Patents by Inventor Hee-Seok Lee

Hee-Seok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128810
    Abstract: Disclosed are an easily manufacturable stator for an axial flux motor, and a method of manufacturing the same. A stator includes a core, a bobbin having a hollow portion into which the core is inserted, and a winding wound around the bobbin. A radial outer corner portion of the core is formed to have a cross-sectional shape bent at least twice.
    Type: Application
    Filed: March 15, 2023
    Publication date: April 18, 2024
    Inventors: Hyun Seok Hong, Hyun Woo Jun, Hee Kwang Lee
  • Publication number: 20240129725
    Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 18, 2024
    Applicant: ESTORM CO., LTD.
    Inventors: Jong Hyun WOO, Tae Il LEE, Il Jin JUNG, Hee Jun SHIN, Hyung Seok JANG, Min Jae SON, Sang Heon BAEK, Seo Bin PARK, Hyo Sang KWON, Mi Ju KIM, Jung Hoon SONG, Rakhmanov DILSHOD, Dong Hee KIM, Jeon Gjin KIM
  • Patent number: 11956980
    Abstract: Discussed is an organic light emitting device in which a light emitting layer includes a host and different kinds of dopants, the fluorescent dopant is formed of a material having energy level properties facilitating thermally activated delayed fluorescence (TADF), and thus energy is concentratedly transferred to the fluorescent dopant so as to increase luminous efficacy of a single color.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: April 9, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Gyeong-Woo Kim, Hong-Seok Choi, Seung-Ryong Joung, Jun-Ho Lee, Yoon-Deok Han, Hee-Su Byeon
  • Patent number: 11942615
    Abstract: An air-cooled battery cooling system for an air mobility vehicle may ensure the cooling performance for batteries using air flows during the flight of the air mobility vehicle, since the cooling of the batteries is performed using an air flow in the top-bottom direction due to the hovering of the air mobility vehicle and an air flow in the front and rear direction due to the cruising of the air mobility vehicle, the efficient cooling performance for the batteries is ensured in a variety of flight modes. Furthermore, the batteries are securely fixed while being cooled by air flows via the heat transfer pads within the battery packs.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Hyun Woo Jun, Woo Suk Jung, Hee Kwang Lee, Hyun Seok Hong
  • Patent number: 11939049
    Abstract: In an air mobility vehicle, an engine operates as required to provide mechanical driving force or electric energy. A battery is charged with the electric energy from the engine. Main rotors operate using the electric energy of the battery and electric power generated by the engine to perform takeoff, landing, and cruising. Auxiliary rotors are disposed at or adjacent to the center of gravity of a vehicle body and mechanically connected to the engine via a clutch. The auxiliary rotors perform the takeoff, the landing, or the cruising by receiving the mechanical driving force from the engine when the clutch is in an engaged position. A controller monitors the states of the battery and the main rotors and controls the operations of the engine and the clutch.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: March 26, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Woo Suk Jung, Hee Kwang Lee, Hyun Seok Hong, Hyun Woo Jun
  • Publication number: 20240096102
    Abstract: Systems and methods are disclosed that relate to freespace detection using machine learning models. First data that may include object labels may be obtained from a first sensor and freespace may be identified using the first data and the object labels. The first data may be annotated to include freespace labels that correspond to freespace within an operational environment. Freespace annotated data may be generated by combining the one or more freespace labels with second data obtained from a second sensor, with the freespace annotated data corresponding to a viewable area in the operational environment. The viewable area may be determined by tracing one or more rays from the second sensor within the field of view of the second sensor relative to the first data. The freespace annotated data may be input into a machine learning model to train the machine learning model to detect freespace using the second data.
    Type: Application
    Filed: August 7, 2023
    Publication date: March 21, 2024
    Inventors: Alexander POPOV, David NISTER, Nikolai SMOLYANSKIY, PATRIK GEBHARDT, Ke CHEN, Ryan OLDJA, Hee Seok LEE, Shane MURRAY, Ruchi BHARGAVA, Tilman WEKEL, Sangmin OH
  • Publication number: 20240079529
    Abstract: A light-emitting element includes a first semiconductor layer, a light-emitting layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the light-emitting layer, a device electrode layer disposed on the second semiconductor layer, a reflective electrode layer disposed on the device electrode layer, an insulating film surrounding a side surface of the light-emitting layer, a side surface of the second semiconductor layer, and a side surface of the device electrode layer, and a reflective layer surrounding a side surface of the insulating film, wherein the side surface of the device electrode layer is aligned with a side surface of the reflective electrode layer.
    Type: Application
    Filed: April 10, 2023
    Publication date: March 7, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Ji Hyun HAM, Moon Jung AN, Jin Seok PARK, Hee Keun LEE, Sung Chan JO, Sang Wook HAN
  • Patent number: 11916831
    Abstract: A reference signal (RS) transmission system to transmit a channel state information (CSI) RS for extraction of CSI to a relay and a macro terminal is disclosed. The base station transmits information on a sub frame containing the CSI RS to the relay or the macro terminal. The macro terminal and the relay receive the CSI RS using the information on the sub frame. The macro terminal and the relay extract the CSI using the CSI RS and transmit the extracted CSI to the base station.
    Type: Grant
    Filed: February 2, 2023
    Date of Patent: February 27, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Hee Soo Lee, Tae Gyun Noh, Jae Young Ahn, Kyoung Seok Lee, Young Jo Ko
  • Publication number: 20230298360
    Abstract: Certain aspects of the present disclosure provide techniques for lane marker detection. A set of feature tensors is generated by processing an input image using a convolutional neural network. A set of localizations is generated by processing the set of feature tensors using a localization network, a set of horizontal positions is generated by processing the set of feature tensors using row-wise regression, and a set of end positions is generated by processing the set of feature tensors using y-end regression. A set of lane marker positions is determined based on the set of localizations, the set of horizontal positions, and the set of end positions.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 21, 2023
    Inventors: Seungwoo YOO, Heesoo MYEONG, Hee-Seok LEE
  • Publication number: 20230112799
    Abstract: Disclosed are techniques for estimating a 3D bounding box (3DBB) from a 2D bounding box (2DBB). Conventional techniques to estimate 3DBB from 2DBB rely upon classifying target vehicles within the 2DBB. When the target vehicle is misclassified, the projected bounding box from the estimated 3DBB is inaccurate. To address such issues, it is proposed to estimate the 3DBB without relying upon classifying the target vehicle.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 13, 2023
    Inventors: Young-Ki BAIK, Hyun-Mook CHO, Duck Hoon KIM, Jeong-Kyun LEE, Chaeseong LIM, Hee-Seok LEE
  • Patent number: 11600080
    Abstract: Certain aspects of the present disclosure provide a method for lane marker detection, including: receiving an input image; providing the input image to a lane marker detection model; processing the input image with a shared lane marker portion of the lane marker detection model; processing output of the shared lane marker portion of the lane marker detection model with a plurality of lane marker-specific representation layers of the lane marker detection model to generate a plurality of lane marker representations; and outputting a plurality of lane markers based on the plurality of lane marker representations.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 7, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Seungwoo Yoo, Heesoo Myeong, Hee-Seok Lee
  • Patent number: 11508122
    Abstract: Disclosed are techniques for estimating a 3D bounding box (3DBB) from a 2D bounding box (2DBB). Conventional techniques to estimate 3DBB from 2DBB rely upon classifying target vehicles within the 2DBB. When the target vehicle is misclassified, the projected bounding box from the estimated 3DBB is inaccurate. To address such issues, it is proposed to estimate the 3DBB without relying upon classifying the target vehicle.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: November 22, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Young-Ki Baik, Hyun-Mook Cho, Duck Hoon Kim, Jeong-Kyun Lee, ChaeSeong Lim, Hee-Seok Lee
  • Patent number: 11475678
    Abstract: Disclosed are techniques for performing lane instance recognition. Lane instances are difficult to recognize since they are long and elongated, and they also look different from view to view. An approach is proposed in which local mask segmentation lane estimation and global control points lane estimation are combined.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: October 18, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Heesoo Myeong, Hee-Seok Lee, Duck Hoon Kim, Seungwoo Yoo, Kang Kim
  • Patent number: 11410040
    Abstract: Certain aspects of the present disclosure are directed to methods and apparatus for deep learning in an artificial neural network. One example method generally includes receiving input data at an input to a layer of the neural network; replicating a group of neural processing units in the layer to form a superset of neural processing units, the superset comprising n instances of the group of neural processing units; processing the input data using the superset to generate output data for the layer; and determining an uncertainty of the output data. Processing the input data includes performing a dropout function by zeroing out one or more weights of a set of weights for each of the n instances of the superset of neural processing units and convolving, for each of the n instances in parallel, the input data with one or more non-zeroed out weights of the set of weights.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: August 9, 2022
    Assignee: Qualcomm Incorporated
    Inventors: Seungwoo Yoo, Heesoo Myeong, Hee-Seok Lee, Hyun-Mook Cho
  • Patent number: 11244936
    Abstract: A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the second portion is inserted into the first interposer hole.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Hyeok Im, Hee Seok Lee, Taek Kyun Shin, Cha Jea Jo
  • Patent number: 11171128
    Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: November 9, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Hyeok Im, Hee Seok Lee, Tae Woo Kang, Yeong Seok Kim, Kyoung-Min Lee
  • Publication number: 20210287018
    Abstract: Certain aspects of the present disclosure provide a method for lane marker detection, including: receiving an input image; providing the input image to a lane marker detection model; processing the input image with a shared lane marker portion of the lane marker detection model; processing output of the shared lane marker portion of the lane marker detection model with a plurality of lane marker-specific representation layers of the lane marker detection model to generate a plurality of lane marker representations; and outputting a plurality of lane markers based on the plurality of lane marker representations.
    Type: Application
    Filed: March 12, 2021
    Publication date: September 16, 2021
    Inventors: Seungwoo YOO, Heesoo MYEONG, Hee-Seok LEE
  • Publication number: 20210192231
    Abstract: Autonomous driving systems described herein provide an efficient way to manage camera-based perception by considering the characteristics of captured images. In one example, a camera sensor may capture an image and a processor may determine a first region of interest (ROI) within the image and a second ROI within the image. The processor may generate a first image of the first ROI and a second image of the second ROI. The processor may transmit a control signal based on one or more objects detected in the first ROI and/or one or more objects detected in the second ROI to cause the vehicle to perform an autonomous driving operation.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 24, 2021
    Inventors: Hee-Seok LEE, Heesoo MYEONG, Hankyu CHO
  • Publication number: 20200218909
    Abstract: Disclosed are techniques for performing lane instance recognition. Lane instances are difficult to recognize since they are long and elongated, and they also look different from view to view. An approach is proposed in which local mask segmentation lane estimation and global control points lane estimation are combined.
    Type: Application
    Filed: January 2, 2020
    Publication date: July 9, 2020
    Inventors: Heesoo MYEONG, Hee-Seok LEE, Duck Hoon KIM, Seungwoo YOO, Kang KIM
  • Publication number: 20200219860
    Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 9, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun Hyeok Im, Hee Seok Lee, Tae Woo Kang, Yeong Seok Kim, Kyoung-Min Lee