Abstract: Provided is a MEMS device which is robust to the misalignment and does not require the double-side wafer processing in the manufacture of a MEMS device such as an angular velocity sensor, an acceleration sensor, a combined sensor or a micromirror. After preparing a substrate having a space therein, holes are formed in a device layer at positions where fixed components such as a fixing portion, a terminal portion and a base that are fixed to a supporting substrate are to be formed, and the holes are filled with a fixing material so that the fixing material reaches the supporting substrate, thereby fixing the device layer around the holes to the supporting substrate.

Abstract: A method of sealing and leading out an electrode for an MEMS device such as an angular velocity sensor, an acceleration sensor, or a combined sensor is provided. A fixed portion is formed within a device forming region surrounded with a base support, a beam is connected to the fixed portion, and a movable portion is connected to the beam. Further, a detection portion for detecting the displacement of the movable portion is disposed within the device forming region. An interconnection is connected to the movable portion and the detection portion, and the interconnection extends from the hermetically sealed device forming region to the external region at the outside. The interconnection penetrates the base support and is connected with the terminal. A hole is formed between the interconnection and the base support, and an insulating film is formed in the hole. The interconnection and the base support are insulated by an insulating film buried in the hole.

Abstract: Four sensor units (SUA1 to SUA4) are disposed symmetrically about a point, on both top and bottom and left and right centering around one point of a support (15e). Furthermore, four sensor units (SUA1 to SUA4) are designed so that all the components are fully in tuning-fork structure. Drive frames (5, 5) of the sensor units (SUA1, SUA2) disposed adjacent to each other in a first direction (Y) are vibrated in mutually inverted phases, and drive frames of the other sensor units (SUA3, SUA4) disposed adjacent to each other in a second direction (X) are vibrated in mutually inverted phases as well. Moreover, the drive frames of the sensor units (SUA1, SUA2) and the drive frames of the other sensor units (SUA3, SUA4) are operated in synchronization in the state in which phases are shifted by 90 degrees. Whereby, it is possible to reduce or prevent vibration coupling in the driving direction and in the detection direction, and the leakage (loss) of excitation energy and Coriolis force.