoparticle dispersion solution and a sacrificial particle dispersion solution; applying the mixed solution onto a substrate to dry it; and heat-treating the mixed solution, wherein the surface of the sacrificial particles is modified by positive charges or negative charges.

Abstract: A device for increasing a slew rate of a driving amplifier includes a driving amplifier, a slew rate improvement circuit, and a controller. The driving amplifier is configured to amplify an input voltage and output an output voltage. The slew rate improvement circuit is configured to provide or receive a current to increase the slew rate of the driving amplifier. The controller is configured to control an operation of the slew rate improvement circuit based on a difference between a first code corresponding to the input voltage of the driving amplifier during a current horizontal line time and a second code corresponding to the input voltage during a next horizontal line time.

Abstract: The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

Abstract: Provided is an image forming apparatus to control capturing of an execution screen displayed. A memory stores at least one application. A user interface device displays an execution screen of an application, to which a user is logged in with an identification (ID) of the user, and receives an input of capturing the execution screen. A processor determines an authority of the ID of the user to capture the execution screen by comparing a security level of the execution screen set based on the data displayed on the execution screen and a security level of the user set with respect to the ID of the user. The processor, in response to the input, controls the capturing of the execution screen, based on the determined authority of the ID of the first user.

Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Abstract: The present disclosure relates to a system and method for segmenting a normal organ and/or tumor structure based on artificial intelligence for radiation treatment planning. The system may include a data collection unit configured to collect a radiotherapy structure (RT-structure) file including a computerized tomography (CT) image of a patient and contour information of an area of interest for radiation treatment, a pre-processing unit configured to extract the contour information from the RT-structure file and generate a binary image based on the extracted contour information, and a model training unit configured to learn parameters for generating a segmentation map indicative of the area of interest using a deep learning algorithm, based on the binary image, and generate a trained model based on the learnt parameter.

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

Abstract: The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

Abstract: There are provided an adhesive film for a semiconductor including: a conductive layer containing at least one metal selected from the group consisting of copper, nickel, cobalt, iron, stainless steel (SUS), and aluminum, and having a thickness of 0.05 ?m or more; and an adhesive layer formed on at least one surface of the conductive layer and including a (meth)acrylate-based resin, a curing agent, and an epoxy resin, and a semiconductor device including the above-mentioned adhesive film.

Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Abstract: Provided is an image forming apparatus to control capturing of an execution screen displayed. A memory stores at least one application. A user interface device displays an execution screen of an application, to which a user is logged in with an identification (ID) of the user, and receives an input of capturing the execution screen. A processor determines an authority of the ID of the user to capture the execution screen by comparing a security level of the execution screen set based on the data displayed on the execution screen and a security level of the user set with respect to the ID of the user. The processor, in response to the input, controls the capturing of the execution screen, based on the determined authority of the ID of the first user.

Abstract: The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of ?10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: The present invention relates to a web authentication hologram label and a method for manufacturing the same, and more particularly, to a web authentication hologram label and a method for manufacturing the same which in forming a web authentication label for identifying a genuine article, enable enhancement of a forgery (and falsification) preventing function as well as duplicate authentication for confirming whether or not an article is genuine to be substantially impossible by means of adopting one-time authentication.

Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Abstract: An electronic device and a control method therefor are disclosed. The disclosed electronic device includes an input part, a communication part, a processor, and a memory, wherein the memory may include instructions for controlling the communication part such that the processor requests identification information including a call word for using an artificial intelligence assistant function to another electronic device when an event for requesting configuration of a first mode in which the artificial intelligence assistant function of the other electronic device can be used occurs, for controlling the communication part to receive the identification information from the other electronic device through the communication part in response to the request, and transmit a user command to the other electronic device based on the identification information if the user command is received during operation of the first mode of the artificial intelligence assistant.