Abstract: Certain aspects of the present disclosure provide a method for lane marker detection, including: receiving an input image; providing the input image to a lane marker detection model; processing the input image with a shared lane marker portion of the lane marker detection model; processing output of the shared lane marker portion of the lane marker detection model with a plurality of lane marker-specific representation layers of the lane marker detection model to generate a plurality of lane marker representations; and outputting a plurality of lane markers based on the plurality of lane marker representations.

Abstract: Autonomous driving systems described herein provide an efficient way to manage camera-based perception by considering the characteristics of captured images. In one example, a camera sensor may capture an image and a processor may determine a first region of interest (ROI) within the image and a second ROI within the image. The processor may generate a first image of the first ROI and a second image of the second ROI. The processor may transmit a control signal based on one or more objects detected in the first ROI and/or one or more objects detected in the second ROI to cause the vehicle to perform an autonomous driving operation.

Abstract: Disclosed are techniques for performing lane instance recognition. Lane instances are difficult to recognize since they are long and elongated, and they also look different from view to view. An approach is proposed in which local mask segmentation lane estimation and global control points lane estimation are combined.

Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

Abstract: Disclosed are techniques for estimating a 3D bounding box (3DBB) from a 2D bounding box (2DBB). Conventional techniques to estimate 3DBB from 2DBB rely upon classifying target vehicles within the 2DBB. When the target vehicle is misclassified, the projected bounding box from the estimated 3DBB is inaccurate. To address such issues, it is proposed to estimate the 3DBB without relying upon classifying the target vehicle.

Abstract: Certain aspects of the present disclosure are directed to methods and apparatus for deep learning in an artificial neural network. One example method generally includes receiving input data at an input to a layer of the neural network; replicating a group of neural processing units in the layer to form a superset of neural processing units, the superset comprising n instances of the group of neural processing units; processing the input data using the superset to generate output data for the layer; and determining an uncertainty of the output data. Processing the input data includes performing a dropout function by zeroing out one or more weights of a set of weights for each of the n instances of the superset of neural processing units and convolving, for each of the n instances in parallel, the input data with one or more non-zeroed out weights of the set of weights.

Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

Abstract: A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the second portion is inserted into the first interposer hole.

Abstract: A method for capturing an image of a traffic sign by an image sensor is disclosed. The method may include capturing, by the image sensor, at least one image including the traffic sign, wherein the image sensor is mounted in a vehicle. The method may include detecting, by a processor, the traffic sign in the at least one image. The method may also include in response to detecting the traffic sign, determining, by the processor, at least one direction of the image sensor based on the at least one image and motion of the vehicle. In addition, the method may include adjusting, by the processor, the image sensor to the at least one direction.

Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

Abstract: A method, a computer-readable medium, and an apparatus for object detection are provided. The apparatus may determine a regression vector using a neural network based on an input image that contains an object. The object may have a planar surface with a known shape. The apparatus may derive a transform matrix based on the regression vector. The apparatus may identify a precise boundary of the object based on the transform matrix. The precise boundary of the object may include a plurality of vertices of the object. To identify the boundary of the object, the apparatus may apply the transform matrix to a determined shape of the object.

Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels.

Abstract: A semiconductor device package includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the first portion is inserted into the first interposer hole.

Abstract: A method, a computer-readable medium, and an apparatus for object detection are provided. The apparatus may determine a regression vector using a neural network based on an input image that contains an object. The object may have a planar surface with a known shape. The apparatus may derive a transform matrix based on the regression vector. The apparatus may identify a precise boundary of the object based on the transform matrix. The precise boundary of the object may include a plurality of vertices of the object. To identify the boundary of the object, the apparatus may apply the transform matrix to a determined shape of the object.

Abstract: A method, which is performed by an electronic device, for resizing an image having text is disclosed. The method may include determining layout information of at least one text region in the image. The layout information may include at least one of a number, a size, a location, a shape, or a text density of the at least one text region in the image. The method may also select a seam carving operation, a cropping operation, or a scaling operation for the image based on the layout information, a size of the image, and a target image size. The selected operation may be performed to resize the image to the target image size based at least on one of the layout information, the size of the image, or the target image size. The resized image may include the at least one text region.

Abstract: A method for capturing an image of a traffic sign by an image sensor is disclosed. The method may include capturing, by the image sensor, at least one image including the traffic sign, wherein the image sensor is mounted in a vehicle. The method may include detecting, by a processor, the traffic sign in the at least one image. The method may also include in response to detecting the traffic sign, determining, by the processor, at least one direction of the image sensor based on the at least one image and motion of the vehicle. In addition, the method may include adjusting, by the processor, the image sensor to the at least one direction.

Abstract: A method, which is performed by an electronic device, of automatically activating a flash for an image sensor of the electronic device is disclosed. The method may include receiving a first image including at least one text region and determining feature data characterizing the at least one text region in the first image. The method may also identify at least one candidate specular reflection region in the first image. Based on the feature data and the at least one candidate specular reflection region, the flash may be activated. Upon activating the flash, a second image including the at least one text region may be captured.

Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels.

Abstract: An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

Abstract: A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.