Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of: applying a voltage to the polymer film at a temperature of 5° C. to 250° C., while one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

Abstract: The present invention relates to an optical film that comprises a block copolymer that comprises a vinyl polymer block containing styrene or a derivative thereof, and a poly-dimethylsiloxane block, a retardation film using the same, a method of manufacturing them, and a liquid crystal display comprising the films.

Abstract: The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*105 to 4*106 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

Abstract: A printing control apparatus includes a user interface configured to receive a selection of a printing option to be applied to a document, and to display, in response to a favorite printing option being the selection of the printing option, information about a method for a preselected printing option, a printer driver configured to establish the printing option to be applied to the document according to the information about the method, and to generate printing data according to the printing option, and a communication interface configured to transmit the printing data to an image forming apparatus.

Abstract: The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

Abstract: The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of ?10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: Provided are a column data driver configured to apply a voltage or current corresponding to image data to a display panel, a display device having the column data driver, and a driving method of the display device. The column data driving circuit includes a precharge unit configured to precharge at least one of a plurality of column lines in response to a plurality of preset signals corresponding to image data; and a driving unit configured to sequentially drive the plurality of column lines in response to a data signal corresponding to the image data.

Abstract: A white light emitting device (LED) and a manufacturing method thereof wherein an LED coated with polymeric resin in which organic phosphors are solved dissolved and inorganic phosphors are dispersed creates a white LED, thereby producing an effect of excellent luminance and color coordinate without creating a compatibility problem with the polymeric resin. The present invention creates a white LED with a high luminance and a long service life using polymeric composition containing organic and inorganic phosphors, organic and inorganic combined phosphors and organosilicates, and an epoch making improvement in terms of luminance and credibility without additional process added to an existing element fabricating process, thereby enabling to achieve price competitiveness through cost reduction.

Abstract: There are provided a composition for forming an adhesive layer of a dicing film including: a silicon compound oil including at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil including at least one reactive functional group to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70° C; and a phenol resin having a softening point of more than 105° C, wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.

Abstract: The present invention relates to a novel polyamic acid introduced with an imidazolyl group in the polymer chain, a photosensitive resin composition including the polyamic acid and that is capable of providing a photosensitive material that satisfies the characteristics of an excellent bending property and low stiffness and also exhibits excellent heat resistance and coating resistance, a dry film obtained from the photosensitive resin composition, and a circuit board including the dry film.

Abstract: The present invention relates to a primer coating composition, an optical film including the same, and a polarizing plate including the same, the primer coating composition according to the present invention includes 1) a polyvinyl alcohol compound including the acetoacetyl group; 2) an acrylate compound that includes at least two vinyl groups; and 3) a basic catalyst, and an optical film that includes a primer layer formed from the primer coating composition has excellent transparency, optical property, mechanical strength, and attaching property to the polyvinyl alcohol polarizer.

Abstract: The present invention relates to an optical film that includes a graft copolymer that includes two types or more of (meth)acryl based resins that have different glass transition temperatures, a retardation film, a method of producing the same, and a polarizing plate and a liquid crystal display device that include the optical film or the retardation film.

Abstract: A method for providing a content service and an electronic device thereof is provided. The electronic device includes a display configured to display content that contains at least a first item. The electronic device also includes an input interface configured to detect an input for at least the first item contained in the content. The electronic device further includes a processor configured to, when an input for the first item contained in the content is detected, display, on the display, at least one piece of information corresponding to user information of the electronic device among information related to the first item.

Abstract: A method and an apparatus for providing a content preview in a server are provided. An electronic device includes a display; a communication interface configured to send and receive signals to and from a server; and a processor configured to display a preview image of content received from the server on the display, and in response to an input, switch from the displayed preview image to a different preview image of the content or switch from the displayed preview image to a preview image of a different content. Thus, the electronic device may consecutively display the content preview screens without having to switch the screen.

Abstract: A method of operating an electronic device includes receiving preference information about each of a plurality of sub-contents constituting contents, from a second electronic device, and displaying a preference for each of the plurality of sub-contents based on the preference information.

Abstract: A computing device supports pull printing by using a mobile terminal. The computing device may include a user interface unit configured to receive an input selecting a print job and a printing method; a communication unit configured to transmit or receive data; a mobile search management unit configured to search for an available mobile terminal if pull printing by using a mobile terminal is selected as the printing method; a printer driver configured to render print data corresponding to the selected print job into a printable format file; a data transmission management unit configured to transmit the rendered print data to a found mobile terminal by using the communication unit; and a controller.

Abstract: The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*105 to 4*106 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

Abstract: There are provided a composition for forming an adhesive layer of a dicing film including: a silicon compound oil including at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil including at least one reactive functional group to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Abstract: There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.