Patents by Inventor Hee Seok Park
Hee Seok Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11976396Abstract: The present disclosure relates to a method for producing a nonwoven fabric that improves filtration performance when applied as a filter material. By adjusting the modification ratio of the Y-shaped cross-section of polyester filaments constituting the nonwoven fabric, when applied to a filter by increasing a specific surface area of the nonwoven fabric, it increases the collection amount of the materials to be filtered and maintains a low differential pressure, thus enabling long-term use.Type: GrantFiled: June 11, 2019Date of Patent: May 7, 2024Assignee: KOLON INDUSTRIES, INC.Inventors: Woo-seok Choi, Min-ho Lee, Hee-jung Cho, Young-shin Park, Jung-soon Jang
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Patent number: 11974455Abstract: A display device includes a substrate; a light-emitting element layer on the substrate; a first thin-film encapsulation layer that is on the light-emitting element layer, has an upper surface conforming an upper surface of the light-emitting element layer, and includes a recessed portion; a bank layer on the first thin-film encapsulation layer and having an opening overlapping the recessed portion; a wavelength conversion layer in the opening on the first thin-film encapsulation layer and at least partially in the recessed portion; a first inorganic layer on the bank layer and the wavelength conversion layer; an organic layer on the first inorganic layer; and a second inorganic layer on the organic layer.Type: GrantFiled: September 3, 2021Date of Patent: April 30, 2024Assignee: Samsung Display Co., Ltd.Inventors: Myung Chul Yeo, Yong Tack Kim, Eung Seok Park, Hee Wook Yoon, Yoon Hyeung Cho
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Patent number: 11970674Abstract: The present disclosure relates to a method for preparing a non-woven fabric which improves impregnation and release properties of a fabric softener in the non-woven fabric in order to apply the non-woven fabric to a dryer sheet (sheet-type fabric softener). When increasing porosity and specific surface area in a non-woven fabric made of two-component blended polyester long fibers, impregnation and release rate of a fabric softener are improved even when the non-woven fabric is lightened, making it possible to apply the non-woven fabric to a dryer sheet.Type: GrantFiled: December 19, 2019Date of Patent: April 30, 2024Assignee: KOLON INDUSTRIES, INC.Inventors: Young-shin Park, Min-ho Lee, Jung-soon Jang, Hee-jung Cho, Woo-seok Choi
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Publication number: 20240129725Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.Type: ApplicationFiled: December 23, 2021Publication date: April 18, 2024Applicant: ESTORM CO., LTD.Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
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Patent number: 11931683Abstract: A scrubber system may include a scrubber housing including a vertically extended cleaning space, an inflow chamber coupled to a bottom portion of the scrubber housing, and first and second inflow portions, each of which is configured to supply a gas into the inflow chamber. The inflow chamber may include a mixing space, and the mixing space may be connected to the cleaning space. The first inflow portion may include a first connection pipe coupled to the inflow chamber to provide a first connection path and the second inflow portion may include a second connection pipe coupled to the inflow chamber to provide a second connection path. The first and second connection paths may be extended toward the mixing space in opposite directions, respectively, and may be connected to opposite portions of the mixing space, respectively.Type: GrantFiled: October 15, 2021Date of Patent: March 19, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Young Seok Roh, Suji Gim, Heesub Kim, Hee Ock Park, Jongyong Bae, Sung Chul Yoon, Sunsoo Lee, Dong Keun Jeon, Jinkyoung Joo
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Patent number: 11929381Abstract: An image sensor including: a substrate which includes a first surface and a second surface opposite each other; a plurality of pixels, each pixel including a photoelectric conversion layer in the substrate; a pixel separation pattern disposed in the substrate and separating the pixels; a surface insulating layer disposed on the first surface of the substrate; conductor contacts disposed in the surface insulating layer; and a grid pattern disposed on the surface insulating layer, wherein the pixel separation pattern includes a first portion and a second portion arranged in a direction parallel to the first surface of the substrate, and the conductor contacts are interposed between the first portion of the pixel separation pattern and the grid pattern and are not interposed between the second portion of the pixel separation pattern and the grid pattern.Type: GrantFiled: December 30, 2020Date of Patent: March 12, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Han Seok Kim, Byung Jun Park, Jin Ju Jeon, Hee Geun Jeong
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Publication number: 20240075724Abstract: Disclosed is a dental orthodontic sheet having a composite structure in which different materials are stacked and bound to each other. The composite structure dental orthodontic sheet includes a first sheet layer, a second sheet layer, and an intermediate sheet layer formed between the first sheet layer and the second sheet layer, wherein the intermediate sheet layer includes a mat portion made of a softer material than each of the first sheet layer and the second sheet layer, the mat portion being formed so as to have a mesh structure, and a binding portion configured to allow mesh holes of the mat portion to be filled with materials of the first sheet layer and the second sheet layer such that the first sheet layer and the second sheet layer are bound to each other.Type: ApplicationFiled: May 30, 2023Publication date: March 7, 2024Applicant: DENTIS CO., LTD.Inventors: Gi Bong SIM, Hee Seok PARK, Byeong Il KIM, Eun Yeong PARK, Won Gun CHANG
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Publication number: 20240079529Abstract: A light-emitting element includes a first semiconductor layer, a light-emitting layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the light-emitting layer, a device electrode layer disposed on the second semiconductor layer, a reflective electrode layer disposed on the device electrode layer, an insulating film surrounding a side surface of the light-emitting layer, a side surface of the second semiconductor layer, and a side surface of the device electrode layer, and a reflective layer surrounding a side surface of the insulating film, wherein the side surface of the device electrode layer is aligned with a side surface of the reflective electrode layer.Type: ApplicationFiled: April 10, 2023Publication date: March 7, 2024Applicant: Samsung Display Co., LTD.Inventors: Ji Hyun HAM, Moon Jung AN, Jin Seok PARK, Hee Keun LEE, Sung Chan JO, Sang Wook HAN
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Patent number: 9252343Abstract: An LED package includes a package substrate, a first LED chip mounted on the package substrate, a first phosphor layer disposed on the first LED chip, a reflective layer configured to surround sides of the first LED chip and the first phosphor layer; and a mask disposed on the reflective layer and including a first opening portion which exposes a surface of the first phosphor layer.Type: GrantFiled: October 22, 2014Date of Patent: February 2, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kwon-Jin Kim, Hee-Dong Kim, Hee-Seok Park, Ji-Seok Wang, Yong-Kee Jo
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Patent number: 9188300Abstract: An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an to LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.Type: GrantFiled: December 18, 2014Date of Patent: November 17, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Hee Dong Kim, Moo Youn Park, Soo Hwan Lee, Hee Seok Park
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Patent number: 9166124Abstract: A light emitting device package according to example embodiments includes a plurality of light emitting device chips arranged linearly and spaced apart from each other on a substrate, and a plurality of wavelength conversion units on upper surfaces of the plurality of light emitting device chips. The plurality of wavelength conversion units may each have portions that extend over regions between the plurality of light emitting device chips. A vehicle headlight may include the light emitting device package.Type: GrantFiled: June 25, 2013Date of Patent: October 20, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Hee Seok Park, Ji Seok Wang, Kwon Jin Kim, Hee Dong Kim
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Publication number: 20150263253Abstract: An LED package includes a package substrate, a first LED chip mounted on the package substrate, a first phosphor layer disposed on the first LED chip, a reflective layer configured to surround sides of the first LED chip and the first phosphor layer; and a mask disposed on the reflective layer and including a first opening portion which exposes a surface of the first phosphor layer.Type: ApplicationFiled: October 22, 2014Publication date: September 17, 2015Inventors: Kwon-Jin KIM, Hee-Dong KIM, Hee-Seok PARK, Ji-Seok WANG, Yong-Kee JO
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Publication number: 20150249193Abstract: Provided are light emitting device package having a phosphor layer and a method of fabricating the same. A package substrate having a wiring pattern is disposed. A light emitting device mounted on the package substrate is disposed. The light emitting device has a main body having a light emitting layer therein. The light emitting device has an upper electrode on an upper surface of the main body. A bonding wire is connected to the upper electrode and the wiring pattern. A phosphor layer is formed on the light emitting device. The phosphor layer has a recessed space to accommodate the upper electrode and the bonding wire. The phosphor layer covers a side surface of the light emitting device.Type: ApplicationFiled: November 19, 2014Publication date: September 3, 2015Inventors: Sung-Yong HONG, Kyung Tae KIM, Hyung-Jin PARK, Hee-Seok PARK, Ji-Seok WANG
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Publication number: 20150103547Abstract: An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an to LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.Type: ApplicationFiled: December 18, 2014Publication date: April 16, 2015Inventors: Hee Dong KIM, Moo Youn Park, Soo Hwan Lee, Hee Seok Park
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Patent number: 8921883Abstract: An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.Type: GrantFiled: January 9, 2014Date of Patent: December 30, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Hee Dong Kim, Moo Youn Park, Soo Hwan Lee, Hee Seok Park
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Patent number: 8882319Abstract: An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.Type: GrantFiled: May 18, 2012Date of Patent: November 11, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Hee Dong Kim, Moo Youn Park, Soo Hwan Lee, Hee Seok Park
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Patent number: 8746937Abstract: A head lamp assembly including a housing; a plurality of head lamp cases installed in the housing, wherein each head lamp case comprises a light emitting diode (LED) light source, and a heat sink for dissipating heat generated from the LED light source; and a plurality of ventilating fans for circulating air in the plurality of head lamp cases and installed in the plurality of head lamp cases, respectively. Accordingly, the ventilating fans installed in the head lamp cases have opposite ventilating directions, and thus air is circulated in the head lamp cases by the ventilating fans to thus improve heat dissipation effects.Type: GrantFiled: September 8, 2011Date of Patent: June 10, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jong-pa Hong, Hyoung-cheol Cho, Hee-seok Park, Joong-kon Son
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Publication number: 20140124815Abstract: An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.Type: ApplicationFiled: January 9, 2014Publication date: May 8, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hee Dong KIM, Moo Youn Park, Soo Hwan Lee, Hee Seok Park
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Publication number: 20140106483Abstract: Provided is a vertical nitride-based LED including a first electrode; a first nitride semiconductor layer that is disposed on the first electrode; an active layer that is disposed on the first nitride semiconductor layer; a second nitride semiconductor layer that is disposed on the active layer; an ohmic contact pattern that is disposed on the second nitride semiconductor layer; a second electrode that is disposed on the ohmic contact pattern; and a bonding pad that is electrically connected to the second electrode and disposed on the second nitride semiconductor layer.Type: ApplicationFiled: December 17, 2013Publication date: April 17, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Bock LEE, Jin Hyun LEE, Hee Seok PARK, Pun Jae CHOI, Jong In YANG
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Publication number: 20140078763Abstract: A light emitting device package according to example embodiments includes a plurality of light emitting device chips arranged linearly and spaced apart from each other on a substrate, and a plurality of wavelength conversion units on upper surfaces of the plurality of light emitting device chips. The plurality of wavelength conversion units may each have portions that extend over regions between the plurality of light emitting device chips. A vehicle headlight may include the light emitting device package.Type: ApplicationFiled: June 25, 2013Publication date: March 20, 2014Inventors: Hee Seok PARK, Ji Seok WANG, Kwon Jin KIM, Hee Dong KIM