Abstract: A plasma processing apparatus includes a plasma chamber, an electrostatic chuck disposed in the plasma chamber and a pressure control ring disposed in the plasma chamber. The pressure control ring includes a body surrounding an electrostatic chuck in a plan view, an exhaust part disposed in a portion of the body along a first direction, the exhaust part configured to induce a flow of gas in the plasma chamber toward the first direction in a plan view, and a blocking part disposed in another portion of the body along a second direction perpendicular to the first direction in a plan view, the blocking part configured to block the flow of the gas in the second direction.

Abstract: There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100° C. or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: Wireless communication equipment includes a communication interface and a processor electrically connected to the communication interface. The processor is configured to set an operation mode of the wireless communication equipment to a router mode or an extender mode, based on a selection of a user of the wireless communication equipment, to configure a network connection such that the wireless communication equipment operates in the router mode, when the operation mode is set to the router mode, and to configure the network connection such that the wireless communication equipment operates in one of a plurality of sub modes included in the extender mode based at least partly on a first connection state between the wireless communication equipment and an external device or a second connection state between the wireless communication equipment and user equipment, when the operation mode is set to the extender mode.

Abstract: There are provided an adhesive film for a semiconductor including: a conductive layer containing at least one metal selected from the group consisting of copper, nickel, cobalt, iron, stainless steel (SUS), and aluminum, and having a thickness of 0.05 ?m or more; and an adhesive layer formed on at least one surface of the conductive layer and including a (meth)acrylate-based resin, a curing agent, and an epoxy resin, and a semiconductor device including the above-mentioned adhesive film.

Abstract: The present invention relate549N01Ss to a web authentication hologram label and a method for manufacturing the same, and more particularly, to a web authentication hologram label and a method for manufacturing the same which in forming a web authentication label for identifying a genuine article, enable enhancement of a forgery (and falsification) preventing function as well as duplicate authentication for confirming whether or not an article is genuine to be substantially impossible by means of adopting one-time authentication.

Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of: applying a voltage to the polymer film at a temperature of 5° C. to 250° C., while one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of applying a voltage to the polymer film, while at least one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.

Abstract: The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100° C. or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: A persimmon leaf-derived polysaccharide fraction consisting of 60-80 wt % of neutral sugar and 18-39 wt % of uronic acid, and 0.5-10 wt % of 3-deoxy-D-manno-2-octulosonic acid (KDO) analogs, the wt % based on the total weight of the polysaccharide fraction.

Abstract: The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

Abstract: A printing method of an image forming apparatus is provided. The printing method includes receiving, from one of an external apparatus and a server connected to the external apparatus, job information and first identification (ID) information related to printing of content, receiving, from a user, second ID information, transmitting accounting information based on the job information to a billing system, when the second ID information received from the user and the first ID information received from one of the external apparatus and the server correspond to each other, and printing the content based on the job information, when payment completion information regarding payment by the user is received from the billing system.

Abstract: The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70° C.; and a phenol resin having a softening point of more than 105° C., wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.

Abstract: A computing device supports pull printing by using a mobile terminal. The computing device may include a user interface unit configured to receive an input selecting a print job and a printing method; a communication unit configured to transmit or receive data; a mobile search management unit configured to search for an available mobile terminal if pull printing by using a mobile terminal is selected as the printing method; a printer driver configured to render print data corresponding to the selected print job into a printable format file; a data transmission management unit configured to transmit the rendered print data to a found mobile terminal by using the communication unit; and a controller.

Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of applying a voltage to the polymer film, while at least one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

Abstract: A printing method of an image forming apparatus is provided. The printing method includes receiving, from one of an external apparatus and a server connected to the external apparatus, job information and first identification (ID) information related to printing of content, receiving, from a user, second ID information, transmitting accounting information based on the job information to a billing system, when the second ID information received from the user and the first ID information received from one of the external apparatus and the server correspond to each other, and printing the content based on the job information, when payment completion information regarding payment by the user is received from the billing system.